透過有效的二維材料散佈實現超高熱導熱環氧樹脂並建立填料散佈模型以分析此複合材料電特性之研究

Abstract

三維集成電路（3DIC）的有效熱管理，由於功率密度增加和散熱需求提升，面臨著顯著挑戰。針對這些挑戰，本研究提出了通過將二維材料整合到熱固性環氧樹脂中來顯著提高封裝材料導熱性的解決方案。我們的研究表明，這一方法在提高材料導熱性方面具有顯著效果，並已成功整合至現有商用產品上，突顯了此方法的實用性和工業可行性。此外，為了實現與生產線的整合，遵守包括熱機械性質在內的參數是至關重要的。這些參數必須符合工業標準，才能確保整合過程的順利進行。為了更好地分析環氧樹脂複合材料，我們也開發了一個穩健的填料散佈模型。該模型不僅為本研究的材料分析提供了分析方式，還為未來的進一步研究和應用提供了堅實的基礎框架。通過這種綜合方法，我們不僅顯著改善了3DIC中的熱管理性能，還在材料科學和電子封裝技術領域開辟了新的研究方向。這一方式不僅能提升當前技術水準，還為未來的技術創新和發展提供了新的可能性，預示著3DIC熱管理技術將迎來更加高效和可靠的發展前景。

Effective thermal management in 3D integrated circuits (3DIC) presents significant challenges due to increased power densities and heat dissipation requirements. Our research addresses these challenges by integrating 2D material composites into thermoset epoxy, significantly enhancing the thermal conductivity of the packaging material. This integration has been successfully demonstrated in commercial products, highlighting both the practicality and industrial viability of our approach. Moreover, we emphasize the importance of complying with essential parameters, such as thermo-mechanical properties, which are required by industry standards for seamless integration into production lines. Additionally, we have developed a robust filler dispersion model to analyze epoxy composite materials, providing a foundational framework for further studies and applications. This comprehensive approach not only improves thermal management in 3DICs but also sets the stage for future advancements in material science and electronic packaging technologies.