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  1. NTU Theses and Dissertations Repository

Browsing by Advisor Tzu-Hsuan Chang

Jump to: 0-9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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Showing results 1 to 13 of 13
Publication Year TitleAuthor(s)Department
2025二維複合材料之介質常數與熱導特性分析研究
Analysis the Dielectric and Thermal Properties of Anisotropic 2D Material Composites
祁廣昀; Kuan-Yun Chi元件材料與異質整合學位學程
2020利用2D材料提高可撓性電子元件的介電與散熱特性
Improvement of Dielectric and Thermal Properties of flexible electronics with 2D material
陳建良; Chien-Liang Chen電子工程學研究所
2024原子層沉積次奈米氧化鎵應用於電晶體閘極氧化層之電性調變與分析
Electrical Modulation and Analysis of Sub-Nanometer Gallium Oxide by Plasma-Enhanced Atomic Layer Deposition Applied to Transistor Gate Oxide Layers
郭鎮宇; Zhen-Yu Guo電子工程學研究所
2024基於二維材料均勻分散的超高熱導複合材料應用於覆晶晶片封裝之研究
Study of ultra-high thermal conductivity composites based on uniform dispersion of two-dimensional materials for flip chip packaging applications
張宇蕎; Yu-Chiao Chang電子工程學研究所
2024應用氦離子束微影技術製作奈米級電晶體並透過次奈米厚Ga2O3應變層與Si異質整合改善傳統FinFET的電性
Application of Helium Ion Beam Lithography and Electrical Performance Improvement of Conventional FinFETs through Hetero Integration of Sub-nanometer Thick Ga2O3 Strain Layer with Si
莊函倫; Han-Lun Chuang電子工程學研究所
2025由Ga2O3誘導之二維電子氣所實現的矽基先進電晶體結構
Advanced Transistor Structures Enabled by Ga2O3-Induced Two-Dimensional Electron Gas on Silicon
陳威合; Wei-He Chen電子工程學研究所
2025石墨烯基高熱導複合材料用於三維積體電路封裝之研究
High-Thermal-Conductivity Underfill for 3DIC Based on Graphene-based Composites
洪睿哲; Ruei-Jhe Hong元件材料與異質整合學位學程
2024研究具拉伸應變之鍺錫合金於法布里-孛羅腔體與彎曲條件的應變效應
Study of Achieving Tensile Strained GeSn to Fabry Perot Cavity and strain effect of bending condition
陳子軒; Tzu-Hsuan Chen電子工程學研究所
2022研究石墨烯複合材料與其可調變電性之封裝應用
Study of High Thermal Conductive Graphene-based Composites and Its Controllable Electrical Application on Device Packaging
林嶸騰; Rong-Teng Lin電子工程學研究所
2022研究石墨烯複合材料與其可調變電性之封裝應用
Study of High Thermal Conductive Graphene-based Composites and Its Controllable Electrical Application on Device Packaging
林嶸騰; Rong-Teng Lin電子工程學研究所
2024莫列波紋於序列型互補式場效電晶體之垂直對準應用探討
Application Study of Moiré Fringe in Vertical Alignment of Sequential CFET Integration
楊雁茹; Yen-Ju Yang電子工程學研究所
2024超薄 ALD Al2O3 緩衝層增強 AlN 於 Si(100)上的生長與探討 AlN/Al2O3/Si HEMT 的應用潛能
The Enhancement of AlN Growth on Si(100) with Ultra-thin ALD Al2O3 Buffer Layer and the Investigation of the Potential in the Application of an AlN/Al2O3/Si HEMT
陳琬淇; Wan-Chi Chen電子工程學研究所
2024透過有效的二維材料散佈實現超高熱導熱環氧樹脂並建立填料散佈模型以分析此複合材料電特性之研究
Research on Achieving Ultra-High Thermal Conductive Epoxy through Effective 2D Material Dispersion and Establishing a Filler Dispersion Model to Analyze the Electrical Properties of the Composite Material
趙家廉; Chia-Lien Chao電子工程學研究所
Showing results 1 to 13 of 13
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