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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/31824
Title: | 微孔輪廓量測系統之研究 The study for dimensional measurement of microholes |
Authors: | Wei-Cheng Liu 劉韋承 |
Advisor: | 廖運炫 |
Keyword: | 微孔量,測,高深寬比,電容感測, Microhole measuring system,High aspect ratio,Capacitance-sencing, |
Publication Year : | 2006 |
Degree: | 碩士 |
Abstract: | 本論文利用電容附加在探針上的觀念,以及輔以旋轉平台與程式做點資料的轉換,發展一套微孔輪廓量測系統,進而可以量測具有高深寬比特徵的微孔洞並演算其各層的真圓度。先以1級塊規驗證量測系統的重現性誤差達到±0.78μm ,再量測塊規之水平與垂直輪廓,所得到真直度誤差為1μm,達到最大量測深度為15mm。最後成功量測Φ1.0mm,深度10mm的微孔,描繪出微孔全輪廓,也計算出每1mm深度的截面真圓度和軸心偏斜度。 A system for measuring the profile of a microhole is developed. The principle of capacitance is adopted and a device to sense the variation of capacitance when the probe touches the workpiece is designed. With the aid of the rotation stage, positions around the contour can be measured. The measured coordinates are transformed by an algorithm proposed in this paper. The developed system is capable of measuring the interior profile of a high aspect ratio microhole, and caculating its roundness. The estimated repeatability around ±0.78μm is obtained by measuring the grade A gauge block. The maximum depth of a Φ1.0mmmicro-hole that can be measured is 15mm. A Φ1.0mm microhole of 10mm depth was successfully measured and its interior profile was described. Moreover, the roundness of each cross-section at every 1 mm depth increment and the inclination of axis of the micro-hole were calculated. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/31824 |
Fulltext Rights: | 有償授權 |
Appears in Collections: | 機械工程學系 |
Files in This Item:
File | Size | Format | |
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ntu-95-1.pdf Restricted Access | 5.41 MB | Adobe PDF |
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