三軸零阿貝誤差晶圓檢測平台之設計最佳化與結構分析

Abstract

本論文研究一台自行研發三軸零阿貝誤差晶圓檢測平台之機構細部設計，熱分析和結構動態靜態反應分析。晶圓檢測平台之主結構包括花崗岩基座，龍門結構，X軸載台，Y軸載台，Z軸載台及量測探頭載台。量測子系統包括多功能量測探頭系統，X載台空氣軸承系統，以及量測三軸位移之雷射干涉儀系統。Y軸載台的整體設計為了更好的剛性進行了結構上的強化。三軸參考鏡系統的架設方式為了應對熱變形和偏角調整需求而重新設計。為量測探頭載台設計了可調式裝設架以調整Z方向量測探頭之俯仰角和偏擺角。為X軸載台下方之空氣軸承系統優化了穩定性和拆卸的方便性。於龍門旁建立了能提供高度穩定性的平台供架設雷射干涉儀系統之精密光學零件。所有的零件皆在AutoCAD及Inventor環境中參數化設計並組合，接著使用ANSYS和Inventor進行自重變形，震動模態，溫度分佈，熱變形等分析。另外，為了驗證結構分析結果，使用雷射都普勒震動量測儀和熱影像儀進行震動模態和溫度場的量測實驗。最後，建置了擁有以上優化設計之原型機台並測試其性能。結果證實此晶圓檢測平台之總體性能得到提升。

This thesis studies the detailed design, thermal analysis, and structural analysis of a self-built 3D Abbe-error free 12” wafer inspection stage. The structural components of the stage include base, gantry, X-stage, Y-stage, Z-stage, and vertical inspection probe stage. The measuring sub-systems includes an inspection probe system for multi-purpose measurement, an air bearing system for X-stage, and a laser interferometer system for measuring 3-axis motions. The overall design of Y-plate of the Y-stage has been modified for extra stiffness. The three reference mirror adaptors have been redesigned for inevitable thermal deformation and precise calibration requirement. The vertical inspection probe stage has an adjustable adaptor to control the pitch and yaw angle of Z-direction inspection probe. The two air bearings under X-plate have been modified for more mobility and stability. A platform beside gantry is designed to mount laser interferometer and optical components with good stability. All the stage components are assembled in AutoCAD and Inventor through customized parametric design programs. Then ANSYS and Inventor were used to analyze structural behaviors such as self-weight deformation, modal shapes, temperature distribution, and thermal deformation of the components. In addition, experiments using Laser Doppler vibrometer (LDV) and thermographic camera were performed to justify the results from structural analysis. Finally, prototype with these improved designs is manufactured and performances of the stage are measured. The results show that the overall performance of the wafer inspection stage is improved.