請用此 Handle URI 來引用此文件：
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/97081完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 謝源弘 | zh_TW |
| dc.contributor.advisor | James Hsieh | en |
| dc.contributor.author | Clinton Marrs | zh_TW |
| dc.contributor.author | Clinton Marrs | en |
| dc.date.accessioned | 2025-02-26T16:21:42Z | - |
| dc.date.available | 2025-02-27 | - |
| dc.date.copyright | 2025-02-26 | - |
| dc.date.issued | 2025 | - |
| dc.date.submitted | 2025-01-23 | - |
| dc.identifier.citation | America, C. f. (2023). CHIPS for America: Building the U.S. Semiconductor Workforce Progress Report. National Institute of Standards and Technology (NIST) Retrieved from https://bit.ly/3BfS4qf
ASU, TSMC announce partnership for workforce and research innovation. (2023). ASU News. https://bit.ly/3VI7g6a Butts, J. (2024). TSMC Arizona struggles to overcome vast differences between Taiwanese and US work culture. https://bit.ly/3Z01UFG Chen, T.-C. T. (2025). Issues in Managing Localized Semiconductor Supply Chains. In T.-C. T. Chen (Ed.), Supply Chain Localization in the Semiconductor Industry: Rebuilding the Competitiveness and Sustainability of Semiconductor Manufacturers (pp. 45-71). Springer Nature Switzerland. https://doi.org/10.1007/978-3-031-81280-4_3 Chengere, K. A. (2024). Cross-Cultural Leadership and Diversity: A Comprehensive Literature Review. Science Innovation, 12(6), 109-112. https://doi.org/10.11648/j.si.20241206.14 Emerson, S. (2024). Chips Giant TSMC Sued Over ‘Anti-American’ Discrimination. Forbes. https://bit.ly/4hoP620 Glassdoor TSMC Arizona reviews. Glassdoor. http://bit.ly/4flfLLS Hofstede, G. (2011). Dimensionalizing cultures: The Hofstede model in context. Online readings in psychology and culture, 2(1), 8. Indeed. TSMC Careers and Employment. https://www.indeed.com/cmp/Tsmc Indeed. (2024). The Indeed Work Wellbeing Score. https://bit.ly/4izopJn Jordan Schneider, L. O. (2024). Culture Clash in TSMC's Phoenix Fab. https://bit.ly/4fmN8hu Kharpal, A. (2024). TSMC To Open Second Japand Chip Factory with Backing from Sony and Toyota. CNBC. https://bit.ly/4gXrK37 Liu, M. (2019). Diversity and Inclusion at TSMC https://bit.ly/40jQQnC Luo, Y. (2023). The rise of techno-geopolitical uncertainty: Implications of the United States CHIPS and Science Act. Journal of International Business Studies, 54(8), 1423-1440. https://link.springer.com/article/10.1057/s41267-023-00620-3 Mendenhall, M. (2015). Specification of the Content Domain of the Intercultural Effectiveness Scale. The Kozai monograph series, 1(2), 1-22. https://www.kozaigroup.com/wp-content/uploads/2015/09/IESTechReport.pdf Portalla, T. (2009). The Development and Validation of the Intercultural Effectiveness Scale. https://bit.ly/4jhaibQ Shih, A. J. (2023). Multicultural Diversity Workforce and Global Technology Collaboration Empowered Semiconductor Manufacturing Excellence in Taiwan: A Manufacturing Engineer’s Perspective. Journal of Manufacturing Science and Engineering, 145(9). https://doi.org/10.1115/1.4062729 Thomson, J. (2024). Taiwan’s TSMC adjusts work culture in Arizona after US staff pushback. https://www.taiwannews.com.tw/news/5916644 TSMC Arizona. (2025). TSMC. https://www.tsmc.com/static/abouttsmcaz/index.htm TSMC Arizona, U.S. Department of Commerce announce up to $6.6B in proposed CHIPS Act direct funding; Company plans third leading-edge fab in Phoenix. (2024). Greater Phoenix Economic Council. https://www.gpec.org/news/tsmc-chips-funding-fab-expansion-announcement/ Wang, L. (2023). TSMC global expansion to minimize risks, concerns. Taipei Times. https://www.taipeitimes.com/News/biz/archives/2023/08/11/2003804541 Wu, M. (2006). Hofstede's cultural dimensions 30 years later: A study of Taiwan and the United States. Intercultural communication studies, 15(1), 33. Zaidi, U. (2024). CSR and Employee Happiness: A Systematic Review and Critique of Organizational Cultures for Employee Satisfaction. Open Journal of Social Sciences, 12(4), 440-457. | - |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/97081 | - |
| dc.description.abstract | None | zh_TW |
| dc.description.abstract | This thesis explores the Taiwan Semiconductor Manufacturing Company’s (TSMC) Arizona operation. TSMC’s Arizona operations face cultural and operational challenges, including misalignment between Taiwanese leadership and U.S. employees, workforce integration issues, and employee dissatisfaction. These barriers impact productivity and operational harmony, making them critical areas for improvement. This thesis explores solutions to these issues, such as cross-cultural training, improved onboarding processes, and employee journey mapping. These strategies focus on identifying pain points and bridging cultural gaps to foster collaboration and employee satisfaction. The aim is for TSMC to achieve a cohesive, productive workforce in Arizona while aligning with broader operational goals. The Arizona semiconductor industry represents a strategic opportunity for TSMC to expand its operations and bring its solutions closer to clients. This expansion offers a pathway for growth and innovation, but the issues TSMC faces in Arizona must be overcome with speed and finesse. | en |
| dc.description.provenance | Submitted by admin ntu (admin@lib.ntu.edu.tw) on 2025-02-26T16:21:42Z No. of bitstreams: 0 | en |
| dc.description.provenance | Made available in DSpace on 2025-02-26T16:21:42Z (GMT). No. of bitstreams: 0 | en |
| dc.description.tableofcontents | Acknowledgment ii
Executive Summary iii Table of Contents iv List of Abbreviations vi Introduction 1 Significance of Study 1 Documentation Overview 1 Objectives 3 TSMC: Company Background 3 Semi-Conductor Supply Chain Localization 4 TSMC Arizona 4 Literature Review 6 Wu & Hofstede on Hofstede’s Cultural Dimensions Theory 6 Luo on Multinational Enterprises 8 Mendenhall’s Intercultural Effectiveness Scale 8 Chengere’s Cross-Cultural Leadership and Diversity 9 Shih on Multicultural Diversity Workforce in Semiconductor Manufacturing 10 Zaidi on CSR and Employee Happiness 12 Operational Challenges 13 Discriminatory Practice Lawsuit 14 Method 15 Data Collection 15 Data Analysis 15 Indeed Data Collection 16 Analytical Framework: Culture Management Overview For Successful Human Operations (CMOFSHO) 26 Indeed TSMC Reviews CMOFSHO Analysis and Findings 29 Interviews 36 Interview Questions: Organizational Goals and Metrics 36 Interview Questions: Workforce Challenges and Adaptation 37 Interview Questions: Feedback Mechanisms and Recent Changes 38 Interview Questions: Individual Roles and Personal Experiences 38 Interview Findings 39 Case Analysis 42 Optimize Onboarding Process 42 Cultural Integration Program 43 Improve Communication and Feedback Mechanisms 43 Other Long-term Considerations 44 Mindset Shift 44 Cultural Gaps 45 Limitations 46 Conclusion 47 | - |
| dc.language.iso | en | - |
| dc.title | 台積電亞利桑那廠與文化融合個案研究 | zh_TW |
| dc.title | Case Study on TSMC Arizona and Cultural Integration | en |
| dc.type | Thesis | - |
| dc.date.schoolyear | 113-1 | - |
| dc.description.degree | 碩士 | - |
| dc.contributor.coadvisor | 堯里昂 | zh_TW |
| dc.contributor.coadvisor | Leon van Jaarsveldt | en |
| dc.contributor.oralexamcommittee | 鄭名道;Mucahid Bayrak | zh_TW |
| dc.contributor.oralexamcommittee | Ming Daw Cheng ;Mucahid Bayrak | en |
| dc.subject.keyword | None, | zh_TW |
| dc.subject.keyword | Workforce Integration,Cross-Cultural,Semiconductor Industry,Employee Experience,Intercultural Effectiveness Scale, | en |
| dc.relation.page | 49 | - |
| dc.identifier.doi | 10.6342/NTU202500284 | - |
| dc.rights.note | 同意授權(全球公開) | - |
| dc.date.accepted | 2025-01-25 | - |
| dc.contributor.author-college | 管理學院 | - |
| dc.contributor.author-dept | 企業管理碩士專班 | - |
| dc.date.embargo-lift | 2025-02-27 | - |
| 顯示於系所單位： | 管理學院企業管理專班(Global MBA) | |
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| 檔案 | 大小 | 格式 | |
|---|---|---|---|
| ntu-113-1.pdf | 465.81 kB | Adobe PDF | 檢視/開啟 |
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