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  1. NTU Theses and Dissertations Repository
  2. 工學院
  3. 機械工程學系
Please use this identifier to cite or link to this item: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/7625
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???org.dspace.app.webui.jsptag.ItemTag.dcfield???ValueLanguage
dc.contributor.advisor吳文方(Wen-Fang Wu)
dc.contributor.authorSue-Ray Linen
dc.contributor.author林書睿zh_TW
dc.date.accessioned2021-05-19T17:48:14Z-
dc.date.available2023-03-02
dc.date.available2021-05-19T17:48:14Z-
dc.date.copyright2018-03-02
dc.date.issued2018
dc.date.submitted2018-02-09
dc.identifier.citation第一章參考文獻:
[1]W. F. Wu, S. R. Lin and J. S. You, “Risk-Based Inspection and Maintenance in Process Plants and Their Practices in Taiwan,” Journal of the Chinese Institute of Engineers, Vol. 39, No. 4, p. 392-403, 2016.
[2]台灣電力公司,核二廠反應爐支撐裙板錨定螺栓破壞力學及疲勞評估報告,2012年6月。
[3]EPRI, BWR Vessel and Internals Project, BWR Shroud Support Inspection and Flaw Evaluation Guidelines, (BWRVIP-38), EPRI TR-108823, September 1997.
[4]ASME, ASME B&PV Codes, Section XI, Nonmandatory, Appendix C, Evaluation of Flaws in Piping, 2007 Version.
[5]USNRC, Regulatory Guide 1.89, Environmental Qualification of Certain Electric Equipment Important to Safety for Nuclear Power Plants, Revision 1, U.S. Nuclear Regulatory Commission, Washington, DC, June 1984.
[6]Korsah, K. et al., Technical Basis for Environmental Qualification of Microprocessor-Based Safety-Related Equipment in Nuclear Power Plants, NUREG/CR-6479, U.S. Nuclear Regulatory Commission, Washington, DC, January 1998.
[7]USNRC, Regulatory Guide 1.209, Guidelines for Environmental Qualification of Safety-Related Computer-Based Instrumentation and Control Systems in Nuclear Power Plants, U.S. Nuclear Regulatory Commission, Washington, DC, March 2007.
[8]USNRC Technical Training Center, Digital Instrumentation & Control Training, E-114, 2007.
第二章參考文獻:
[1]Taiwan Power Company, Containment Internals Reactor Pedestal Liner Plate Section and Details, Drawing No. C-342 Sh. 2.
[2]Taiwan Power Company, Final Safety Analysis Report of Kuosheng Nuclear Power Station, 16th Edition, 2007.
[3]台灣電力公司,DNS-ES-100-101,核二廠2號機EOC-21反應爐支撐裙板錨定螺栓結構安全分析報告,2012. (In Chinese)
[4]Taiwan Power Company, Final Safety Analysis Report of Kuosheng Nuclear Power Station, 16th Edition, 2007.
[5]ASTM, ASTM Standards, A540/A540M-11, Standard Specification for Alloy-Steel Bolting for Special Applications, vol. 01.01, 2007 Edition.
[6]USNRC, NUREG-1801, Generic Aging Lessons Learned (GALL) Report, Revision 2, Aging Management Program (AMP) XI.M18, December 2010.
[7]Y. F. Cheng, Stress Corrosion Cracking of Pipelines, John Wiley & Sons, Inc., Canada, 2013.
[8]W. F. Wu, C. H. Tsai, K. C. Tu, and J. S. You, “Probabilistic analysis of core shroud cracks, Nuclear Engineering and Design,” Vol.214, p.103-112, 2002.
[9]T. L. Dickson, M. T. EricksonKirk, “The Inclusion of Inner Serface Breaking Flaws in Probabilistic Fracture Mechanics Analysis of Reactor Vessels Subjected to Planned Normal Cool-Down Transients, ASME Pressure Vessel and Piping Division Conference, Paper Number: PVP2008-61392, U. S., July, 2008.
[10]J. S. You, W. F. Wu, “Risk-Based Prevent Maintenance Policies for Power Plants.” Journal of Engineering, National Taiwan University, Vol. 87, p. 15-26, 2001. (In Chinese)
[11]ASME, ASME Boiler and Pressure Vessel Code, Section XI, Appendix G, 2004 Edition
[12]P. M. Besuner, A. S. “Tetelman, Probablistic Fracture Mechanics,” Nuclear Engineering and Design, Vol. 43, No. 1, p. 99-144, Auguest, 1977.
[13]ASME, ASME B & PV Codes, Section III, Division 1, Subsection NF, 1989 Edition.
第三章參考文獻:
[1]EPRI, BWR Shroud Support Inspection and Flaw Evaluation Guidelines, BWR Vessel and Internals Project, BWRVIP-38, EPRI TR-108823, Palo Alto, CA, September 1997.
[2]The Japan Steel Works, Ltd., Quality Control Records for Chinshan No. 1 Reactor Pressure Vessel, Doc. No. JQCR-69002, Vol. 2, p. 7485, May 1972.
[3]EPRI, Evaluation of Crack Growth in BWR Nickel Base Austenitic Alloys in RPV Internals, BWR Vessel and Internals Project, BWRVIP-59-A, EPRI TR-1014874, Palo Alto, CA, 2007.
[4]The Japan Steel Works, Ltd., Sizing Calculation for Shroud Support Structure, Spec. No. NCL-69226, Rev. 6, May 1972.
[5]T. S. Bulischeck, D. V. Rooyen, “Effect of environmental variables on the stress corrosion cracking of Inconel 600 steam generator tubing,” Nuclear Technology Vol. 55, No. 2, p. 383393, 1981.
[6]L. R. Bandy, R. Roberg and R. C. Newman, “Low temperature stress corrosion cracking of Inconel 600 under two different conditions of sensitization,” Corrosion Science, Vol. 23, No. 9, p.9951006, 1983.
[7]USNRC, Generic Aging Lessons Learned (GALL) Report, NUREG-1801, Revision 1, Vol. 1~2, 2005.
[8]C. E. Ebeling, An Introduction to Reliability and Maintainability Engineering, McGraw-Hill Inc., New York, 1997.
[9]ASME, ASME B&PV Codes, Section XI, Nonmandatory Appendix C, Evaluation of Flaws in Piping, 2007 Version.
[10]EPRI, BWR Core Shroud Inspection and Flaw Evaluation Guidelines, BWR Vessel and Internals Project, BWRVIP-76-A, EPRI TR-1019057, Palo Alto, CA, 2009.
[11]S. R. Lin, W. F. Wu, “Estimation of maximum axial force of anchor bolts in consideration of random bolt failures,” International Journal of Pressure Vessels and Piping, Vol. 131, No. 7, p. 5259, 2015.
第四章參考文獻
[1]USNRC, Research Activities, NUREG-1925, Washington, DC, February 2016.
[2]USNRC, Identification and Analysis of Failure Modes in Digital Instrumentation and Controls (DI&C) Safety Systems—Expert Clinic Findings, Part 2, Research Information Letter 1002, May 2014.
[3]L. Betancourt, S. Birla, J. Gassino and P. Regnier, Suitability of Fault Modes and Effects Analysis for Regulatory Assurance of Complex Logic in Digital Instrumentation and Control Systems, NUREG/IA-0524, U.S. Nuclear Regulatory Commission, Washington, DC, April 2011.
[4]USNRC, Regulatory Guide 1.89, Environmental Qualification of Certain Electric Equipment Important to Safety for Nuclear Power Plants, Revision 1, Washington, DC, June 1984.
[5]IEEE, IEEE Standard for Qualifying Class 1E Equipment for Nuclear Power Generating Stations, IEEE Std. 323-1974, Piscataway, NJ, 1974.
[6]USNRC, U.S. Code of Federal Regulations, Title 10, Part 50.55a, Domestic Licensing of Production and Utilization Facilities, , Washington, DC.
[7]USNRC, Regulatory Guide 1.209, Guidelines for Environmental Qualification of Safety-Related Computer-Based Instrumentation and Control Systems in Nuclear Power Plants, Washington, DC, March 2007.
[8]USNRC, U.S. Code of Federal Regulations, Title 10, Part 50.49, Environmental Qualification of Electric Equipment Important to Safety for Nuclear Power Plants,” Washington, DC.
[9]EPRI, Generic Requirements Specification for Qualifying a Commercially Available PLC for Safety-Related Applications in Nuclear Power Plants, Topical Report 107330, December 1996.
[10]T. C. Ou, H. C. Lo, R. C. Wu and C. T. Lee, “A Study of I&C Systems Digital Upgrade in Nuclear Power Plant,” The 31st Power Engineering Conference, p.1725-1731, Tainan, Taiwan , December 2010.
[11]Korsah, K. et al., Technical Basis for Environmental Qualification of Microprocessor-Based Safety-Related Equipment in Nuclear Power Plants, NUREG/CR-6479, U.S. Nuclear Regulatory Commission, Washington, DC, January 1998.
[12]郭獻棠,赴美參加核電廠設備驗證技術相關訓練及參加第28屆設備驗證技術研討會,出國報告,行政院原子能委員會,106年3月27日。
[13]Y. F. Su, K. N. Chiang, “Design and Reliability Assessment of Novel 3d-IC,” Journal of Mechanics, Vol. 33, No. 2, p.193-203, April 2017.
[14]C. Lu, “Overview of Fan-Out Wafer Level Package (FO-WLP),” 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014.
[15]JEDEC, JESD22 - A104-B, Temperature Cycling, Solid State Technology Asscociation, July, 2000.
[16]<https://www.materialsnet.com.tw/material/DocView_MaterialFront.aspx?id=25225>, 電子構裝發展趨勢,材料世界網,2017/6/28刊登。
[17]<http://www.mitsubishielectric.com/bu/powersystems/nuclear/lineup/i_c/index.html>, 三菱電子,數位儀控系統架構圖。
[18]行政院原子能委員會,核能同級品零組件檢證作業及檢證機構認可管理辦法,會核字第0950034131號,95年12月12日。
[19]李德善,“輻射偵測儀器”,中興工程科技研究發展基金會出版,2002。
[20]EPRI, “Aging Assessment Field Guide,” Technical Results Report 1007933, December 2003.
[21]USNRC, Regulatory Guide 1.97, Instrumentation for Light-Water-Cooled Nuclear Power Plants to Assess Plant and Environs Conditions During and Following an Accident, Revision 3, Washington, DC, May 1983.
[22]USNRC, Interim Staff Position on Environmental Qualification of Safety-Related Electrical Equipment, NUREG-0588, Revision 1, Washington, DC, July 1981.
[23]IEEE, IEEE Std. 323-2003, IEEE Standard for Qualifying Class 1E Equipment for Nuclear Power Generating Stations, Piscataway, NJ, 2003.
[24]Y. Hsu, C. Y. Su and W. F. Wu, “An Analytical Procedure for Estimating Field Lifetime and Failure Rate of Electronic Packages,” Journal of the Chinese Institute of Engineers, Vol. 37, No. 1, p. 36-43, 2014.
[25]Y. Hsu, C. Y. Su and W. F. Wu, “Thermal-Cyclic Fatigue Life Analysis and Reliability Estimation of a FCCSP based on Probabilistic Design Concept,” Computers, Materials and Continua, Vol. 36, No. 2, p. 155-176, 2013.
[26]J. Weertman, “Creep Deformation of ICE,” Annual Review of Earth and Planetary Sciences Vol. 11, p.215-240, 1983.
[27]J. H. L. Pang, T. Tan, S. K. Sitaraman. “Thermo-Mechanical Analysis of Solder Joint Fatigue and Creep in a Flip Chip on Board Package Subjected to Temperature Cycling Loading.” In: Electronic Components and Technology Conference, p. 878-83, 1998.
[28]L. Zhang, J. H. Y. Guo, C. W. He, “Anand model and FEM analysis of SnAgCuZn lead-free solder joints in wafer level chip scale packaging devices,” Microelectronics Reliability, Volume 54, Issue 1, p 281-286, January 2014.
[29]J. Dukovic et al., “Through-Silicon-Via Technology for 3D Integration,” Internatioanl Memory Workshop (IMW), p. 148-149, 2010, DOI: 10.1109/IMW.2010.5488399.
[30]Y. H. Kwon, H. S. Bang, S. M. Joo, H. S. Bang, “Numerical Analysis of Thermo-Mechanical Characteristics of Solder Joint Depending on Change in Solder Junction Structure of MCP,” Microelectronics Reliability, Vol. 55, p. 442-447, 2015.
[31]<http://www.dupont.com/products-and-services/membranes-films/polyimide-films/brands/kapton-polyimide-film.html/>, KAPTON® Polyimide Film, Summary of Properties, DuPont Inc., 2017.
[32]N. E. Dowling, Mechanical Behavior of Meterials, Prentice-Hall, Inc., 1992.
[33]X. J. Fan, B. Varia and Q. Han, “Design and optimization of thermo-mechanical reliability in wafer level packaging,” Microelectronics Reliability Vol.50, p.536–546, 2010.
第五章參考文獻
[1]J. Dukovic et al., “Through-Silicon-Via Technology for 3D Integration,” Internatioanl Memory Workshop (IMW), pp. 148-149, 2010, DOI: 10.1109/IMW.2010.5488399.
[2]蕭献賦,實用IC封裝,臺北市:五南圖書出版股份有限公司,2015/6/1。
[3]Y. H. Kwon, H. S. Bang, S. M. Joo, H. S. Bang, “Numerical Analysis of Thermo-Mechanical Characteristics of Solder Joint Depending on Change in Solder Junction Structure of MCP,” Microelectronics Reliability, Vol. 55, p. 442-447, 2015.
[4]C. Lu, “Overview of Fan-Out Wafer Level Package (FO-WLP),” 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014.
[5]<https://read01.com/LmmAoP.html> 網站資料,扇出型電子構裝元件簡介。
[6]<http://appleapple.top/> 網站資料,扇出型電子構裝元件示意圖。
[7]徐祥禎,電子構裝結構分析,網站電子檔資料,2009。
[8]M. Yunus, K. Srihari, J. M. Pitarresi and A. Primavera, “Effect of Voids on the Reliability of BGA/CSP Solder Joints,” Microelectronics Reliability, Vol. 43, p. 2077-2086, 2003.
[9]<http://www.indium.com/blog/voids-in-solder-joints-i.php> 網站資料,空孔類型說明。
[10]R. F. Aspandiar, “Voids in Solder Joints,” Proceedings of the SMTAI 2006, 406-415, Chicago, IL, September 2006.
[11]邱建勳、何宗漢、劉旭唐、林書羽、林益生,“系統級封裝 (SiP)在SMT迴焊製程孔洞缺陷之研究”,工程科技與教育學刊第九卷第三期,第312-321頁,2012/09。
[12]Q. Yu, T. Shibutani, D. S. Kim, Y. Kobayashi, J. Yang and M. Shiratori, “Effect of Process-Induced Voids on Isothermal Fatigue Resistance of CSP Lead-Free Solder Joints,” Microelectronics Reliability, Vol. 48, p. 431-437, 2008.
[13]Ming-Hwa R. Jen, L. C. Liu and Y. S. Lai, “Electromigration on Void Formation of Sn3Ag1.5Cu FCBGA Solder Joints,” Microelectronics Reliability, Vol. 49, p. 734-745, 2009.
[14]K. C. Otiaba, M. I. Okereke and R.S. Bhatti, “Numerical Assessment of the Effect of Void Morphology on Thermomechanical Performance of Solder Thermal Interface Material,” Applied Thermal Engineering, Vol. 64, p. 51-63, 2014.
[15]D. Bušek a, K. Dušek, D. Růžička, M. Plaček, P.Macha, J. Urbánek and J. Starý, “Flux Effect on Void Quantity and Size in Soldered Joints,” Microelectronics Reliability, Vol. 60, p. 135-140, 2016.
[16]L. Cergel, L. Wetz, B. Keser and J. White, “Chip Size Packages with Wafer-Level Ball Attach and Their Reliability,” Proceedings of the Advanced Semiconductor Devices and Microsystems (ASDAM), p. 27-30, 2002.
[17]H. C. Cheng, C. Y. Yu and W. H. Chen, “An Effective Thermal-Mechanical Modeling Methodology for Large-Scale Area Array Typed Packages,” CMES: Computer Modeling in Engineering & Sciences, Vol. 7, No. 1, p. 1-17, 2005.
[18]JEDEC Solid State Technology Association, JESD22-A104C: Temperature Cycling, JESD22-A104C, 2005.
[19]ANSYS Workbench User’s Guide 17.0, ANSYS, Inc., 2016.
[20]S. R. Lin, W. F. Wu, Estimation of maximum axial force of anchor bolts in consideration of random bolt failures, International Journal of Pressure Vessels and Piping, Vol. 131, No. 7, p.5259, 2015.
[21]J. Weertman, “Creep Deformation of ICE”, Annual Review of Earth and Planetary Sciences Vol. 11, p.215-240, 1983.
[22]J. H. L. Pang, T. Tan, S. K. Sitaraman. “Thermo-Mechanical Analysis of Solder Joint Fatigue and Creep in a Flip Chip on Board Package Subjected to Temperature Cycling Loading,” Electronic Components and Technology Conference, p. 878-83, 1998.
[23]K. C. Norris and A. H. Landzberg, “Reliability of controlled collapse interconnections” , IBM Journal of Research and Development, Vol. 13, p. 266-271, 1969.
[24]O. Salmela, “Acceleration factors for lead-free solder materials”, IEEE Transactions on Components and Packaging Technologies, Vol. 30, p. 700-707, 2007.
[25]V. Vasudevan, X. Fanan. “Acceleration Model for Lead-Free (SAC) Solder Joint Reliability under Thermal Cycling,” Electronic Components and Technology Conference, USA, p.139-145, 2008.
[26]Korsah, K. et al., Technical Basis for Environmental Qualification of Microprocessor-Based Safety-Related Equipment in Nuclear Power Plants, NUREG/CR-6479, U.S. Nuclear Regulatory Commission, Washington, DC, January 1998.
[27]吳琮傑,重點取樣法在結構可靠度分析之應用,台灣科技大學營建系碩士論文,93年7月。
第六章參考文獻
[1]C. H. Lee, K. C Wu, K. N. Chiang, “A Novel Acceleration-factor Equation for Packaging-solder Joint Reliability Assessment at Different Thermal Cyclic Loading Rates,” Journal of Mechanics, Vol. 33, No. 1, p.35-40, February 2017.
dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/7625-
dc.description.abstract針對電廠結構與設備元件而言,隨機缺陷難免出現。然而,此類結構力學性能之完整性評估是相當棘手的問題。回顧2012年我國某一核電廠反應器壓力槽支撐裙板螺栓之斷裂事件,雖螺栓已經更換,坊間仍然存在修復後再次發生類似事件的疑慮。人們也擔心,假使同樣或類似事件再度發生,該支撐裙板是否仍然具備足夠的安全承載能力。如何以定量化且科學、不偏向的方式說服大眾,即是本研究之主要考量與目的。緣此,本研究提出一種合理可行的有限元素數值分析模型,處理需要考量大量隨機數據、雖簡化、但有效率且準確之力學分析,並結合統計檢定等相關學理處理分析結果。該結果既符合力學分析原理,也將不確定性所引致之風險納入考量,而達到前述本研究之目的。事實上,前述核電廠反應器壓力槽支撐裙板螺栓斷裂之力學分析也出現在美國電力研究院所出版的組件檢測導則中。該導則主要針對電廠反應器爐內組件無法檢測到的區域進行力學分析與檢測建議,但該分析保守假設裂紋具對稱性且穿壁,致使結構強度降低,並未探討裂紋隨機出現的問題。為改善該項保守假設,本研究採用前述所提模型與方法,另為較為合理的分析,並適當驗證分析結果。
綜觀電廠的安全評估問題,不單只是系統結構組件上的力學問題,對於安全至關重要的電氣電子設備也同樣存在類似的問題:隨機缺陷。美國核管會曾發佈對相關設備進行環境驗證的導則,但大多數以電氣設備較為完整,雖也曾針對含半導體電子構裝元件設備的物理失效機制進行一系列的研究,認為其若架設在溫和環境,也須證明其可正常運作而不致影響電廠設備安全運轉,但電子設備不斷推陳出新,規範導則則卻無法符合潮流,監測或儀控設備的核心元件在物理失效問題上僅能仰賴半導體設計廠商的數據,反觀目前大部分對此類電子構裝元件的可靠度研究中,則都是以完整、不含缺陷的構裝體為出發點考量,對於疲勞壽命的評估,往往忽略製程上所導致的缺陷問題。本研究延續前半部份一些理念,引用合理簡化模型的概念,配合經由數值實驗、力學公式所推導的模擬含空孔無鉛錫球之等效圓柱體及通式,將不同類型空孔在錫球內部以及隨機含空孔錫球在全域電子構裝元件分佈位置模擬出來,藉以評估其在加速環境下之疲勞壽命分佈,且引用適當的加速因子模型,推估其在電廠環境下的壽命,提供此類主動元件在維護上的參考。
zh_TW
dc.description.abstractAs random defects presenting in a system or electronic components, it is indeed quite difficult to solve such structural integrity and mechanical problems. Reviewing the anchor-bolt failure event of reactor pressure vessel support skirt in a domestic nuclear power plant in 2012, at that time there were doubts about the reoccurrence of similar incidents thereafter although the loosen bolts have been replaced. If the failure event of anchor bolts reoccurred, the question whether there is still enough tightening capacity to ensure safety of the whole system remains. Aiming to convince the public in an appropriate and quantitative manner that is not extremely conservative, this research begins with a proposed finite element model that handles a large number of random events and improves the efficiency of the analysis. Statistical tests and other related assessments to deal with such a random problem are also proposed. In fact, such a problem also appears in guidelines issued by the Electric Power Research Institute (EPRI), which is aimed at analyzing the undetectable area of the reactor pressure vessel shourd support (the two inner and outer circular weldments aside the support plate). However, the overall assessment is merely based on the assumption of symmetric through-wall cracks to reduce the structural strength for conservative reasons. The possible issue on random events is not explored. In this study, an improved analysis in consideration of random fracture anchor bolts is proposed to improve the treatment of cracked support plate. The efficiency method is verified with a large number of random events. It also shows in this dissertation that the proposed analysis for the discrete structures can also be applied to the continuous structures.
In the viewpoint of safety assessment on power plants, the random defects problem not only belongs to the mechanical issue of systems, structures and components, but also occurs on safety related electrical and electronic equipment. In fact, the US Nuclear Regulatory Commission (USNRC) has issued guidelines for environmental qualification for electrical and electronic equipment, but with little mentioning about the microprocessor-based equipment, despite a few studies on the physical failure of semiconductor-based equipment have been carried out in non-nuclear industry. Those guidelines considered that even under mild environments, such equipment should function normally without affecting the safe operation of power plants. However, the new type of microprocessor-based equipment, especially those used for monitoring and instrumentation continues to develop but its failure only relies on the testing or analyzing data from semiconductor manufacturers. Most reliability studies of the electronic packaging are based on assuming integrated structures, and the evaluation of fatigue life often ignores defects induced in production process. To improve the shortcomings, the concept of rational model proposed in the first part of this dissertation is adopted, and an equivalent general formula for use in the simulation of lead-free solder ball containing void is derived in the second part of the dissertation. The formula results in simplified equivalent cylinders to replace sloder balls containing random voids for use in the finite element simulation of packages. The fatigue life distribution of a package used in electrical or electronic equipment is determined under an accelerated environment. Its life under the normal operation of power plant can also be obtained. The result is also helpful for the maintenance of a power plant.
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dc.description.tableofcontents口試委員會審定書 i
誌謝 ii
摘要 iii
Abstract iv
第一章 緒論 1
1.1 研究背景、動機與目的 1
1.2 研究流程 4
1.3 論文架構 5
本章參考文獻 6
第二章 錨定螺栓在各種不同斷裂機率下所衍生最大軸向力評估法 7
2-1 前言 7
2-1 螺栓斷裂機率討論 9
2-1-1 以再斷裂機率討論 9
2-1-2 直接以斷裂根數進行統計分析 9
2-3. 分析模型的建立與驗證 10
2-3-1 建立快速的分析模型 10
2-3-2 驗證 14
2-4. 分析統計 17
2-5 小結 20
本章參考文獻 21
第三章 焊道含隨機多穿壁裂紋之爐心側板支撐平板機率評估法 23
3-1 前言 23
3-2 有限元素模型及評估法 25
3-3 數值驗證 29
3-4 隨機裂紋分析與機率評估描述 31
3-5 小結 35
本章參考文獻 36
第四章 從安全重要電氣設備至安全相關數位電子設備環境驗證規範與導則-探討半導體電子構裝元件於加速環境下熱疲勞分析評估 38
4-1 前言 38
4-2 環境驗證(Environmental Qualification)於重要安全電氣設備之相關規範彙整 43
4-2-1 Regulatory Guide 1.89之補充說明(驗證引用之NUREG-0588 Part I 及 IEEE-323-1974) 45
4-2-2 Regulatory Guide 1.97(對儀控設備功能要求的導則) 49
4-2-3 Regulatory Guide 1.209 (具有對電子設備環境驗證要求的導則) 50
4-3 從物理機制失效模式探討具微處理器電子設備之環境驗證(NUREG/CR-6479) 53
4-3-1電子設備元件老劣化機制 53
4-3-2 NUREG/CR-6479(具微處理器設備之環境驗證技術基礎) 56
4-3-3 加速測試彙整與IC電子構裝疲勞壽命評估 57
4-3-4 基於位置類別的數位儀控系統設備驗證方法 61
4-4半導體微處理器電子構裝元件數值分析評估 66
4-4-1假設性驗證案例 66
4-4-2模型建立 70
4-4-3 分析結果及壽命評估 72
4-5 小結 75
本章參考文獻 76
本章附錄 安全相關電氣設備或系統(R. G. 1.89) 80
第5章 含製程引致隨機孔洞晶圓級電子構裝加速環境試驗之數值模擬 81
5-1 前言 81
5-2 含缺陷錫球之數值實驗 84
5-2-1數值實驗模型建立 85
5-2-2模擬含空孔之實體錫球 85
5-2-3等效圓柱體模擬 89
5-3 等效通式建立 90
5-4數值實驗結果 93
5-5等效圓柱體全域分析模型建立 96
5-6疲勞壽命統計分析評估與加速因子 97
5-6-1含隨機缺陷之無鉛錫球(等效圓柱體)統計評估 98
5-6-2加速因子 122
5-7小結 126
本章參考文獻 129
第六章 結論與建議 132
6-1 結論 132
6-2 未來展望 135
本章參考文獻 135
dc.language.isozh-TW
dc.title含隨機缺陷電廠結構與設備元件之數值模擬與力學分析zh_TW
dc.titleNumerical Simulation and Mechanics Analysis of Structural and Equipment Components with Random Defects in Power Plantsen
dc.typeThesis
dc.date.schoolyear106-1
dc.description.degree博士
dc.contributor.oralexamcommittee丁鯤(Kuen Ting),鍾立來(Lap-Loi Chung),黃金城(Chin-Cheng Huang),陳正宗(Jeng-Tzong Chen),單秋成(Chow-Shing Shin)
dc.subject.keyword隨機缺陷,有限元素模型,電子構裝元件,疲勞壽命,等效圓柱體,zh_TW
dc.subject.keywordRandom defects,Numerical finite element model,Electronic packaging structure,Fatigue life,Equivalent cylinder,en
dc.relation.page135
dc.identifier.doi10.6342/NTU201800430
dc.rights.note同意授權(全球公開)
dc.date.accepted2018-02-09
dc.contributor.author-college工學院zh_TW
dc.contributor.author-dept機械工程學研究所zh_TW
Appears in Collections:機械工程學系

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