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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 盧信嘉 | |
dc.contributor.author | Jun-An Ji | en |
dc.contributor.author | 紀俊安 | zh_TW |
dc.date.accessioned | 2021-05-20T20:33:19Z | - |
dc.date.available | 2012-08-12 | |
dc.date.available | 2021-05-20T20:33:19Z | - |
dc.date.copyright | 2011-08-12 | |
dc.date.issued | 2011 | |
dc.date.submitted | 2011-08-10 | |
dc.identifier.citation | [1]International Technology Roadmap for Semiconductors 2007 Edition Assembly and Packaging. Available: http://www.itrs.net/Links/2007ITRS/Home2007.htm
[2]K. Onizuka, H. Kawaguchi, M. Takamiya, T. Kuroda, and T. Sakurai, 'Chip-to-chip Inductive Wireless Power Transmission System for SiP Applications,' in IEEE Custom Integrated Circuits Conference, Sep. 2006, pp. 575-578. [3]Yuxiang Yuan, Y. Yoshida, and T. Kuroda, 'Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18μm CMOS,' in Asian Solid-State Circuits Conference, Nov. 2007, pp. 115-118. [4]Hsin-Chia Lu, Guan-Ming Wu, Chuan Pan, and Yien-Tien Chou, 'Coupling coefficient improvement for inductor coupled vertical interconnect in 3D IC die stacking,' in Electronic Components and Technology Conference, May 2009, pp. 1207-1212. [5]A. Yoshida, J. Taniguchi, K. Murata, M. Kada, Y. Yamamoto, Y. Takagi, T. Notomi, and A. Fujita, 'A study on package stacking process for package-on-package (PoP),' in Electronic Components and Technology Conference, Nov. 2006, pp. 6-11 [6]S. F. Al-Sarawi, D. Abbott, and P. D. Franzon, 'A review of 3-D packaging technology,' IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 21, no. 1, pp. 2-14, Feb. 1998. [7]Hsin-Chu Yu, 'The 3rd dimension-more Life for Moore's Law,' in International Microsystems Packaging Asembly Conference Taiwan, Oct. 2006, pp. 1-6. [8]Black Bryan, Annavaram Murali, Brekelbaum Ned, DeVale John, Jiang Lei, H. Loh Gabriel, McCaule Don, Morrow Pat, W. Nelson Donald, Pantuso Daniel, Reed Paul, Rupley Jeff, Shankar Sadasivan, Shen John, and Webb Clair, 'Die stacking (3D) microarchitecture,' in Annual IEEE/ACM International Symposium on Microarchitecture, Dec. 2006, pp. 469-479. [9]J. A. Burns, B. F. Aull, C. K. Chen, Chen Chang-Lee, C. L. Keast, J. M. Knecht, V. Suntharalingam, K. Warner, P. W. Wyatt, and D. R. W. Yost, 'A wafer-scale 3-D circuit integration technology,' IEEE Transactions on Electron Devices, vol. 53, no. 11, pp. 2507-2516, Oct. 2006. [10]S. Denda, 'Process Examination of Through Silicon Via Technologies,' in Polymers and Adhesives in Microelectronics and Photonics, Nov. 2007, pp. 149-152. [11]K. Kanda, D. D. Antono, K. Ishida, H. Kawaguchi, T. Kuroda, and T. Sakurai, '1.27Gb/s/pin 3mW/pin wireless superconnect (WSC) interface scheme,' in IEEE International Solid-State Circuits Conference, Tech. Dig., Feb. 2003, pp. 186-487 [12] M. Sasaki and A. Iwata, 'A 0.95 mW/1.0 Gbps spiral-inductor based wireless chip-interconnect with asynchronous communication scheme,' in Symposium on VLSI Circuits, Tech. Dig. , July 2005, pp. 348-351. [13]Y. Yoshida, K. Nose, Y. Nakagawa, K. Noguchi, Y. Morita, M. Tago, M. Mizuno, and T. Kuroda, 'An Inductive-Coupling DC Voltage Transceiver for Highly Parallel Wafer-Level Testing,' IEEE Journal of Solid-State Circuits, vol. 45, no.11, pp. 2057-2065, Sep. 2010. [14]Hsiang Chen Kuo, 'The study and calculation of straight line coupled inductors,' Master thesis, Graduate of electronic engineering, National Taiwan university, 2008. [15]U. Karthaus and M. Fischer, 'Fully integrated passive UHF RFID transponder IC with 16.7mW minimum RF input power,' IEEE Journal of Solid-State Circuits, vol. 38, no.13, pp. 1602-1608, Sep. 2003. [16]R. E. Barnett, Liu Jin, and S. Lazar, 'A RF to DC Voltage Conversion Model for Multi-Stage Rectifiers in UHF RFID Transponders,' IEEE Journal of Solid-State Circuits, vol. 44, no.2, pp. 354-370, Jan. 2009. [17]K. Zoschke, J. Wolf, M. Topper, O. Ehrmann, T. Fritzsch, K. Scherpinski, H. Reichl, and F. J. Schmuckle, 'Fabrication of application specific integrated passive devices using wafer level packaging technologies,' in Electronic Components and Technology Conference, May 2005, pp. 1594-1601. [18]Chien-Hsun Chen, Chien-Hsiang Huang, Tzyy-Sheng Horng, Sung-Mao Wu, Chi-Tsung Chiu, Chih-Pin Hung, Jian-Yu Li, and Chen Cheng-Chung, 'Very compact transformer-coupled balun-integrated bandpass filter using integrated passive device technology on glass substrate,' in IEEE International Microwave Symposium Asembly Conference Taiwan, May 2010, pp. 1372-1375. [19]Che-Chun Kuo, 'Flip Chip Microwave Integrated Circuit,' Master thesis, Graduate institute of electrical engineering, National central university, 2005. [20]Kiichi Niitsu, Yuan Yuxiang, and Hiroki Ishikuro, 'A 33% improvement in efficiency of wireless inter-chip power delivery by thin film magnetic material for three-dimensional system integration,' Japanese Journal of Applied Physics, vol. 48, no.48, pp.114-127, Dec. 2009. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/9646 | - |
dc.description.abstract | 本篇論文提出一個使用了耦合電感於三維積體電路堆疊晶片間無線能量傳輸的一個可行方法。現行無線能量傳輸方法主要有三,耦合電容、耦合電感以及天線。但其中偶合電容與天線在晶片尺寸時的功率傳輸大約只在微瓦(μW)等級,而我們希望能得到毫瓦(mW)等級的傳輸功率,來驅動系統級的電路。除此之外,與電容耦合相比,由於電感耦合的傳輸有比較遠的距離,因此選用耦合電感做為傳輸媒介。本論文提出兩個不同傳輸距離的設計,晶片間的距離分別為15以及70微米。我們使用交流弦波做為發射訊號,經由發射端電感來傳送能量,接收端則包含了接收電感以及整流器來穩定並提供輸出電壓。此無線能量傳輸系統發射端分別使用氧化鋁陶瓷基板(Al2O3)製程以及玻璃基體被動元件(GIPD)製程,而接收端方面則使用台灣積體電路公司0.18微米製程來實現。本論文實作之結果,在Al2O3版本模擬結果為輸出功率38.10mW,轉換效率為25.93%。在GIPD版本量測結果為輸出功率3.28mW,轉換效率10.36%。 | zh_TW |
dc.description.abstract | A wireless power transmission for stacked dies in 3D-IC is implemented by using coupled inductor design. There are three common methods for wirelessly power transfer: inductive coupling, capacitive coupling and antenna radiation. We hope the wireless power transmission system can offer more than mW power. Unfortunately, only inductive coupling can provide over mW power transmission. Besides, inductive coupling interconnect has longer transmission distance as compared with capacitive interconnect and antenna. This is why we choose inductive coupling. In this thesis, we implement two systems in different transmission distances. The transmission distance is 15μm and 70μm respectively. A sine-wave signal generator is adopted as a source for power transmission. On the other side, there is a receiving inductor and a rectifier at the receiver. The proposed receiver of wireless power transmission system is implemented in TSMC 0.18μm CMOS process and the transmitter of wireless power transmission system is implemented in Al2O3 process and GIPD process respectively for demonstration of this architecture. The simulated received power and efficiency for transmitting inductor using Al2O3 process are 38.10mW and 25.93% respectively. The measured received power and efficiency for transmitting inductor using GIPD process are 3.28mW and 10.36% respectively. | en |
dc.description.provenance | Made available in DSpace on 2021-05-20T20:33:19Z (GMT). No. of bitstreams: 1 ntu-100-R98943129-1.pdf: 2537241 bytes, checksum: 859eebcb1dac0c1d4dceb910d1e08269 (MD5) Previous issue date: 2011 | en |
dc.description.tableofcontents | 第 1 章 簡介 1
1.1 動機 1 1.2 什麼是三維積體電路 3 1.2.1 封裝堆疊 3 1.2.2 晶片堆疊 3 1.2.3 晶圓堆疊 4 1.3 已知的垂直傳輸技術 5 1.3.1 直通矽晶穿孔(through silicon via,TSV) 5 1.3.2 無線電容耦合 6 1.3.3 無線電感耦合 6 1.4 各章節簡介 8 第 2 章 垂直無線能量傳輸系統 9 2.1 無線能量傳輸系統簡介 9 2.2 基本架構 9 2.2.1 電感耦合模型 10 2.2.2 交叉式NMOS開關整流器 12 2.3 完整系統架構與阻抗匹配技巧 15 第 3 章 系統設計考量與實作 19 3.1 GIPD與Al2O3製程介紹 19 3.2 交叉式NMOS開關整流器模擬 21 3.3 通道設計 24 3.4 決定傳輸頻率 29 3.5 效能評估與完整系統模擬 30 第 4 章 量測考量與效能評估 39 4.1 量測方法說明 39 4.2 架構驗證 39 4.3 GIPD版本晶片量測結果 44 第 5 章 結論 50 參考文獻 50 | |
dc.language.iso | zh-TW | |
dc.title | 堆疊晶片間無線能量傳送系統 | zh_TW |
dc.title | Wireless power transmission system between stacked dies | en |
dc.type | Thesis | |
dc.date.schoolyear | 99-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 陳少傑,林宗賢,陳怡然 | |
dc.subject.keyword | 三維積體電路,耦合電感,能量傳輸,覆晶技術,整流器, | zh_TW |
dc.subject.keyword | 3D-IC,coupled inductor,power transmission,flip-chip,rectifier, | en |
dc.relation.page | 51 | |
dc.rights.note | 同意授權(全球公開) | |
dc.date.accepted | 2011-08-10 | |
dc.contributor.author-college | 電機資訊學院 | zh_TW |
dc.contributor.author-dept | 電子工程學研究所 | zh_TW |
顯示於系所單位: | 電子工程學研究所 |
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