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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 楊哲人 | |
| dc.contributor.author | "Liu, Iu-Hsien" | en |
| dc.contributor.author | 劉祐銜 | zh_TW |
| dc.date.accessioned | 2021-06-13T01:03:46Z | - |
| dc.date.available | 2007-07-27 | |
| dc.date.copyright | 2007-07-27 | |
| dc.date.issued | 2007 | |
| dc.date.submitted | 2007-07-24 | |
| dc.identifier.citation | 1 Roland Hauert, Jörg Patscheider, Advanced Engineering Materials 2 No. 5 (2000)
247 2 S. Paldey, S.C. Deevi, Materials Science and Engineering A342 (2003) 58 3 A. Escudeiro Santana, A. Karimi, V.H. Derflinger, A. Schqtze, Thin Solid Films 469-470 (2004) 339 4 O. Knotek, Materials Science and Engineering A105/106 (1988) 481 5 D. McIntyre, J.E. Greene, G. H3kansson, J.E. Sundgren, W.-D. Mqnz, Journal of applied physics 67 (3) (1990) 1542 6 P.Eh. Hovsepian, D.B. Lewis, Q. Luo, W.-D. Mu¨nz, P.H. Mayrhofer, C. Mitterer, Z. Zhou, W.M. Rainforth, Thin Solid Films 485 (2005) 160 7 Ayako Kimura, Masahiro Kawate, Hiroyuki Hasegawa, Tetsuya Suzuki, Surface and Coatings Technology 169 –170 (2003) 367 8 A. Hörling, L. Hultman, M. Ode´n, J. Sjöle´n, L. Karlsson, Journal of Vacuum Science and Technology A20.5 Sep/Oct (2002) 1815 9 J.M. Cairney, S.G. Harris, P.R. Munroea, E.D. Doyleb, Surface and Coatings Technology 183 (2004) 239 10 B. Chapman, “Glow Discharge Processes”, A Wiley-Interscience Publication, N.Y., 1980 11 Milton Ohring, Materials Science of Thin Films: Deposition and Structure, 2nd Edition, Academic Press, 2002 12 S. M. Rossnagel, Handbook of Plasma Processing Technology, Noyes Publications, Park Ridge, New Jersey, USA ,1989 13 翁睿哲, 以射頻磁控濺鍍氮化鉭薄膜製程條件對顯微結構及電性影響之研究, 成大碩士論文, 2001 14 陳建人 發行, 真空技術與應用, 全華科技圖書公司, 2001 15 莊達人 編著, VLSI製造技術, 高立圖書有限公司, 1995 16 John A. Thornton, Annual Review of Materials Science 7 (1977) 239 17 O. Knotel, T. Leyendecker, Journal of Solid State Chemistry 70 (1987) 318 18 L. Hultman, Vacuum 57 (2000) 1 19 D.A. Porter, K.E. Easterling, Phase Transformations in Metals and Alloys, 2nd Edition, CRC Press, 1992 20 IUPAC Compendium of Chemical Terminology 2nd Edition, 1997 21 K.L. Weng, H.R. Chen, J.R. Yang, Materials Science and Engineering A 379 (2004) 119–132 22 Fan-bean Wu, Wei-yu Chen, Jenq-gong Duh, Yi-ying Tsai, Yuan-i Chen, Surface and Coatings Technology 163 –164 (2003) 227 23 徐偉倫, 離子佈植矽單晶之退火奈米雙晶組織研究, 台大碩士論文, 2005 24 Seong-Min Jeong, Po-Wan Shum, Yao-Gen Shen, Kwok-Yan Li, Yiu-Wing Mai, Hong-Lim Lee, Japanese Journal of Applied Physics 45 8A (2006) 6411 25 S.J. Bull, Adhesion Measurement of Films and Coatings, Vol. 2, K.L. Mittal, Ed.2001 26 Robert Lacombe, Adhesion Measurement Methods, Theory and Practice, CRC Press, Taylor & Francis Group, 2006 | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/29277 | - |
| dc.description.abstract | 本研究乃是運用射頻磁控濺鍍系統，將欲成長的兩種保護性硬魔之薄膜結構：碳化鎢及矽基板 -氮化鋁鈦，以及碳化鎢及矽基板-氮化鋁（中介層）-氮化鋁鈦，以反應性濺鍍的方式成長。相對於真空電弧鍍膜，射頻磁控濺鍍的優點在於擁有較佳的表面平整度，且可精確控制薄膜厚度，有較一致性的披覆效果，且對於基板有較佳的附著性。
氮化鋁鈦的鋁濃度範圍為不小於70%。在這兩種薄膜結構成長完成之後，施予不同溫度下的真空退火處理，使其產生相變化。而在退火前後的硬度、附著力、表面粗糙度等則分別藉由奈米硬度機、刮痕試驗機、原子力顯微鏡量測之。 構橫切面電子顯微鏡術可以詳細的研究整個薄膜的微結構的轉變以及介面接合區，本研究以高解析電子顯微鏡詳細研究薄膜結構的變化，並將觀察結果連結到機械性質。 | zh_TW |
| dc.description.abstract | In this investigation, the two different hard protective thin film structures: TiAlN/Si&WC and TiAlN/AlN/Si&WC are deposited by RF sputtering system. The advantages of sputtering system is lower surface roughness, higher adhesion and more precise in film thickness than that of arc deposition system.
The concentration of aluminum is no less than 70%. After depositing these two different film structures, these samples will be annealed at different temperature in vacuum. The mechanical properties of these films such as hardness, adhesion, surface roughness are measured by nano-indentation, scratch test and atomic force microscopy respectively. XTEM (cross-section transmission electron microscopy) can study the evolution of the microstructure and the interface regions of the films precisely. In this study, the evolution of the microstructure and the interface regions will be investigated by high- resolution transmission electron microscopy (HRTEM), and the result will be related to the mechanical properties. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-13T01:03:46Z (GMT). No. of bitstreams: 1 ntu-96-R94527010-1.pdf: 18334258 bytes, checksum: b9208017d6b6c20c06a46c283c9c3532 (MD5) Previous issue date: 2007 | en |
| dc.description.tableofcontents | Contents
論文口試委員審定書 i 誌謝 ii 中文摘要 iii Abstract iv 圖目錄 viii 表目錄 xiv Chapter 1 Introduction 1 Chapter 2 Research background 9 2-1 Plasma 9 2-2 Sputtering 11 2-2-1 DC Sputtering 11 2-2-2 RF Sputtering 12 2-2-3 Reactive Sputtering 13 2-2-4 Magnetron Sputtering 14 2-2-5 Substrate Bias Voltage Effect 15 2-3 Mechanism of Nucleation and Growth of Film 17 2-4 Microstructure of Film 20 2-5 Crystal Structure of TiAlN 22 2-6 Spinodal Decomposition 23 Chapter 3 Experiment 37 3-1 Experiment Procedures 37 3-2 Material Selections 38 3-3 Substrate Pretreatment 38 3-4 Facility of Sputtering 39 3-5 Sputtering Processes and Parameters 39 3-6 Heat Treatments 40 3-7 Microstructure Analysis 41 3-7-1 AFM 41 3-7-2 TEM 41 3-8 Chemical Composition Analysis 45 3-9 Mechanical Properties Test 45 3-9-1 Nano-Hardness Test 45 3-9-2 Adhesion Test 48 Chapter 4 Analyses of the nano-structure TixAl1-xN films 59 4-1 TixAl1-xN mono layer / Silicon substrate 59 4-1-1 Chemical analysis 59 4-1-1-1 EPMA 59 4-1-1-2 EDS(TEM) 59 4-1-2 Microstructure analysis 60 4-1-2-1 TEM 60 4-1-2-1-1 Overview 60 4-1-2-1-2 Column crystals 61 4-1-2-1-3 Interfaces 63 4-1-2-2 AFM 64 4-1-3 Mechanical properties analysis 65 4-1-3-1 Hardness 65 4-1-3-2 Scratch 65 4-2 TixAl1-xN / AlN buffer layer / Silicon substrate 66 4-2-1 Chemical analysis 66 4-2-1-1 EDS(TEM) 66 4-2-2 Microstructure analysis 66 4-2-2-1 TEM 66 4-2-2-1-1 Overview 66 4-2-2-1-2 Column crystals 67 4-2-2-1-3 Interfaces 67 4-2-2-3 AFM 69 4-2-3 Mechanical properties analysis 69 4-2-3-1 Hardness 69 4-2-3-2 Scratch 69 4-3 Summary 70 Chapter 5 Conclusions 98 Chapter 6 Future works 100 Chapter 7 Appendix 101 References 103 | |
| dc.language.iso | en | |
| dc.title | 中介層與熱處理對氮化鋁鈦顯微結構分析 | zh_TW |
| dc.title | Analysis of Microstructure Evolution of RF Sputtered Ti1(subscript -x)Al(subscript x)N Affected by Intermediate Layer and Heat Treatment | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 95-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 林新智,王星豪,蕭健男 | |
| dc.subject.keyword | 氮化鋁鈦,電子顯微鏡,磁控濺鍍,奈米硬度,原子力顯微鏡, | zh_TW |
| dc.subject.keyword | TiAlN,TEM,RF sputtering,nano-hardness,AFM, | en |
| dc.relation.page | 105 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2007-07-24 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
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