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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/61789
Title: | 考慮實體資訊多重缺陷診斷 Multiple Defect Physical-aware Diagnosis |
Authors: | Chieh-Chih Che 車介智 |
Advisor: | 李建模 |
Keyword: | 多重缺陷,晶片診斷, Multiple Defect,IC Diagnosis, |
Publication Year : | 2013 |
Degree: | 碩士 |
Abstract: | 這篇論文針對多重缺陷的錯誤晶片提出一個考慮實體資訊的診斷技術,我們的技術使用單一錯誤模擬,並且可以考慮觸發多重缺陷的錯誤測試向量。我們使用影響一個單一缺陷有關的導線作為診斷的最小單位,然後,我們並不使用任何的錯誤模型,而是提出一個導線對應實體位置的技術來找出真正的缺陷。在ISCAS’89的電路上,多重元件內部缺陷、導線開路和短路缺陷的實驗顯示出我們診斷技術的能力。在使用少量測試向量的設計,此技術的診斷能力特別突出。兩張業界錯誤晶片實體故障分析的照片驗證了我們的診斷技術的正確性。 This thesis presents a physical-aware diagnosis technique for failing dies with multiple defects. Our diagnosis technique uses single fault simulation and considers failing patterns that activate multiple defects at a time. We identify nets that involved in a defect as the smallest diagnosis unit. Then, we propose net to physical site mapping technique to find culprit defects instead of applying any fault model. Simulations on five ISCAS’89 benchmark circuits with multiple cell, open and bridging defects demonstrate the effectiveness of our diagnosis technique. The diagnosability is improved especially when a design with a small number of test patterns. Tow physical failure analysis photos validate the correctness of our diagnosis results for two industrial failing dies. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/61789 |
Fulltext Rights: | 有償授權 |
Appears in Collections: | 電子工程學研究所 |
Files in This Item:
File | Size | Format | |
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ntu-102-1.pdf Restricted Access | 4.24 MB | Adobe PDF |
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