請用此 Handle URI 來引用此文件:
http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/78137
完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 楊申語(Sen-Yeu Yang) | |
dc.contributor.author | Yang-Min Shih | en |
dc.contributor.author | 施養旻 | zh_TW |
dc.date.accessioned | 2021-07-11T14:43:26Z | - |
dc.date.available | 2021-10-14 | |
dc.date.copyright | 2016-10-14 | |
dc.date.issued | 2016 | |
dc.date.submitted | 2016-08-11 | |
dc.identifier.citation | [1] A. Mathur, S. S. Roy, M. Tweedie, S. Mukhopadhyay, S. K. Mitra, and J. A. McLaughlin, “Characterisation of PMMA microfluidic channels and devices fabricated by hot embossing and sealed by direct bonding,” Curr. Appl. Phys., vol. 9, no. 6, pp. 1199–1202, Nov. 2009.
[2] C. T. Pan, T. T. Wu, M. F. Chen, Y. C. Chang, C. J. Lee, and J. C. Huang, “Hot embossing of micro-lens array on bulk metallic glass,” Sens. Actuators Phys., vol. 141, no. 2, pp. 422–431, Feb. 2008. [3] J. V. Erps, M. Wissmann, M. Guttmann, M. Hartmann, J. Mohr, C. Debaes, and H. Thienpont, “Hot Embossing of Microoptical Components Prototyped by Deep Proton Writing,” IEEE Photonics Technol. Lett., vol. 20, no. 18, pp. 1539–1541, Sep. 2008. [4] H. Becker and U. Heim, “Hot embossing as a method for the fabrication of polymer high aspect ratio structures,” Sens. Actuators Phys., vol. 83, no. 1–3, pp. 130–135, May 2000. [5] 張哲豪, “流體微熱壓製程開發研究,” 國立臺灣大學博士論文, 台北市, 2004. [6] H. Gao, H. Tan, W. Zhang, K. Morton, and S. Y. Chou, “Air cushion press for excellent uniformity, high yield, and fast nanoimprint across a 100 mm field,” Nano Lett., vol. 6, no. 11, pp. 2438–2441, Nov. 2006. [7] 徐智楓, “合金化爐高週波感應加熱器特性分析與模擬,” 國立高雄應用科技大學碩士論文, 高雄市, 2011. [8] R. Bartolini, W. Hannan, D. Karlsons, and M. Lurie, “HOLOGRAPHY Embossed Hologram Motion Pictures for Television Playback,” Appl. Opt., vol. 9, no. 10, p. 2283, Oct. 1970. [9] E. W. Becker, W. Ehrfeld, P. Hagmann, A. Maner, and D. Münchmeyer, “Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic moulding (LIGA process),” Microelectron. Eng., vol. 4, no. 1, pp. 35–56, May 1986. [10] H. Becker and U. Heim, “Silicon as tool material for polymer hot embossing,” in Twelfth IEEE International Conference on Micro Electro Mechanical Systems, 1999. MEMS ’99, 1999, pp. 228–231. [11] M. Heckele and W. K. Schomburg, “Review on micro molding of thermoplastic polymers,” J. Micromechanics Microengineering, vol. 14, no. 3, p. R1, 2004. [12] K. Deguchi, N. Takeuchi, and A. Shimizu, “Evaluation of press-uniformity using a pressure sensitive film and calculation of wafer distortions caused by mold press in imprint lithography,” in Microprocesses and Nanotechnology Conference, 2001 International, 2001, pp. 100–101. [13] M. C. Lin, J. P. Yeh, S. C. Chen, R. D. Chien, and C. L. Hsu, “Study on the replication accuracy of polymer hot embossed microchannels,” Int. Commun. Heat Mass Transf., vol. 42, pp. 55–61, Mar. 2013. [14] Y. Zhao and T. Cui, “Fabrication of high-aspect-ratio polymer-based electrostatic comb drives using the hot embossing technique,” J. Micromechanics Microengineering, vol. 13, no. 3, pp. 430–435, May 2003. [15] A. Kolew, M. Heilig, M. Schneider, D. Münch, R. Ezzat, N. Schneider, and M. Worgull, “Hot embossing of transparent high aspect ratio micro parts,” Microsyst. Technol., vol. 20, no. 10–11, pp. 1967–1973, Dec. 2013. [16] J. H. Chang and S. Y. Yang, “Gas pressurized hot embossing for transcription of micro-features,” Microsyst. Technol., vol. 10, no. 1, pp. 76–80, Dec. 2003. [17] J. H. Chang and S. Y. Yang, “Development of fluid-based heating and pressing systems for micro hot embossing,” Microsyst. Technol., vol. 11, no. 6, pp. 396–403, Jun. 2005. [18] F. S. Cheng and S. Y. Yang, “Soft mold and gasbag pressure mechanism for patterning submicron patterns onto a large concave substrate,” J. Vac. Sci. Amp Technol. B - J VAC SCI TECHNOL B, vol. 24, no. 4, 2006. [19] F. S. Cheng and S. C. Nian, “Soft UV-Imprinting Using Gasbag Pressure Mechanism for Side-Direction and Non-Planar Substrate,” Adv. Mater. Res., vol. 189–193, pp. 4068–4072, Feb. 2011. [20] J. Jeong, K. Kim, Y. Sim, H. Sohn, and E. Lee, “A step-and-repeat UV-nanoimprint lithography process using an elementwise patterned stamp,” Microelectron. Eng., vol. 82, no. 2, pp. 180–188, Oct. 2005. [21] 楊申語, “創新行為光學增光分色片應用於CMOS影像感測器之研究,” 行政院國家科學委員會專題研究計畫, 2004. [22] 陳永坤, “雙面微溝槽之薄件射出成形研究,” 國立臺灣科技大學碩士論文, 台北市, 2005. [23] S. J. Liu and Y. C. Huang, “Manufacture of dual-side surface-relief diffusers with various cross angles using ultrasonic embossing technique,” Opt. Express, vol. 17, no. 20, pp. 18083–18092, Sep. 2009. [24] C. H. Chien and Z. P. Chen, “Design and fabrication of the concentric circle light guiding plate for LED-backlight module by MEMS technique,” Microsyst. Technol., vol. 13, no. 11–12, pp. 1529–1535, Jan. 2007. [25] D. Yao and B. Kim, “Development of rapid heating and cooling systems for injection molding applications,” Polym. Eng. Sci., vol. 42, no. 12, pp. 2471–2481, Dec. 2002. [26] D. Yao and B. Kim, “Injection molding high aspect ratio microfeatures,” J. Inject. Molding Technol., vol. 6, no. 1, pp. 11–17, 2002. [27] W. Liu, T. Kimerling, D. Yao, and B. Kim, “Rapid thermal response (RTR) hot embossing of micro-structures,” ANTEC Conf. Proc., vol. 1, pp. 933–936, 2004. [28] P. C. Chang and S. J. Hwang, “Experimental investigation of infrared rapid surface heating for injection molding,” J. Appl. Polym. Sci., vol. 102, no. 4, pp. 3704–3713, Nov. 2006. [29] P. C. Chang and S. J. Hwang, “Simulation of infrared rapid surface heating for injection molding,” Int. J. Heat Mass Transf., vol. 49, no. 21–22, pp. 3846–3854, Oct. 2006. [30] C. Lu, Y. J. Juang, L. J. Lee, D. Grewell, and A. Benatar, “Analysis of laser/IR-assisted microembossing,” Polym. Eng. Sci., vol. 45, no. 5, pp. 661–668, May 2005. [31] Q. Chen, L. Zhang, and G. Chen, “Far infrared-assisted embossing and bonding of poly(methyl methacrylate) microfluidic chips,” RSC Adv., vol. 4, no. 99, pp. 56440–56444, Oct. 2014. [32] M. C. Jeng, S. C. Chen, P. S. Minh, J. A. Chang, and C. Chung, “Rapid mold temperature control in injection molding by using steam heating,” Int. Commun. Heat Mass Transf., vol. 37, no. 9, pp. 1295–1304, Nov. 2010. [33] J. Kang, H. Kim, K. S. Kim, S. K. Lee, S. Bae, J. H. Ahn, Y. J. Kim, J. B. Choi, and B. H. Hong, “High-Performance Graphene-Based Transparent Flexible Heaters,” Nano Lett., vol. 11, no. 12, pp. 5154–5158, Dec. 2011. [34] U. Khan, T. H. Kim, K. H. Lee, J. H. Lee, H. J. Yoon, R. Bhatia, I. Sameera, W. Seung, H. Ryu, C. Falconi, and S. W. Kim, “Self-powered transparent flexible graphene microheaters,” Nano Energy, vol. 17, pp. 356–365, Oct. 2015. [35] P. Xie, P. He, Y. C. Yen, K. J. Kwak, D. Gallego-Perez, L. Chang, W. Liao, A. Yi, and L. J. Lee, “Rapid hot embossing of polymer microstructures using carbide-bonded graphene coating on silicon stampers,” Surf. Coat. Technol., vol. 258, pp. 174–180, Nov. 2014. [36] H. Li, P. He, J. Yu, L. J. Lee, and A. Y. Yi, “Localized rapid heating process for precision chalcogenide glass molding,” Opt. Lasers Eng., vol. 73, pp. 62–68, Oct. 2015. [37] S. C. Chen, “Device for advancing even distribution of high cycle wave magnetism,” US6919545 B2, 19-Jul-2005. [38] 范家瑞, “電磁感應技術應用於模具快速加熱系統,” 國立成功大學碩士論文, 台南市, 2008. [39] S. C. Chen, Y. W. Lin, R. D. Chien, and H. M. Li, “Variable mold temperature to improve surface quality of microcellular injection molded parts using induction heating technology,” Adv. Polym. Technol., vol. 27, no. 4, pp. 224–232, Dec. 2008. [40] M. S. Huang and N. S. Tai, “Experimental rapid surface heating by induction for micro-injection molding of light-guided plates,” J. Appl. Polym. Sci., vol. 113, no. 2, pp. 1345–1354, Jul. 2009. [41] M. S. Huang and Y. L. Huang, “Effect of multi-layered induction coils on efficiency and uniformity of surface heating,” Int. J. Heat Mass Transf., vol. 53, no. 11–12, pp. 2414–2423, May 2010. [42] S. C. Chen, W. R. Jong, Y. J. Chang, J. A. Chang, and J. C. Cin, “Rapid mold temperature variation for assisting the micro injection of high aspect ratio micro-feature parts using induction heating technology,” J. Micromechanics Microengineering, vol. 16, pp. 1783–1791, Sep. 2006. [43] S. C. Chen, W. R. Jong, and J. A. Chang, “Dynamic mold surface temperature control using induction heating and its effects on the surface appearance of weld line,” J. Appl. Polym. Sci., vol. 101, no. 2, pp. 1174–1180, Jul. 2006. [44] E. Roland, P. Damien, F. José, and H. Rémi, “3D inductive phenomena modeling,” Proceedings of the COMSOL Users Conference, 2006. [45] S. K. Hong, Y. M. Heo, and J. Kang, “Replication of polymeric micro patterns by rapid thermal pressing with induction heating apparatus,” in 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, 2008. NEMS 2008, 2008, pp. 911–915. [46] J. Yanagimoto and K. Ikeuchi, “Sheet forming process of carbon fiber reinforced plastics for lightweight parts,” CIRP Ann. - Manuf. Technol., vol. 61, no. 1, pp. 247–250, 2012. [47] A. Rochman, A. Frick, and P. Martin, “An alternative method for processing high viscosity polymers. I. Development and feasibility study,” Polym. Eng. Sci., vol. 52, no. 10, pp. 2114–2121, Oct. 2012. [48] T. J. Ahmed, D. Stavrov, H. E. N. Bersee, and A. Beukers, “Induction welding of thermoplastic composites—an overview,” Compos. Part Appl. Sci. Manuf., vol. 37, no. 10, pp. 1638–1651, Oct. 2006. [49] 蔡宗鴻, “感應加熱技術輔助微結構熱壓印成形之研究,” 國立高雄第一科技大學碩士論文, 高雄市, 2013. [50] P. Robert, Electrical and Magnetic Properties of Materials. Norwood, MA:Artech House Publishers, 1988. [51] S. L. Semiatin, Elements of Induction Heating: Design, Control, and Applications. ASM International, 1988. [52] 王尊信, “磁滯曲線,” 科學online, 23-Jun-2011. . [53] 蘇卓盛, “應用於感應加熱的負載並聯共振電流型反流器設計與研製,” 中原大學碩士論文, 桃園縣, 2003. [54] 沈文揚, “外周包覆式磁場感應加熱應用於模具快速加熱之研究,” 中原大學碩士論文, 桃園縣, 2010. [55] V. Rudnev, D. Loveless, R. L. Cook, and M. Black, Handbook of Induction Heating. CRC Press, 2002. [56] 許國展, “應用於感應加熱的負載串聯共振電壓型反流器設計與研製,” 中原大學碩士論文, 桃園縣, 2002. [57] 楊學安, “電磁感應渦電流於微機電系統之分析與應用,” 國立清華大學博士論文, 新竹市, 2005. [58] K. Zakrzewski and F. Pietras, “Method of calculating the electromagnetic field and power losses in ferromagnetic materials, taking into account magnetic hysteresis,” Proc. Inst. Electr. Eng., vol. 118, no. 11, pp. 1679–1685, Nov. 1971. [59] S. N. Talukdar and J. R. Bailey, “Hysteresis models for system studies,” IEEE Trans. Power Appar. Syst., vol. 95, no. 4, pp. 1429–1434, Jul. 1976. [60] 孫振峰, “金屬材質特性影響渦電流非破壞性檢測之研究分析與應用,” 國立高雄應用科技大學碩士論文, 高雄市, 2005. [61] D. C. Turner, J. Lawton, P. Dollenmeier, R. Ehrismann, and M. Chiquet, “Guidance of myogenic cell migration by oriented deposits of fibronectin,” Dev. Biol., vol. 95, no. 2, pp. 497–504, Feb. 1983. [62] D. M. Thompson and H. M. Buettner, “Schwann Cell Response to Micropatterned Laminin Surfaces,” Tissue Eng., vol. 7, no. 3, pp. 247–265, Jun. 2001. [63] M. H. Hartmann and N. Whiteman, “TAPPI Polymers, Laminations, & Coatings Conference,” Chicago, IL, United States, pp. 467–474, 2000. | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/78137 | - |
dc.description.abstract | 雙面微結構其光學性質及適用性又較單面微結構來的優異,在微結構的複製上,熱壓印成型為常用的製程技術,其具有製程步驟簡單及轉寫率高的優勢,常被用來複製高分子光學元件表面微結構。傳統熱壓印成型有二大問題:一是板壓,容易造成壓力分佈不均;二是升降溫耗時,成型週期過長,如何開發快速加熱冷卻且能均勻施壓製作雙面微結構光學元件是一大挑戰。本研究以包覆式感應加熱技術使雙片模仁快速升溫,加上氣體等向施壓達到壓力平均之目的,開發一結合感應加熱氣體輔助雙面熱壓設備。
本研究首先利用COMSOL分析軟體進行包覆式線圈對於不同模具面積的加熱模擬,觀察此包覆式線圈設計對模具的加熱情形,並配合實驗進行驗證。分析結果顯示,隨著面積的增加,感應電流密度也隨之增加使升溫速率提升,其與實驗結果相當符合,在50 mm × 50 mm的面積下,升溫速率最快可達到13.2°C/s且實驗之溫差可控制在20°C以內,證明此線圈設計可達到良好的溫度均勻性。本研究接著將此包覆式線圈與氣體輔助熱壓製程結合,設計製作可快速加熱且具備雙面氣體均勻施壓之設備,實驗結果顯示本文所設計之設備能將整體熱壓印製程時間縮短至4分鐘以內,與傳統熱壓20分鐘以上的製程時間相較,製程週期大幅縮短。 在實際應用上,此製程能完整複製雙面50 mm × 50 mm微奈米結構於PC、COP、PLA基材表面,V型溝槽及奈米結構皆有95%以上的轉寫率,微透鏡陣列的轉寫更能達到97%以上的轉寫率。本研究證明高週波感應快速加熱與氣體均勻施壓應用於壓印複製雙面微奈米結構的可行性與性能。 | zh_TW |
dc.description.abstract | Components with microstructures on double sides have better optical properties and functions than those with microstructures on single side. In the replication of microstructures, hot embossing is an inexpensive and flexible fabrication method for replication of micro/nano structures on polymer. However, there are two inherent problems in the conventional hot embossing process. First, the embossing pressure provided by plates is not uniform.Second, the heating by the plates causes long cycle time. How to develop a rapid heating and cooling system to replicate high-performance double-sided optical elements is a challenge. This study is devoted to developing a rapid heating system which integrates induction heating and gas-assisted pressuring to hot embossing process for replicating micro/nano structures on polymeric both sides of substrates.
In this study, induction heating using wrapped coils is employed to heat metallic molds. The temperature rise and distribution on various areas were first simulated and analyzed with CAE software COMSOL. Coil induction heater was then implemented and tested. Both the experiments and simulations showed that the density of induction current and the heating rate increase with the mold area. In 50 mm × 50 mm sample, the heating rate can reach 13.2°C/s, and the temperature variation is 20°C, showing the good uniformity of this system. A facility to integrate induction heating and gas pressuring for hot embossing was designed and constructed in a chamber. Experiments showed that the cycle time can be reduced to 4 minutes. The inducton heating gas-assisted embossing successfully replicated doubled-sided V-cut, microlens array and nanostructures on 50 mm × 50 mm PC, COP, PLA substrates with a replication rate above 95%. This study proves the potential of induction heating gas-assisted embossing for rapid replication of double-sided micro/nano structures for industial applications. | en |
dc.description.provenance | Made available in DSpace on 2021-07-11T14:43:26Z (GMT). No. of bitstreams: 1 ntu-105-R03522701-1.pdf: 8707775 bytes, checksum: e73eb24f22ef22cb67f0b7e52ac7a6b1 (MD5) Previous issue date: 2016 | en |
dc.description.tableofcontents | 致謝 i
摘要 iii Abstract iv 目錄 v 圖目錄 ix 表目錄 xvi 第一章 導 論 1 1.1 前言 1 1.2 傳統微熱壓成型 3 1.3 流體微熱壓成型 7 1.4 加熱技術 9 1.5 感應加熱於塑膠成型之應用 10 1.6 研究動機與目的 11 1.7 論文架構 12 第二章 文獻回顧 14 2.1 微熱壓成型與氣體輔助熱壓技術 14 2.2 雙面微結構成型 20 2.3 快速加熱系統 23 2.3.1 薄膜電阻加熱技術 23 2.3.2 紅外線加熱技術 25 2.3.3 蒸氣加熱技術 28 2.3.4 石墨烯快速加熱技術 30 2.3.5 高週波感應加熱技術 33 2.4 感應加熱原理 42 2.4.1 電磁感應 42 2.4.2 焦耳定律、歐姆定律與電功率 44 2.4.3 焦耳效應(Joule Effect) 45 2.4.4 集膚效應(Skin Effect) 47 2.4.5 鄰近效應(Proximity Effect) 50 2.4.6 邊界效應 51 2.5 綜合歸納 54 第三章 感應加熱氣輔熱壓製程研究規劃 55 3.1 研究架構 55 3.2 高週波感應產生器模組 59 3.3 感應加熱氣體輔助熱壓實驗 61 3.3.1 感應加熱氣輔熱壓步驟簡介 61 3.3.2 感應熱壓腔體設計與線圈架設 63 3.3.3 耐高溫矽膠袋 66 3.4 實驗材料與量測儀器 67 3.4.1 壓印模具 67 3.4.2 壓力量測設備 72 3.4.3 紅外線熱顯像儀 73 3.4.4 熱電偶溫度資料擷取器 75 3.4.5 3D雷射共焦顯微鏡 76 3.4.6 掃描式電子顯微鏡(SEM) 79 3.4.7 表面粗度量測儀 80 第四章 模具升溫模擬與感應加熱設備效能探討 81 4.1 感應加熱模擬分析 81 4.1.1 COMSOL軟體模擬分析理論 81 4.1.2 COMSOL軟體模擬分析流程 83 4.1.3 感應加熱模擬建置 85 4.1.4 模擬結果 88 4.2 感應加熱溫度探討 93 4.2.1 溫度探討實驗設置 93 4.2.2 上、下模具升溫趨勢量測 96 4.2.3 不同面積之溫度探討 97 4.3 感應加熱升溫速率探討 102 4.3.1 升溫速率量測模組設置 102 4.3.2 微結構形貌對升溫速率的影響 107 4.3.3 單、雙片模具對升溫速率的影響 110 4.3.4 不同機台輸出功率對升溫速率的影響 112 4.3.5 模具厚度與感應溫度的關係 113 4.4 模擬結果與實驗量測之比較 115 4.5 本章結論 118 第五章 感應加熱氣體輔助壓印探討與應用 119 5.1 熱壓製程壓力均勻性探討 119 5.2 不同尺度結構之熱壓參數探討 122 5.2.1 感應加熱氣體輔助熱壓製程實驗規劃 123 5.2.2 微米結構-微透鏡陣列壓印探討 125 5.2.3 微米結構-V型溝槽( V-cut )壓印探討 129 5.2.4 奈米結構-錐狀壓印探討 133 5.2.5 奈米結構-柵狀結構壓印探討 138 5.3 不同高分子材料之壓印探討與其相關應用 141 5.3.1 不同材料壓印之實驗規劃 141 5.3.2 微透鏡陣列壓印於聚碳酸酯 142 5.3.3 V型溝槽壓印於環烯烴聚合物 145 5.3.4 V型溝槽壓印於聚乳酸 149 5.4 本章結論 153 第六章 結論與未來展望 154 6.1 結論 154 6.2 未來展望 154 參考文獻 156 | |
dc.language.iso | zh-TW | |
dc.title | 高週波感應快速加熱與氣體均勻施壓應用於壓印複製雙面微結構製程開發 | zh_TW |
dc.title | Imprinting of double-sided microstructures with rapid induction heating and gas-assisted pressuring | en |
dc.type | Thesis | |
dc.date.schoolyear | 104-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 張復瑜(Fuh-Yu Chang),粘世智(Shih-Chih Nian),廖先順(Hsien-Shun Liao) | |
dc.subject.keyword | 氣體輔助熱壓印成型,感應加熱,成型週期,雙面微結構複製, | zh_TW |
dc.subject.keyword | Induction hot embossing,Hot embossing,Induction heating, | en |
dc.relation.page | 159 | |
dc.identifier.doi | 10.6342/NTU201602290 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2016-08-11 | |
dc.contributor.author-college | 工學院 | zh_TW |
dc.contributor.author-dept | 機械工程學研究所 | zh_TW |
顯示於系所單位: | 機械工程學系 |
文件中的檔案:
檔案 | 大小 | 格式 | |
---|---|---|---|
ntu-105-R03522701-1.pdf 目前未授權公開取用 | 8.5 MB | Adobe PDF |
系統中的文件,除了特別指名其著作權條款之外,均受到著作權保護,並且保留所有的權利。