請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/36911
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 陳希立 | |
dc.contributor.author | Ren-Hao Kang | en |
dc.contributor.author | 康仁豪 | zh_TW |
dc.date.accessioned | 2021-06-13T08:22:18Z | - |
dc.date.available | 2007-07-26 | |
dc.date.copyright | 2005-07-26 | |
dc.date.issued | 2005 | |
dc.date.submitted | 2005-07-17 | |
dc.identifier.citation | 1.M. Mochizuki, Y. Saito, K. Goto, and Y. Nguyen, “ Hinged Heat Pipes for Cooling Notebooks PCs ”, 13th IEEE SEMI-THERM Symposium, pp. 64-72, 1997.
2.M. Oomi, T. Fukumoto, and J.Sotani, “ A Heat-Pipe system for a Desktop Computer ”, Advances in Electronic Packaging, ASME, Vol. 2, pp. 1951-1955, 1999. 3.J. Stotani, Y. Susa, S. Tanaka, K. Sato, and Y. Kimura, “ Micro Heat Pipe ”, Transport Phenomena in Heat and Mass Transfer, pp.1100-1108, 1992. 4.J. Stotani, K. Nanba, Y. Kasagi, and K. Yoshioka, “ Performance of Flat Micro Heat Pipe ”, Experimental Heat Transfer, Fluids Mechanics and Thermodynamics, Vol. 1, pp. 414-421, 1993. 5.J. Stotani, K. Nanba, and N. Kageyama, “ A Micro Heat-Pipe for Cooling Notebook PCs ”, International Heat Pipe Conference, 1995. 6.Thang Nhuyen, Masataka Mochizuki, Koichi Mashiko, and Yuji Saito, “ Use of Heat Pipe/Heat Sink for Thermal Management of High Performance CPUs ”, Sixteenth IEEE SEMI-THREM Symposium, 2000. 7.Christopher A. Soule, “ Future Trends in Heat Sink Design ”, Electronics Cooling, February, 2001. 8.R.E. Simons, “ Estimating Parallel Plate-Fin Heat Sink Thermal Resistance ”, Electronics Cooling, Vol. 9, No.1, pp. 8-9, 2003. 9.Kwang-Soo Kim, Myong-Hee Won, Jong-Wook Kim, and Byung-Joon Back, “ Heat Pipe Cooling Technology for Desktop PC CPU ”, Applied Thermal Engineering 23, pp. 1137-1144, 2003. 10.D. G. Wang, “ Optimization of System Fan Placement ”, Proceeding of the 2000 IEMT/IMC Thermal Management, April, 2000. 11.Seri Lee, “ Calculating Spreading Resistance in Heat Sinks ”, Electronics Cooling, Vol. 4, No. 1, pp. 30-33, January 1998. 12.Seri Lee, S. Song, V. Au, “ Closed Form Equation for Thermal Constriction/Spreading Resistances with Variable Boundary Condition ”, Proceedings of the 1994 IEPS Conference, pp. 111-121, 1994. 13.Seri Lee, S. Song, V. Au, and K.P. Moran, “ Constriction/Spreading Resistance Model for Electronic Packaging ”, Proceedings of the 4th ASME/JSME Thermal Engineering Joint Conference, Vol. 4, pp. 199-206, 1995. 14.Geoff Thyrum, “ Alleviating Thermal Spreading Resistance in Telecommunications Systems ”, Thermacore, Inc. 15.Don, Noren, “ Heat Pipe/Sink Combination Cools Sealed Power Modules ”, Powerconversion & Intelligent Motion, Vol. 14, No. 6, pp. 15-16, January 1998. 16.A. Faghri, “ Heat Pipe Science and Technology “, Taylor & Francis, Washington. DC, 1995. 17.P. D. Dunn, and D. A. Reay, “ Heat Pipes ”, 4th, 1994. 18.J. P. Holman, “ Heat Transfer ”, The McGraw-Hill Companies, 2000. 19.A. F. Mills, “ Heat Transfer ”, 2nd ed., Prentice Hall, , 1999. 20.S.W. Chi, “ Heat Pipe Theory and Practice:A Sourcebook ”, The McGraw-Hill Companies. 21.A. Abo El-Nasr, S.M. El-Haggar, “ Effective Thermal Conductivity of Heat Pipes ”, Heat and Mass Transfer, Vol. 32, No. 1-2, pp. 97-101, November, 1996. 22.M. N. Murray, “ Heat Transfer Through an Annular Disk or Fin of Uniform Thickness”, Trans. ASME, J. Applied Mech., 60, A78, 1938. 23.依日光,「熱管技術理論實務」, 日本技術協會編, 復漢出版社, 1986. 24.陳宏鳴,「熱虹吸蒸氣腔體之研究」,碩士論文,國立台灣大學機械工程學研究所,民國93年。 25.陳克俊,「功率掃描之直徑五釐米粉末燒結式熱管性能測試」,碩士論文,國立台北科技大學冷凍與低溫科技研究所,民國93年。 26.黨一為,「熱管結合散熱鰭片之效能模擬與分析」,碩士論文,國立清華大學工程與系統科學系研究所,民國93年。 27.周文豪,「嵌入式熱管散熱模組之數值分析與實驗測試」,碩士論文,國立台灣大學機械工程學研究所,民國94年7月(2005)。 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/36911 | - |
dc.description.abstract | 近年來,電子設備元件之性能不斷提升,而其發熱功率亦隨著性能提升而逐漸增加,因此尋求更有效之散熱方式將顯得不可忽略,本研究中之嵌入式熱管散熱模組亦屬於能有效解決散熱問題的方式之一。針對此散熱模組,本研究利用熱阻分析模式及性能實驗之方法,成功建立了嵌入式熱管散熱模組完整之理論模式,可提供後續相關研究進行之依據及改良方法。實驗結果顯示,嵌入式熱管散熱模組其性能會受到熱管性能之影響,當加熱功率為140W時,此散熱模組之最佳總熱阻值為0.267℃/W,表示此散熱模組在電子冷卻應用上有相當好的性能表現。 | zh_TW |
dc.description.abstract | In recent years, the electronic devices and components have better performance constantly. With the increasing performance, the heat generation of the electronic devices and components also increases. Therefore, looking for more effective cooling method plays an important role. The embedded heat-pipe cooling module in this investigation is designed to solve the foregoing thermal problem. This investigation successfully establishes an overall theoretical model for the embedded heat-pipe cooling module by adopting the thermal resistance’s analysis and the performance’s experiment, and provides the follow-up research a basis. From the experimental results, the performance of this cooling module is affected by the performance of heat-pipe. When the input power is 140W, this cooling has a best overall thermal resistance 0.267℃/W. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T08:22:18Z (GMT). No. of bitstreams: 1 ntu-94-R92522309-1.pdf: 1491644 bytes, checksum: 5fce8f30006a03716d1a4bacbfee83e3 (MD5) Previous issue date: 2005 | en |
dc.description.tableofcontents | 目 錄
摘要 I ABSTRACT II 目錄 III 表目錄 V 圖目錄 VI 符號說明 VIII 第一章 緒論 1 1-1 前言 1 1-2 研究動機與目的 2 1-3 文獻回顧 3 第二章 熱阻分析模式與理論模式之建立 9 2-1 熱管基本原理 9 2-2 熱阻分析模式之建立 10 2-2-1 熱阻之定義 10 2-2-2 熱阻分析模式 11 2-2-3 鰭片上之溫度分佈 13 2-3 理論模式之建立 16 第三章 實驗設備與方法 33 3-1 實驗系統簡介 33 3-1-1 單根熱管實驗系統 33 3-1-2 嵌入式熱管散熱模組實驗系統 34 3-1-3 實驗量測裝置 35 3-2 實驗參數 35 3-3 實驗步驟 36 3-3-1 單根熱管之實驗步驟 36 3-3-2 嵌入式熱管散熱模組之實驗步驟 36 3-4 誤差分析 37 第四章 結果與討論 46 4-1 單根熱管之性能 46 4-2 供應熱源加熱功率對系統性能之影響 46 4-2-1 分路熱傳量之估算 47 4-2-2 加熱功率對各項熱阻之影響 48 4-2-3 總鰭片高度之分段 50 4-3 實驗熱阻值與理論熱阻值之比較 52 4-3-1 介面熱阻1 52 4-3-2 底板熱阻 53 4-3-3 鰭片H1段之對流熱阻 53 4-3-4 底板至熱管之熱阻 53 4-3-5 熱管熱阻 54 4-3-6 鰭片(H2+H3)段之對流熱阻 54 4-3-7 總熱阻 54 第五章 結論與建議 69 5-1 結論 69 5-2 建議 71 參考文獻 74 | |
dc.language.iso | zh-TW | |
dc.title | 嵌入式熱管散熱模組之性能研究與熱阻分析 | zh_TW |
dc.title | Thermal Performance of Heat Sink With Embedded Heat Pipe Using Thermal Resistance Method | en |
dc.type | Thesis | |
dc.date.schoolyear | 93-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 田華忠,雷顯宇,李雨 | |
dc.subject.keyword | 熱管,嵌入式熱管散熱模組,熱阻分析, | zh_TW |
dc.subject.keyword | Heat Pipe,Cooling Module with Embedded Heat Pipe,Thermal Resistance Analysis, | en |
dc.relation.page | 76 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2005-07-19 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-94-1.pdf 目前未授權公開取用 | 1.46 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。