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標題: | 高週波感應快速加熱與氣體均勻施壓應用於壓印複製雙面微結構製程開發 Imprinting of double-sided microstructures with rapid induction heating and gas-assisted pressuring |
作者: | Yang-Min Shih 施養旻 |
指導教授: | 楊申語(Sen-Yeu Yang) |
關鍵字: | 氣體輔助熱壓印成型,感應加熱,成型週期,雙面微結構複製, Induction hot embossing,Hot embossing,Induction heating, |
出版年 : | 2016 |
學位: | 碩士 |
摘要: | 雙面微結構其光學性質及適用性又較單面微結構來的優異,在微結構的複製上,熱壓印成型為常用的製程技術,其具有製程步驟簡單及轉寫率高的優勢,常被用來複製高分子光學元件表面微結構。傳統熱壓印成型有二大問題:一是板壓,容易造成壓力分佈不均;二是升降溫耗時,成型週期過長,如何開發快速加熱冷卻且能均勻施壓製作雙面微結構光學元件是一大挑戰。本研究以包覆式感應加熱技術使雙片模仁快速升溫,加上氣體等向施壓達到壓力平均之目的,開發一結合感應加熱氣體輔助雙面熱壓設備。
本研究首先利用COMSOL分析軟體進行包覆式線圈對於不同模具面積的加熱模擬,觀察此包覆式線圈設計對模具的加熱情形,並配合實驗進行驗證。分析結果顯示,隨著面積的增加,感應電流密度也隨之增加使升溫速率提升,其與實驗結果相當符合,在50 mm × 50 mm的面積下,升溫速率最快可達到13.2°C/s且實驗之溫差可控制在20°C以內,證明此線圈設計可達到良好的溫度均勻性。本研究接著將此包覆式線圈與氣體輔助熱壓製程結合,設計製作可快速加熱且具備雙面氣體均勻施壓之設備,實驗結果顯示本文所設計之設備能將整體熱壓印製程時間縮短至4分鐘以內,與傳統熱壓20分鐘以上的製程時間相較,製程週期大幅縮短。 在實際應用上,此製程能完整複製雙面50 mm × 50 mm微奈米結構於PC、COP、PLA基材表面,V型溝槽及奈米結構皆有95%以上的轉寫率,微透鏡陣列的轉寫更能達到97%以上的轉寫率。本研究證明高週波感應快速加熱與氣體均勻施壓應用於壓印複製雙面微奈米結構的可行性與性能。 Components with microstructures on double sides have better optical properties and functions than those with microstructures on single side. In the replication of microstructures, hot embossing is an inexpensive and flexible fabrication method for replication of micro/nano structures on polymer. However, there are two inherent problems in the conventional hot embossing process. First, the embossing pressure provided by plates is not uniform.Second, the heating by the plates causes long cycle time. How to develop a rapid heating and cooling system to replicate high-performance double-sided optical elements is a challenge. This study is devoted to developing a rapid heating system which integrates induction heating and gas-assisted pressuring to hot embossing process for replicating micro/nano structures on polymeric both sides of substrates. In this study, induction heating using wrapped coils is employed to heat metallic molds. The temperature rise and distribution on various areas were first simulated and analyzed with CAE software COMSOL. Coil induction heater was then implemented and tested. Both the experiments and simulations showed that the density of induction current and the heating rate increase with the mold area. In 50 mm × 50 mm sample, the heating rate can reach 13.2°C/s, and the temperature variation is 20°C, showing the good uniformity of this system. A facility to integrate induction heating and gas pressuring for hot embossing was designed and constructed in a chamber. Experiments showed that the cycle time can be reduced to 4 minutes. The inducton heating gas-assisted embossing successfully replicated doubled-sided V-cut, microlens array and nanostructures on 50 mm × 50 mm PC, COP, PLA substrates with a replication rate above 95%. This study proves the potential of induction heating gas-assisted embossing for rapid replication of double-sided micro/nano structures for industial applications. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/78137 |
DOI: | 10.6342/NTU201602290 |
全文授權: | 有償授權 |
顯示於系所單位: | 機械工程學系 |
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