嵌入式熱管散熱模組之性能研究與熱阻分析

Abstract

近年來，電子設備元件之性能不斷提升，而其發熱功率亦隨著性能提升而逐漸增加，因此尋求更有效之散熱方式將顯得不可忽略，本研究中之嵌入式熱管散熱模組亦屬於能有效解決散熱問題的方式之一。針對此散熱模組，本研究利用熱阻分析模式及性能實驗之方法，成功建立了嵌入式熱管散熱模組完整之理論模式，可提供後續相關研究進行之依據及改良方法。實驗結果顯示，嵌入式熱管散熱模組其性能會受到熱管性能之影響，當加熱功率為140W時，此散熱模組之最佳總熱阻值為0.267℃/W，表示此散熱模組在電子冷卻應用上有相當好的性能表現。

In recent years, the electronic devices and components have better performance constantly. With the increasing performance, the heat generation of the electronic devices and components also increases. Therefore, looking for more effective cooling method plays an important role. The embedded heat-pipe cooling module in this investigation is designed to solve the foregoing thermal problem. This investigation successfully establishes an overall theoretical model for the embedded heat-pipe cooling module by adopting the thermal resistance’s analysis and the performance’s experiment, and provides the follow-up research a basis. From the experimental results, the performance of this cooling module is affected by the performance of heat-pipe. When the input power is 140W, this cooling has a best overall thermal resistance 0.267℃/W.