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標題: | 中介層與熱處理對氮化鋁鈦顯微結構分析 Analysis of Microstructure Evolution of RF Sputtered Ti1(subscript -x)Al(subscript x)N Affected by Intermediate Layer and Heat Treatment |
作者: | "Liu, Iu-Hsien" 劉祐銜 |
指導教授: | 楊哲人 |
關鍵字: | 氮化鋁鈦,電子顯微鏡,磁控濺鍍,奈米硬度,原子力顯微鏡, TiAlN,TEM,RF sputtering,nano-hardness,AFM, |
出版年 : | 2007 |
學位: | 碩士 |
摘要: | 本研究乃是運用射頻磁控濺鍍系統,將欲成長的兩種保護性硬魔之薄膜結構:碳化鎢及矽基板 -氮化鋁鈦,以及碳化鎢及矽基板-氮化鋁(中介層)-氮化鋁鈦,以反應性濺鍍的方式成長。相對於真空電弧鍍膜,射頻磁控濺鍍的優點在於擁有較佳的表面平整度,且可精確控制薄膜厚度,有較一致性的披覆效果,且對於基板有較佳的附著性。
氮化鋁鈦的鋁濃度範圍為不小於70%。在這兩種薄膜結構成長完成之後,施予不同溫度下的真空退火處理,使其產生相變化。而在退火前後的硬度、附著力、表面粗糙度等則分別藉由奈米硬度機、刮痕試驗機、原子力顯微鏡量測之。 構橫切面電子顯微鏡術可以詳細的研究整個薄膜的微結構的轉變以及介面接合區,本研究以高解析電子顯微鏡詳細研究薄膜結構的變化,並將觀察結果連結到機械性質。 In this investigation, the two different hard protective thin film structures: TiAlN/Si&WC and TiAlN/AlN/Si&WC are deposited by RF sputtering system. The advantages of sputtering system is lower surface roughness, higher adhesion and more precise in film thickness than that of arc deposition system. The concentration of aluminum is no less than 70%. After depositing these two different film structures, these samples will be annealed at different temperature in vacuum. The mechanical properties of these films such as hardness, adhesion, surface roughness are measured by nano-indentation, scratch test and atomic force microscopy respectively. XTEM (cross-section transmission electron microscopy) can study the evolution of the microstructure and the interface regions of the films precisely. In this study, the evolution of the microstructure and the interface regions will be investigated by high- resolution transmission electron microscopy (HRTEM), and the result will be related to the mechanical properties. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/29277 |
全文授權: | 有償授權 |
顯示於系所單位: | 材料科學與工程學系 |
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