請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/34933
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 陳希立 | |
dc.contributor.author | Shan-Ching Chao | en |
dc.contributor.author | 趙善慶 | zh_TW |
dc.date.accessioned | 2021-06-13T06:37:06Z | - |
dc.date.available | 2007-01-26 | |
dc.date.copyright | 2006-01-26 | |
dc.date.issued | 2005 | |
dc.date.submitted | 2005-10-13 | |
dc.identifier.citation | 1. Haper, D. R. and Brown, W. B., “Mathematical Equations for Heat Conduction in the Fins if Air Cooled Engines,” NACA Report No.158, 1922.
2. Bejan, A. and Sciubba, E., “The Optimal Spacing of Parallel Plates Cooled by Forced Convection,” Int. J. Heat Mass Transfer, Vol. 35, No. 12, pp. 3259-3264, 1992. 3. D. Strassberg, 'Cooling Hot Microprocessor,' EDN, Vol. 39, pp. 40-50, 1994. 4. Grover, G. M. “US Patent No. 3229759,” 1963. 5. Nguyen, T., Mochizuki, M., Mashiko, K., Saito, Y., Sauciuc, I., and Boggs, R., “Advanced Cooling System Using Miniature Heat Pipes in Mobile PC,” IEEE Transactions on Components and Packing Technology, Vol.23, No.1, March 2000. 6. Legierski, J. & Wiecek, B.,” Steady State Analysis of Cooling Electronic Circuits Using Heat Pipes,” IEEE Transactions on Components and Packing Technology, Vol.24, No.4, December 2001. 7. A. Niro and G. P. Beretta, 'Boiling Regimes in a Closed Two-Phase Thermosyphon,' International Journal of Heat and Mass Transfer, Vol. 33, No. 10, pp. 2099-2110, 1990. 8. Zuo, Z.J., Dussinger, Peter M., “Heat Pipe Vapor Chamber Cold Plate Modeling, Fabrication and Testing,” Proceedings of other 1998 ASME International Mechanical Engineering Congress and Exposition, pp. 281-286, 2000. 9. Yusfu, I., Watwe, A., and Ekhiassi, H., “Integrated Heat Sink-Heat Pipe Thermal Cooling Device,” 7th Intersociety Conference on Thermal and Thermomechanicla Phenomena in Electronic System-Itherm 2000, Vol. 2. pp. 27-30, 2000. 10. Thermal Integration Technology, Inc., http://www.thermal-integration.com 11. Jacob, M., 'Heat Transfer,' Wiley, New York, pp.636-638,1949. 12. Webb, R. L., and Pais, C., “Nucleation Boiling Data for Five Refrigerants on Plain, Integral-Fin and Enhanced Tube Geometries,” International general of heat and mass transfer, Vol. 35, No. 8, pp. 1893-1904,1972. 13. Nakayama, W., Diakoku, T., Kuwahara, H. and Nakajima, T. “Dynamic Model of Enhanced Boiling Heat Transfer on Porous Surface”, 1980. 14. O’Neill, P. S.,Gottzman, C. F., and Terbot, J. W., 'Novel Heat Exchanger Increases Cascade Cycle Efficiency for Natural Gas Liquefaction,in Advances in Cryogenic Engineering, ' ed. K. D. Timmerhaus, pp.420-437,Plenum,New York, 1972. 15. Nukiyama, S., 1934, “Maximum and Minimum Values of Heat Transmitted from a Metal to Boiling Water under Atmospheric Pressure,” Japanese Society of Mechanical Engineers, Japan, Vol. 37, 367-373, S53-43. 16. Rohsenow, W. M., and Griffith, P., “Correlation of Maximum Heat Transfer Data for Boiling Saturated Liquids,” Chem. Eng. Progress Symp. Ser. 52(18), 1956. 17. Pioro, “Experimental evaluation of contents for the Rohsenow pool boiling correlation,” Heat and Mass Transfer, Vol.42, pp2003-2013, 1998. 18. W. M. Rohsenow, 'Boiling,' in Handbook of Heat Transfer, W. M. Rohsenow and J. P. Hartnett eds., Sec. 13, McGraw-Hill Book Company, New York, 1973. 19. J. G. Collier and J. R. Thome, 'Convective Boiling and Condensation,' 3rd ed., Clarendon Press, Oxford, UK, 1994. 20. Czikk, A.M. and O’Neill, P.S.,” Correlation of Nucleate Boiling from Porous Metal Films,” in advances in Enhanced Heat Transfer, J.M. Chenoweth, J. Kaellis, J.W. Michel, and S. Shenkman, Eds., ASME, New York, pp.103-113, 1979. 21. L. T. Yeh, and R. C. Chu, 'Thermal Management of Microelectronic Equipment,' ASME Press Book Series on Electronic Packaging, New York, 2002. 22. 陳宏鳴,「熱虹吸蒸氣腔體之研究」,碩士論文,國立臺灣大學機械工程學研究所,民國九十三年六月(2004)。 | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/34933 | - |
dc.description.abstract | 電子產品隨者科技的進步使得性能及處理速度不斷的增加以符合工業的需求,但是電子產品在高速運算的同時也會產生大量的熱能,因此如何在有限的散熱面積下將熱能有效的散出,成為目前電子產品設計中不可忽視的一環,現在最常用的方式是風扇鰭片組合,由於電子產品的熱能密度越來越高,而風扇鰭片的散熱性能已經接近瓶頸,因此本研究嘗試以兩相流封閉式熱虹吸散熱系統為散熱模組,以實驗的方式研究此散熱模組在不同的實驗參數下散熱性能的表現差異,並找出本散熱模組之最佳化設計,兩相流封閉式熱虹吸散熱系統主要可以分為蒸發部、冷凝部、對流部三大部分,其運作原理是利用蒸發部內的液態的工作流體產生相變化以吸收大量的熱能,然後變成氣態的工作流體會上升至冷凝部並於璧面產生凝結將熱迅速的釋放於外界之中。本實驗之實驗參數有散熱系統的充填率、模擬熱源的加熱率、蒸發部底板沸騰表面的結構,研究各實驗參數下的散熱性能表現以作為未來改進本系統的方向,由實驗結果發現本系統對於高加熱率有良好的散熱性能,對於目前熱能密度越來越高的電子產品來說,本實驗散熱系統應用於電子散熱有很好的散熱表現。 | zh_TW |
dc.description.abstract | The increase that the electronic product makes performance and processing speeds constant with the progress of science and technology, in order to accord with the demand of industry, but electronic product can produce a large amount of heat energy too in while in high-speed computation, so how make heat energy valid to is it produce to come loose under the area in limited heat dissipation, becoming a ring which can't be ignored in the electronic product design at present, the most frequently used way is one slice of associations of fan fin now, because the heat energy of the electronic product is higher and higher in density, and the heat dissipation performance of slice of fan fin has already been close to the bottleneck, so research Two Phase Close Thermosyphon Cooling System
as the heat dissipation to try, research this heat dissipation mould group behavior difference, heat dissipation of performance under different experiment parameter by way of experiment, find out this heat dissipation optimization, mould of group design, two phase flow closed thermosyphon heat dissipation system can divide into person who evaporate, condensation department, convection department three major part mainly, its operation principle is to utilize the liquid job fluid in the evaporating department to produce the looks change in order to absorb a large amount of heat energy, turn into job fluid of gaseous state will rise to condensation department and is it condense hot fast release among the external world to produce ancient piece of jade. The experiment parameter of this experiment has surface structure of filling rate, the heating rate of the simulation heat source, evaporating department baseplate of the heat dissipation system, study every experiment heat dissipation performance of parameter display in order to improve direction of system this as future, found this system has good heat dissipation performance to the high heating rate by the experimental result, because electronic product higher and higher in density to heat energy at present once, this experiment heat dissipation system has very fine heat dissipation to behave to apply to electronic cooling. | en |
dc.description.provenance | Made available in DSpace on 2021-06-13T06:37:06Z (GMT). No. of bitstreams: 1 ntu-94-R92522103-1.pdf: 1431320 bytes, checksum: a282148a35618f9faef30a3722dc7925 (MD5) Previous issue date: 2005 | en |
dc.description.tableofcontents | 摘 要 I
Abstract II 目錄 III 圖目錄 V 表目錄 VII 符號說明 VIII 第一章 緒論 1 1.1前言 1 1.2研究動機與目的 3 1.3文獻回顧 5 第二章 基本原理與理論模式 12 2.1熱管原理 12 2.1.1熱管 12 2.1.2封閉式熱虹吸管 14 2.1.3蒸氣腔體 15 2.2沸騰理論 16 2.2.1沸騰定義與概念 16 2.2.2核沸騰理論 18 2.2.3孔隙表面之沸騰理論 20 2.3熱阻分析模式 25 2.3.1 熱阻定義與概念 25 2.3.2 熱阻模型 27 2.3.3 界面熱阻 30 2.3.4 底板壁面熱阻 31 2.3.4 蒸發熱阻 32 2.3.5 冷凝熱阻 32 2.3.6 冷凝管壁面熱阻 33 2.3.6 對流熱阻 33 第三章 實驗設備與研究方法 41 3.1實驗系統說明 41 3.1.1 實驗系統 41 3.1.2 實驗相關設備 44 3.2系統作動原理 47 3.3實驗參數 48 3.3.1 模擬熱源之加熱率 48 3.3.2 工作流體之充填率 49 3.3.3沸騰表面之結構形式 50 3.4實驗流程 52 3.4.1 前置作業 52 3.4.2 實驗步驟 53 3.5誤差分析 56 第四章 結果與討論 69 4.1 加熱率對系統性能的影響 70 4.1.1結果描述 70 4.1.2結果討論 71 4.2 充填率對系統性能的影響 72 4.2.1結果描述 72 4.2.2結果討論 75 4.3 沸騰表面對系統性能的影響 77 4.3.1結果描述 77 4.3.2結果討論 78 第五章 結論與建議 100 5.1 結論 100 5.2 建議 104 參考文獻 107 | |
dc.language.iso | zh-TW | |
dc.title | 兩相流封閉式熱虹吸系統應用於電子散熱之研究 | zh_TW |
dc.title | Investigation and Analysis of the Two Phase Close Thermosyphon System for Electronic Cooling | en |
dc.type | Thesis | |
dc.date.schoolyear | 94-1 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 陳輝俊,卓清松 | |
dc.subject.keyword | 電子散熱,熱虹吸,充填率,沸騰表面, | zh_TW |
dc.subject.keyword | electronic cooling,Thermosyphon,filling rate,boiling enhancement, | en |
dc.relation.page | 109 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2005-10-13 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-94-1.pdf 目前未授權公開取用 | 1.4 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。