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| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 薛人愷(Ren-Kae Shiue) | |
| dc.contributor.author | Yi-Yen Wu | en |
| dc.contributor.author | 吳依妍 | zh_TW |
| dc.date.accessioned | 2022-11-23T09:29:59Z | - |
| dc.date.available | 2021-07-20 | |
| dc.date.available | 2022-11-23T09:29:59Z | - |
| dc.date.copyright | 2021-07-20 | |
| dc.date.issued | 2021 | |
| dc.date.submitted | 2021-07-09 | |
| dc.identifier.citation | Crofer® 22 H Material Data Sheet No. 4050, VDM Metals, June 2010 Edition https://www.vdm-metals.com/fileadmin/user_upload/Downloads/Data_Sheets/Data_Sheet_VDM_Crofer_22_H.pdf Crofer® 22 APU Material Data Sheet No. 4146, VDM Metals, January 2021 Edition. https://www.vdm-metals.com/fileadmin/user_upload/Downloads/Data_Sheets/Data_Sheet_VDM_Crofer_APU_01.pdf Humpston, G. and Jacobson, D.M. (2005), Principles of Brazing: ASM International Derby, B. and Wallach, E.R. (1982), Theoretical model for diffusion bonding. Metal Science, 16(1), 49-56. Mishira, R.S. and Ma, Z.Y., Friction stir welding and processing. Materials Science and Engineering: R: reports, 50(1-2), 2005, 1-78. Way, M., Willingham, J. and Goodall, R., Brazing Filler Metal, International Materials Review, Vol. 65, 2019, 257-85. Oslon, D.L., Siewart, T.A., Liu, S. and Edwards, G.R. (1990), ASM Handbook Volume 6: Welding, Brazing and Soldering 10th Edition, ASM International. American Welding Society (2007), Brazing handbook. 5th ed, Miami (FL): American Welding Society. Milner, R.D., A Survey of the Scientific Principles Related to Wetting and Spreading, British Welding Journal, Vol. 5, 1958, 90-105. Bailey, G. L. G. and Watklns, H. C., The Flow of Liquid Metals on Solid Metal Surfaces and its Relation to Soldering, Brazing, and Hot-Dip Coating, Journal of the Institute of Metals, 1952, 57-76. Kowalewski, J., and Szczurek, J. (2017), Issues in Vacuum Brazing, SECO/WARWICK, Meadville, PA USA Prof. Dr.M. Sherif El-Eskandarany (2020), Vapor deposition, Mechanical Alloying (Third Edition) Wasa, K. (Ed.), Kanno, I. (Ed.) and Kotera, H. (Ed.) (2012), Handbook of Sputter Deposition Technology 2nd edition: Elsevier Inc. Perry, E. R., Joining by Brazing: High Quality Filler Alloys are Essential, Welding and Metal Fabrication, Vol. 59, 1991, 11-12. Schwartz, M., Brazing Second Edition, ASM International, 2003. Walker, C. A., and Hodges, V. C. (2008), Comparing Metal-Ceramic Brazing Methods, Brazing Soldering Today. Humpston, G.; Jacobson, D.M. (1993), Principles of Soldering and Brazing, ASM International, Materials Park Nolte, H.J., Method of Metallizing a Ceramics Member, US. Patent 2,667,427, 1954. Nolte, H.J., Metallizing Ceramic, US. Patent 2,667,432, 1954. Weil, K. S., Kim, J. Y. and Hardy, J. S., Reactive Air Brazing: A Novel Method of Sealing SOFCs and Other Solid-State Electrochemical Devices, Electrochemical and Solid-State Letters, Vol. 8(2), 2005, A133-A136. Le, S., Shen, Z., Zhu, X., Zhou, X., Yan, Y., Sun, K., Zhang, N., Yuan, Y. and Mao, Y., Effective Ag-CuO Sealant for Planar Solid Oxide Fuel Cell, Journal of Alloys and Compounds, Vol. 496(1-2), 2010, 96-99. Kiebach, R, Engelbrecht, K, Grahl-Madsen, L., Sieborg, B, Chen, M., Hjelm, J., Norrman, K., Chatzichristodoulou, C. and Hendriksen, P. V., An Ag Based Brazing System with a Tunable Thermal Expansion for the Use as Sealant for Solid Oxide Cells, Journal of Power Sources, Vol. 315, 2016, 399-350. Halbig, M. C., Coddington, B. P., Asthana, R. and Singh, M., Characterization of Silicon Carbide Joints Fabricated Using SiC Particulate-Reinforced Ag-Cu-Ti Alloys, Ceramics International, Vol. 39, 2013, 4151-4162. Tucker, M. C., Jacobson, C. P., Jonghe, L. C. D. and Viscco, S. J., A Braze System for Sealing Metal-Supported Solid Oxide Fuel Cells, Journal of Power Sources, Vol. 160(2), 2006, 1049-1057. Ranaweera, M. and Kim, J. S., Cell Intergrated Multi-junction Thermalcouple Array for Solid Oxide Fuel Cell Temperature Sensing: N+1 Architecture, Journal of Power Sources, Vol. 315, 2016, 70-78. Rabinkin, A. (2004), Brazing with (NiCo Cr)-B -Si Amorphous Brazing Filler Metals: Alloys, Processing, Joint Structure, Properties, Applications. Science and Technology of Welding and Joining Szewieczek, D. and Tyrlik, J., Designing the Brazed Joint Properties with Applica- tion of Amorphous Tapes as a Filler Metal, Journal of Materials Process Technology, Vol. 53, 1995, 405–412. Weil, K. L.; Rice, J. P., Substrate Effects on the High-Temperature Oxidation Behavior of a Gold-Based Braze Filler Metal, Scripta Materialia, Vol. 52(11), 2005, 1081-1085 李訓杰, 鈦鋁介金屬紅外線加熱接合及其介面之研究, 材料科學與工程學研究所, 國立臺灣大學, 台北市, 1997, 169. Villars, P., Prince, A. and Okamoto, H. (1995), Handbook of Ternary Alloy Phase Diagrams, ASM International. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/80171 | - |
| dc.description.abstract | 本研究分為兩部分，第一部分是使用活性銀基填料(Ticusil、Cusil-ABA)及非晶鎳基填料(MBF-51)分別將Crofer 22 H鐵鉻合金及8YSZ陶瓷進行高溫硬銲接合。第二部分是使用未含活性元素之銀基填料(BAg-8)及金基填料(70Au-22Ni-8Pd)分別對Crofer 22 APU與具表面金屬化(Cu、Ti濺鍍層)之8YSZ陶瓷進行高溫硬銲接合。實驗中嘗試以不同填料及不同真空度之條件進行異質硬銲，期望能改善SOFC電池中連接板與電解質接點之性質，藉由EPMA可觀察其表面形貌以確認銲點接合之完整性，及利用WDS定量分析以分析各相元素之組成。 第一部分中與使用Cusil-ABA填料相比，活性元素Ti含量較高之Ticusil活性銀基填料，在高溫、高真空之條件，銲道橫截面完好無裂紋，但在高溫低真空、大氣之條件下，由於氧分壓的上升，銲道與8YSZ界面產生裂紋，無法形成良好之銲點。而使用高溫鎳基非晶填料(MBF-51)進行硬銲接合，可有效在高溫高真空下達到完整的接點，應為MBF-51屬非晶金屬填料且在更高溫的環境對陶瓷之潤濕性提高所致。 第二部分為在硬銲前先對8YSZ陶瓷做表面金屬化之處理，先後在8YSZ上鍍一層約1 μm之活性元素Ti、約0.4 μm之保護金屬Cu，可使用未含活性元素之銀基填料(BAg-8)，在高溫高真空之條件下，成功將兩基材硬銲接合在一起。但在高溫大氣下之條件，鍍層外層之Cu在升溫時即形成氧化物，無法保護活性元素Ti層，喪失對8YSZ陶瓷之潤濕性，導致銲接效果不佳。而使用金基填料(70Au-22Ni-8Pd)也可有效在高溫高真空之環境良好接合兩基材，其中填料與8YSZ界面之濺鍍層在升溫過程中可能已產生反應，並在高溫持溫過程中濺鍍層溶解至填料中。 | zh_TW |
| dc.description.provenance | Made available in DSpace on 2022-11-23T09:29:59Z (GMT). No. of bitstreams: 1 U0001-2606202112472100.pdf: 10969404 bytes, checksum: ae8fe86bb23de2afde6da66d2e925eed (MD5) Previous issue date: 2021 | en |
| dc.description.tableofcontents | 誌謝 i 摘要 iii Abstract iv 目錄 vii 表目錄 ix 圖目錄 x 第一章 前言 1 第二章 文獻回顧 3 2-1 基材特性簡介 3 2-1-1 Crofer 22 H與Crofer 22 APU不鏽鋼基材 3 2-1-2 8YSZ電解質材料 3 2-2 接合製程 4 2-2-1 硬銲接合機構 5 2-2-2 接合強度之影響因素 7 2-3 氣相沉積 10 2-3-1 濺鍍 11 2-4 填料選擇 12 2-4-1 填料特性 12 2-4-2 陶瓷與金屬異質接合之填料選擇 14 2-4-3 本實驗所使用之硬銲填料 15 第三章 實驗方法與步驟 23 3-1 試片前處理 23 3-2 濺鍍 23 3-3 動態潤濕角實驗 23 3-4 硬銲試片之製程 24 3-5 金相實驗 研磨拋光 24 3-6 EPMA之顯微組織觀察與定量分析 25 第四章 使用不同填料硬銲接合Crofer 22 H與8YSZ 33 4-1 使用Ticusil將Crofer 22 H與8YSZ在不同氧壓下硬銲接合 33 4-1-1 Ticusil對基材之潤濕角量測 33 4-1-2 Crofer 22 H/Ticusil/8YSZ硬銲接合於高真空 34 4-1-3 Crofer 22 H/Ticusil/8YSZ硬銲接合於低真空 34 4-1-4 Crofer 22 H/Ticusil/8YSZ硬銲接合於大氣 35 4-2 使用Cusil-ABA將Crofer 22 H與8YSZ硬銲接合於高真空 36 4-3 使用MBF-51將Crofer 22 H與8YSZ硬銲接合 38 4-3-1 MBF-51對基材之潤濕角量測 38 4-3-2 Crofer 22 H/MBF-51/8YSZ硬銲接合於高真空 38 第五章 使用不同填料硬銲接合Crofer 22 APU與具有表面濺鍍層之8YSZ 61 5-1 使用BAg-8將Crofer 22 APU與Cu/Ti/8YSZ硬銲接合 61 5-1-1 BAg-8對基材之潤濕角量測 61 5-1-2 Crofer 22 APU/BAg-8/Cu/Ti/8YSZ硬銲接合於高真空 62 5-1-3 Crofer 22 APU/Ag/BAg-8/Cu/Ti/8YSZ硬銲接合於大氣 63 5-2 使用70Au-22Ni-8Pd將Crofer 22 APU與Cu/Ti/8YSZ硬銲接合 63 5-2-1 70Au-22Ni-8Pd對基材之潤濕角量測 64 5-2-2 Crofer 22 APU/70Au-22Ni-8Pd/Cu/Ti/8YSZ硬銲接合於高真空 64 第六章 結論 81 6-1 使用活性銀基填料及非晶鎳基填料硬銲接合Crofer 22 H與8YSZ 81 6-2 使用銀基填料及金基填料硬銲接合Crofer 22 APU與具濺鍍層之8YSZ 82 參考文獻 84 | |
| dc.language.iso | zh-TW | |
| dc.subject | 金基填料 | zh_TW |
| dc.subject | 活性銀基填料 | zh_TW |
| dc.subject | 非晶鎳基填料 | zh_TW |
| dc.subject | Crofer 22 | zh_TW |
| dc.subject | 8YSZ | zh_TW |
| dc.subject | 銀基填料 | zh_TW |
| dc.subject | Active Ag-based filler | en |
| dc.subject | Au-based filler | en |
| dc.subject | Ag-based filler | en |
| dc.subject | 8YSZ | en |
| dc.subject | Crofer 22 | en |
| dc.subject | Amorphous Ni-based filler | en |
| dc.title | 使用不同填料硬銲接合Crofer 22合金與8YSZ陶瓷 | zh_TW |
| dc.title | Brazing Crofer 22 Alloy and 8YSZ Ceramics Using Different Filler Metals | en |
| dc.date.schoolyear | 109-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 蔡履文(Hsin-Tsai Liu),郭東昊(Chih-Yang Tseng) | |
| dc.subject.keyword | 活性銀基填料,非晶鎳基填料,Crofer 22,8YSZ,銀基填料,金基填料, | zh_TW |
| dc.subject.keyword | Active Ag-based filler,Amorphous Ni-based filler,Crofer 22,8YSZ,Ag-based filler,Au-based filler, | en |
| dc.relation.page | 85 | |
| dc.identifier.doi | 10.6342/NTU202101147 | |
| dc.rights.note | 同意授權(全球公開) | |
| dc.date.accepted | 2021-07-09 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
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