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Publication Year	Title	Author(s)	Department
2012	17-4PH不銹鋼之乾壓燒結製程研究 Press-and-Sinter Process of 17-4PH Stainless Steels	Chi-Kin Cheong; 張子健	材料科學與工程學研究所
2022	17-7 析出硬化型半沃斯田鐵系不銹鋼之相分析與機械性能之探討 Investigations on phase identification and mechanical properties of 17-7 precipitate-hardened semi-austenitic stainless steel	林忠威; Jhong-Wei Lin	材料科學與工程學系
2024	17-7 析出硬化型半沃斯田鐵系不鏽鋼相變態特性及顯微組織研究 The characteristics of phase transformation and microstructure in 17-7 precipitate-hardened semi-austenitic stainless steel	游雨蓁; Yu-Jhen You	材料科學與工程學系
2023	17-7半沃斯田鐵系析出硬化型不鏽鋼之熱處理對顯微結構及機械性質之影響 Impact of heat treatments on microstructure and mechanical properties in 17-7 semi-austenitic precipitation stainless steel	林冠名; Guan-Ming Lin	材料科學與工程學系
2011	1~10莫耳百分比氧化錫添加之氧化鉍作為固態電解質之研究 Investigation of 1~10 mol% SnO2-doped Bi2O3 as Solid Electrolyte	Tzu-Chi Kuo; 郭子期	材料科學與工程學研究所
2022	2024-T3鋁合金前處理與鋯化成處理之研究 A Study of Pretreated and Zirconium Conversion Coated 2024-T3 Aluminum Alloy	Guan-Ting Shen; 沈冠廷	材料科學與工程學研究所
2024	2024-T3鋁合金稀土金屬化成處理與抗蝕性之研究 The Corrosion Resistance of Rare-Earth Metal Conversion Coating on Aluminum Alloy 2024-T3	郭詠竹; Yung-Chu Kuo	材料科學與工程學系
2005	2205雙相不銹鋼銲件應力腐蝕與腐蝕疲勞特性研究 The Stress Corrosion Cracking and Corrosion Fatigue of Duplex Stainless Steel Weldments	Ming-Chung Young; 楊明宗	材料科學與工程學研究所
2006	2507雙相不銹鋼添加氮氣雷射銲件之顯微組織與腐蝕性研究 The investigation of microstructure and corrosion properties with adding nitrogen in laser welding of 2507 duplex stainless steels	Chia-Ling Liu; 劉家伶	材料科學與工程學研究所
2013	301不銹鋼及其雷射銲件經輥軋後之內部氫脆研究 Internal Hydrogen Embrittlement of 301 Stainless Steel and its Laser Welds after Rolling	Chieh Yu; 于傑	材料科學與工程學研究所
2023	309不銹鋼鋼胚均質化處理之研究 The Study of Homogenization 309 Stainless Cast Billet.	吳敏彰; Min-Chang Wu	材料科學與工程學系
2012	316L與A508鋼材之疲勞裂縫特性研究 The Study of Fatigue Crack Characteristics of 316L and A508 Steels	Yueh-Hsuan Tsai; 蔡岳軒	材料科學與工程學研究所
2012	3D IC 封裝中接點空間受限誘發之界面反應關鍵效應 Critical Issues in Soldering Reactions Arising from Space Confinement in 3D IC Packages	Hsin-Yi Chuang; 莊鑫毅	材料科學與工程學研究所
2014	3D IC 封裝中銅基材與無鉛銲料接點之介面反應 Interfacial Reactions Between Cu Substrates and Lead Free Solder for 3D IC Applications	Meng-Hsin Chen; 陳孟歆	材料科學與工程學研究所
2013	3D IC 微銲點與不同基材之介面反應與機械性質研究 Interfacial Reactions and Mechanical Properties of 3D IC Micro-joints with Different Substrates	Yu-Jen Chen; 陳郁仁	材料科學與工程學研究所
2012	3D IC應用中鎳基材與無鉛銲料之界面反應 Interfacial Reaction between Ni Substrate and Lead Free Solder for 3D IC Application	Mei-Shih Kuo; 郭楣詩	材料科學與工程學研究所
2012	3D-IC 封裝鎳/銦及鎳/錫凸塊接合界面研究 Study on the Bonding Interfaces of Ni/In and Ni/Sn Bumps in 3D-IC Packages	Chun-Yen Lee; 李俊彥	材料科學與工程學研究所
2019	3D列印支架結構設計與應力分析 Structure design and stress analysis of 3D printing scaffold	Chih-Chi Hsu; 許智齊	材料科學與工程學研究所
2018	3D列印銅基合金之材料性質分析與擠出模擬 Analysis of Material Properties of Copper-Based Alloy by 3D Printing and Modelling of Melt-Extrusion (ME)	Yi-Ting Huang; 黃怡婷	材料科學與工程學研究所
2011	(4,5-diaza-9,9’-spirobifluorene)官能基共軛寡聚物界面改質劑用於反式P3HT:TiO2 異質混摻太陽能電池之研究 Development of Inverted P3HT:TiO2 Bulk Heterojunction Hybrid Solar Cell Using (4,5-Diaza-9,9’-spirobifluorene) Functionalized Donor/Acceptor Conjugated Oligomer as Interface Modifier	Yi-Chen Ho; 何宜臻	材料科學與工程學研究所

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