探討多個平行放置熱管於多重熱源與單一冷卻塊下之熱傳表現

Abstract

本研究欲探討多個平行放置的扁平熱管於多重熱源與單一冷卻塊下之熱傳表現。隨著對高效能運算的需求不斷增長，安裝多個矽晶片於電子設備中已成為一項高要求且不可避免的挑戰，而透過在冷卻設備上適當分佈總加熱功率可以增強電子設備的散熱能力。研究將熱管之熱傳性能分為兩個部分來探討，分別為不同數量的平行放置熱管以及不同配比下輸入功率分佈對熱管熱傳性能的影響。實驗採用扁平熱管作為測試樣本，其毛細結構為燒結銅粉而工作流體為去離子水。實驗結果表明，平行放置情況下的熱管熱阻值與單一支熱管條件下的熱阻值相比，其存在差異。此外，在兩支和三支熱管平行放置的情況下，結果指出，以不同比例分配每支熱管上的輸入功率是至關重要的，並對熱管上之最高溫度有顯著影響。為了減低運作期間熱管上的最高溫度，本研究提出了輸入功率配置的建議，透過調控每支熱管總輸入功率的比例，以提升熱管的散熱能力。

This study experimentally investigated the thermal performance of parallel-placed flat heat pipes with multiple heat sources and a single cooling section. As the demand for high-performance computing continues to rise, the installation of multiple silicon chips in electronic devices becomes both demanding and inevitable. Achieving a suitable arrangement of total heating power on cooling devices can enhance thermal management in electronic devices. In this paper, the investigation of the thermal performance of the heat pipes is divided into two parts. The first part explores the effect of different numbers of parallel-placed heat pipes, while the second part examines the influence of input power distribution on the heat pipes at different ratios. Flat heat pipes were utilized as test samples in experiments, incorporating sintered copper powder as the wick structure and DI water as the working fluid. The experimental results revealed that the thermal resistance of a heat pipe among parallel-placed heat pipes differs from that of a single heat pipe condition. Additionally, under the conditions of two and three parallel-placed heat pipes, the results indicated that the distribution of input power on each heat pipe in different ratios is critical and has a significant impact on the measured maximum temperature among the heat pipes. To reduce the maximum temperature on heat pipes during operation, a guideline for input power arrangements was proposed. Improved thermal management of heat pipes can be realized by manipulating the proportions of the total input power to each heat pipe.