兩相流封閉式熱虹吸系統應用於電子散熱之研究

Abstract

電子產品隨者科技的進步使得性能及處理速度不斷的增加以符合工業的需求，但是電子產品在高速運算的同時也會產生大量的熱能，因此如何在有限的散熱面積下將熱能有效的散出，成為目前電子產品設計中不可忽視的一環，現在最常用的方式是風扇鰭片組合，由於電子產品的熱能密度越來越高，而風扇鰭片的散熱性能已經接近瓶頸，因此本研究嘗試以兩相流封閉式熱虹吸散熱系統為散熱模組，以實驗的方式研究此散熱模組在不同的實驗參數下散熱性能的表現差異，並找出本散熱模組之最佳化設計，兩相流封閉式熱虹吸散熱系統主要可以分為蒸發部、冷凝部、對流部三大部分，其運作原理是利用蒸發部內的液態的工作流體產生相變化以吸收大量的熱能，然後變成氣態的工作流體會上升至冷凝部並於璧面產生凝結將熱迅速的釋放於外界之中。本實驗之實驗參數有散熱系統的充填率、模擬熱源的加熱率、蒸發部底板沸騰表面的結構，研究各實驗參數下的散熱性能表現以作為未來改進本系統的方向，由實驗結果發現本系統對於高加熱率有良好的散熱性能，對於目前熱能密度越來越高的電子產品來說，本實驗散熱系統應用於電子散熱有很好的散熱表現。

The increase that the electronic product makes performance and processing speeds constant with the progress of science and technology, in order to accord with the demand of industry, but electronic product can produce a large amount of heat energy too in while in high-speed computation, so how make heat energy valid to is it produce to come loose under the area in limited heat dissipation, becoming a ring which can't be ignored in the electronic product design at present, the most frequently used way is one slice of associations of fan fin now, because the heat energy of the electronic product is higher and higher in density, and the heat dissipation performance of slice of fan fin has already been close to the bottleneck, so research Two Phase Close Thermosyphon Cooling System as the heat dissipation to try, research this heat dissipation mould group behavior difference, heat dissipation of performance under different experiment parameter by way of experiment, find out this heat dissipation optimization, mould of group design, two phase flow closed thermosyphon heat dissipation system can divide into person who evaporate, condensation department, convection department three major part mainly, its operation principle is to utilize the liquid job fluid in the evaporating department to produce the looks change in order to absorb a large amount of heat energy, turn into job fluid of gaseous state will rise to condensation department and is it condense hot fast release among the external world to produce ancient piece of jade. The experiment parameter of this experiment has surface structure of filling rate, the heating rate of the simulation heat source, evaporating department baseplate of the heat dissipation system, study every experiment heat dissipation performance of parameter display in order to improve direction of system this as future, found this system has good heat dissipation performance to the high heating rate by the experimental result, because electronic product higher and higher in density to heat energy at present once, this experiment heat dissipation system has very fine heat dissipation to behave to apply to electronic cooling.