可撓式基材之元件發展：以射頻辨識標籤及溫度感測陣列為例

Abstract

本研究以可撓性元件發展設計為訴求，以「射頻辨識系統(RFID)之標籤天線設計及製作」及「人工皮膚之溫度感測陣列」為應用，來做為論文主要重點與達成目標。射頻辨識標籤天線的部份，我們以Zeland IE3D來進行模擬及設計，以求得天線與晶片間是否達到阻抗匹配(Impedance matching)，並取得最佳的天線增益。因此本研究改變偶極天線(Dipole)之尺寸參數，並設計四種於操作頻率在915MHz的標籤天線，並以MEMS製程將此四種天線利用銅膜製作出來後，以讀取距離來討論模擬與實際量測之間的關係。而可撓式溫度感測陣列部分，則在欲達成之規格規範之下，用軟性電路板技術(FPCB)與類比式溫度感測器(MAX6607)之結合後完成8×8陣列的製作，並利用類比式多工器及單晶片微處理器8051來進行掃描陣列的動作，其中此類比式多工器可當做解多工器使用，透過此特性，利用當做解多工器時做為「列」之掃描，提供驅動電壓給溫度感測器，另外則是當做多工器使用時做為「行」之掃描，接收晶片送出之訊號；最後並使用線路雕刻機將掃描電路做成一個整合型電路板，透過RS232傳輸陣列上的溫度資訊於PC上。此外，本研究亦發展了一套C++程式能將二維的溫度分佈清晰地用不同的顏色在電腦上顯示。

In this work, we develop radio frequency identification (RFID) tags and temperature sensor arrays using flexible substrates. The RFID tag operated at 915 MHz. The tag antenna is simulated by the Zeland IE3D. The goal of the design is to match the tag impedance as well as to maximize the directive gain. Four different tag antenna designs are proposed and fabricated on Cu membranes using MEMS process. The design parameters are the patterns and the dimensions of antennas. Simulated results of the RFID tags are also verified with the measured results the effective reading distances. For the temperature sensor array case, we develop an 8×8 sensing array using FPCB and analog temperature sensors MAX6607. The scanning circuit, which includes a microprocessor (8051) and multiplexers, is developed to scan the sensor array as well as to transfer the scanned data to a personal computer using RS232. For row scanning, the multiplexer provides the driving power to sensors. For column scanning, another multiplexer is used to receive the data outputs of the sensor. Furthermore, we also develop a C++ code which presents the measured real-time temperature distributions as two-dimensional color-map images on a computer monitor.