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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/81364完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 韋文誠(Wen-Cheng Wei) | |
| dc.contributor.author | Wei-Cheng Li | en |
| dc.contributor.author | 李偉丞 | zh_TW |
| dc.date.accessioned | 2022-11-24T03:45:40Z | - |
| dc.date.available | 2022-07-14 | |
| dc.date.available | 2022-11-24T03:45:40Z | - |
| dc.date.copyright | 2021-08-06 | |
| dc.date.issued | 2021 | |
| dc.date.submitted | 2021-07-14 | |
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/81364 | - |
| dc.description.abstract | 本研究利用擠出成型(extrusion)製程，使用將多成分氧化物漿料進行線材及圖形之2D擠出列印。使用無鹼(alkali-free)玻璃作為基板及填充劑，將複合漿料中氧化銅、氧化鎳還原後，形成金屬導線及熱電偶，分別應用於固態燃料電池之電流收集器及溫度偵測器。研究中先進行廢棄無鹼玻璃的基本性質測試，SEM+EDS與XRD分析玻璃基板之成分及晶相，再以DSC及潤濕角(wetting angle)測試基板之熱分析，並利用TMA確認其熱膨脹係數(CTE)。其次是建立漿料成分設計，氧化物漿料先進行沉降試驗及測量界面電位，找尋適當分散劑及漿料比率，並分析高固含量漿料之流變(黏彈性)行為。漿料之降伏剪切應力，均控制超過500 Pa，使漿料經擠出後可維持形狀。透過改變製程參數改善燒結行為並以四點探針法測量銅、鎳基導線的中、高溫電導率及Seebeck係數。銅基導線在700 oC下之導電率皆超過SOFC電流收集器所需之0.1×104 S·cm-1。此外製作之Cu-Cu11Ni熱電偶在650 oC時之Seebeck係數為0.059 mV/oC，代表具有良好的靈敏度。最後將印刷之導線進行高溫氧化測試並分析其氧化機制。三種線材均由介面化學反應控制，其中鎳基線材有最低的氧化速率及最高之活化能，代表鎳材比起其他兩種線材具有抵抗高溫氧化的優勢。 | zh_TW |
| dc.description.provenance | Made available in DSpace on 2022-11-24T03:45:40Z (GMT). No. of bitstreams: 1 U0001-1407202100414300.pdf: 10141560 bytes, checksum: 7076c1dbb3815eb1a42d10f02b70b4ef (MD5) Previous issue date: 2021 | en |
| dc.description.tableofcontents | 口試委員審定書 I 摘要 III Abstract IV Contents VI List of Figures IX List of Tables XVI Chapter 1 Introduction 1 Chapter 2 Literature Review 5 2.1 Introduction of Direct Ink Writing 5 2.2 Rheology of Paste 11 2.2.1 Properties of Fluids 11 2.2.2 Rheological Behavior of Paste 12 2.2.3 Extrusion Behavior of DIW Paste 14 2.3 Applications of Printed Electronics 19 2.3.1 Conductive Cu Paste 19 2.3.2 Printed Temperature Sensor 21 Chapter 3 Experimental Procedure 24 3.1 Materials 24 3.2 Preparation and Extrusion of Pastes 24 3.3 Sintering Procedure of Extrusion Patterns 25 3.4 Property Characterization 26 3.4.1 Sedimentation Test 26 3.4.2 DSC Analysis 27 3.4.3 SEM Analysis 27 3.4.4 Wetting Angle Measurement 28 3.4.5 X-ray Diffraction Analysis 28 3.4.6 Rheology Test 28 3.4.7 Thermomechanical Analysis 29 3.4.8 Zeta-potential Measurement 29 3.4.9 Electrical Conductivity Measurement 30 3.4.10 Thermopotential Measurement 30 3.4.11 Oxidation Resistance Test 31 Chapter 4 Results and Discussion 36 4.1 Properties of GC Glass 36 4.1.1 Element Analysis of GC Glass 36 4.1.2 Thermal Properties of GC Glass 37 4.1.3 Wetting Behavior of GC Glass 38 4.1.4 Sintering Behavior of GC pellet 39 4.2 Rheology of Extrusion Paste 53 4.2.1 Dispersion Properties 53 4.2.2 Rheology of Extruded Paste 54 4.2.3 Working Window of Paste Extrusion 57 4.3 Properties of Extruded Patterns 74 4.3.1 Sintering Behavior of Wires 74 4.3.2 Improvement of Sintering Schedule 75 4.3.3 Conductivity of Sintered Wires 77 4.3.4 Seebeck Coefficient of Extruded Thermocouples 80 4.4 Long-term Test of Extruded Samples 104 4.4.1 Microstructure of Oxide Layer of Testing Wires 104 4.4.2 Oxidation Analysis of Extruded Wires 105 4.4.3 Activation Energy of Oxidation Test 105 4.4.4 Long-term Test of Extruded Thermocouple 107 Chapter 5 Conclusions 117 Reference 120 Appendix 129 | |
| dc.language.iso | en | |
| dc.subject | 導電性 | zh_TW |
| dc.subject | 熱電位 | zh_TW |
| dc.subject | 銅 | zh_TW |
| dc.subject | 鎳 | zh_TW |
| dc.subject | 溫度感測器 | zh_TW |
| dc.subject | 電流收集器 | zh_TW |
| dc.subject | temperature sensor | en |
| dc.subject | conductivity | en |
| dc.subject | Cu | en |
| dc.subject | Ni | en |
| dc.subject | current collector | en |
| dc.subject | thermopotential | en |
| dc.title | 以2D列印法製作銅、鎳基導線及其溫度感測器之研究 | zh_TW |
| dc.title | Study on Fabrication of Copper and Nickel-based Wires and Temperature Sensors by 2D Printing | en |
| dc.date.schoolyear | 109-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 謝宗霖(Hsin-Tsai Liu),趙基揚(Chih-Yang Tseng) | |
| dc.subject.keyword | 電流收集器,鎳,銅,導電性,熱電位,溫度感測器, | zh_TW |
| dc.subject.keyword | current collector,Ni,Cu,conductivity,thermopotential,temperature sensor, | en |
| dc.relation.page | 136 | |
| dc.identifier.doi | 10.6342/NTU202101452 | |
| dc.rights.note | 同意授權(限校園內公開) | |
| dc.date.accepted | 2021-07-15 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
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