P型氧化鋅特性分析

Abstract

我們在全氧的環境下於GaAs 基板上，濺鍍磷摻雜的氧化鋅薄膜，並於之後做RTA處理於800度3 分鐘，成功成長出了P型氧化鋅薄膜，其電阻為0.00096Ω-cm，而電洞濃度達到 2.244 cm-3。並由XPS的分析，推測會形成這樣的結果，主要是因為氧化鋅內部產生 -2 的受體缺陷，並讓參與其中的磷，因為砷元素的摻雜，改變了氧化鋅晶格的結構 -2 的受體缺陷。並與鎵形成acceptor-donor-acceptor 鍵結對，導致電洞濃度的上升，並提昇了P型氧化鋅的材料特性。

We successfully fabricate a P-doped ZnO thin film on the GaAs substrate at O2 ambient. And then we apply the post annealing process in 800℃ with in 3 minutes.The resistivity of the film is 0.00096Ω-cm and the hole concentration is 2.244×1020 cm-3. The p-type film exits the acceptor-like complexes of AsZn-2VZn. The structure of the ZnO film has been changed due to the As doped. It helps P-doped to increase the PZn-2VZn complexes. The P-dopant and the Ga-dopant in the ZnO film form the acceptor-donor-acceptor complexes and the hole concentration will be inceased and promote the property of p-type ZnO film.