含奈米碳管的光固化樹脂列印成品導電性探討

Abstract

本研究以混入奈米碳管的光敏樹脂作為列印原料，使用以DLP投影機作為光源、增設刮刀機構的DLP上照式系統印製出具有導電性的結構，並探討列印原料固化前、中、後的電阻與相關參數之間的關係。列印原料根據混入的奈米碳管外徑和長度的不同分成兩種，探討奈米碳管尺寸對列印原料電阻的影響。 首先探討列印原料內的奈米碳管經設備分散均勻後，列印原料電阻與時間之間的關係，並延伸探討同一時間下列印原料電阻與施加之電流之間的關係，接著在列印過程中同步量測列印原料的電阻，更進一步了解列印過程中列印原料的電阻變化，並比較列印原料固化前後的電阻。 印製出具有導電性的結構後，嘗試對結構進行高溫加熱，探討加熱前後電阻的變化，並另外嘗試將結構放置於兩個不同濕度的環境下一個月，觀察水氣對結構電阻的影響。 最後印製出指叉結構，並說明列印過程中遇到的問題，接著對指叉結構進行實驗得到其電容、阻抗與環境溫濕度之間的關係，並計算出理論電容與相關參考文獻進行比較。

In this study, the photosensitive resin mixed with carbon nanotubes was used as the printing materials, and the conductive structures were printed by a DLP (Digital Light Processing) top-down system with the DLP projector as light source and the additional sweeper mechanism. The relationship between the resistance of the printing materials before, during, and after curing and the related parameters was discussed. The printing materials were divided into two types according to outer diameter and length of mixed carbon nanotubes, and the influence of size of carbon nanotubes on the resistance of the printing materials was discussed. Firstly of all, the relationship between a resistance of the printing materials and a time after carbon nanotubes in the printing materials were uniformly dispersed by equipments was discussed, and the relationship between the resistance of the printing materials and applied current at the same time was further discussed. Then, the resistance of the printing materials was measured simultaneously during printing process in order to know more about the resistance change of the printing materials during printing process, and compared the resistance of the printing materials before and after curing. After printing and getting the conductive structures, this study tried to heat the structures at high temperature to discuss the change of the resistance, and also tried to place the structures in two environments with different humidity for a month to observe the effect of moisture on the resistance of the structures . Finally, the interdigitated structures were printed and gotten, and the problems encountered in the process of printing the interdigitated structures were explained. Then, the interdigital structures were tested to obtain the relationship between their capacitance and impedance and ambient temperature and humidity.Then, the theoretical capacitance was calculated and compared with related references.