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完整後設資料紀錄
DC 欄位 | 值 | 語言 |
---|---|---|
dc.contributor.advisor | 陳俊忠 | |
dc.contributor.author | Wan-Chi Cheng | en |
dc.contributor.author | 鄭宛綺 | zh_TW |
dc.date.accessioned | 2021-06-16T17:23:14Z | - |
dc.date.available | 2017-08-20 | |
dc.date.copyright | 2012-08-20 | |
dc.date.issued | 2012 | |
dc.date.submitted | 2012-08-16 | |
dc.identifier.citation | References
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Websites 1) http://big5.hdcmr.com/142829.html 2) http://broadband02.ici.ro/program/klingenstein_3d.pdf 3) http://cens.com/cens/html/en/news/news_inner_38816.html 4) http://en.wikipedia.org/wiki/Thermal_management_of_electronic_devices_and_systems#Recent_developments 5) http://media01.24hrstech.com/PDFs/12B1-Nano-Thermo.pdf 6) http://pcdandf.com/cms/magazine/95/3704 7) http://unstats.un.org/unsd/trade/s_geneva2011/refdocs/RDs/GVC%20in%20Electronics%20Industry%20(Sturgeon%20-%20Sep%202010).pdf 8) http://www.appliednanotech.net/tech/CarbAl.php 9) http://www.bccresearch.com/report/top-ten-thermal-management-companies-smc075a.html 10) http://www.businessmodelgeneration.com 11) http://www.chalmers.se/mc2/EN/laboratories/bionano-systems/research/smit-center/nano-thermal/downloadFile/attachedFile_f0/2180260205.pdf?nocache=1260362286.99 12) http://www.digikey.com/purchasingpro/us/en/articles/supply-chain/revenue-for-contract-manufacturers-to-grow-85-percent-in-2011/1142 13) http://www.emasiamag.com/article-5268-unimicronacquiresphoenixtoaimforworldsno1pcbmaker-Asia.html 14) http://www.frostytech.com/top5heatsinks.cfm 15) http://www.ledinside.com/New_dawn_of_the_high_power_LED_lighting_industry_20081104 16) http://www.nec.co.jp/rd/en/innovative/bioplastics/03_4.html 17) http://www.stanford.edu/class/ee311/NOTES/TrendsSlides.pdf | |
dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/63924 | - |
dc.description.abstract | Heat dissipation is becoming an area of hot interest due to the demand of increase functionalities within electronics under more compact designs. To dissipate heat researchers and businesses have introduced many solutions. From different module designs, to adding cooling fans, to various packaging materials and even heat reducing chip level designs. Organizations, such as iNEMI and ITRS, have listed thermal management as a topic of priority on its roadmap. Thus the importance of heat dissipation to the future of electronic design is undeniable.
The market demand is present, yet even if a new product offering can meet the technical needs, what are the business aspects that need to be considered. How should a new market entrant position itself in the industry to gain a foot hold in the saturated market? Furthermore, how should a new entrant prepare itself against incumbent responses? What type of business model would be most beneficial to the new entrant? These would be the areas of exploration in this paper, which utilizes a company DBC as the case study company. In the highly competitive market of thermal solutions, what market entry strategy is most beneficial for DBC and how this would affect its business model. | en |
dc.description.provenance | Made available in DSpace on 2021-06-16T17:23:14Z (GMT). No. of bitstreams: 1 ntu-101-R99749010-1.pdf: 1572450 bytes, checksum: bf2966fa545f8bf9d2ccef4436e578b0 (MD5) Previous issue date: 2012 | en |
dc.description.tableofcontents | Master Thesis Certification.....ii
Acknowledgement.....iii Abstract.....iv List of Figures.....vii List of Tables.....viii Chapter 1: Introduction.....1 1.1 Research Motive.....1 1.2 Research Issues.....2 Chapter 2: Literature Review and Methodology.....3 2.1 Business Model....4 2.2 Porter’s Five Forces.....5 2.3 Competitive Dynamics.....6 2.4 Co-Opetition.....7 2.5 Methodology.....10 Chapter 3: Thermal Industry Introduction and DBC Introduction.....11 3.1 Thermal Industry Introduction.....11 3.1.1 Thermal Management Background.....12 3.1.2 Current Thermal Management Solutions and Limitations.....15 3.1.3 Market Driving Forces.....20 3.1.4 Current Industry Structure.....23 3.1.5 Industry Prospect.....24 3.2 Current Market Structure and Business Model.....25 3.3 DBC Introduction.....30 3.3.1 Company Background.....31 3.3.2 Competitive Strength Assessment and Advantage.....32 3.3.3 Current Activity Configuration.....37 Chapter 4:Market Entry Strategies.....38 4.1 Market Commonality and Resource Similarity.....39 4.2 Market Timing and Expansion.....40 4.2.1 Key Materials/Resources and Processes.....44 4.3 New Business Model.....46 4.3.1 Customer Relationship.....50 4.3.2 Partners Relationship.....52 Chapter 5: Conclusion.....57 5.1 Industry Finding......57 5.2 Action Plan......58 5.3 Managerial Implication.....59 5.4 Paper Contributions.....60 5.5 Future Research.....61 | |
dc.language.iso | en | |
dc.title | 新創企業之經營模式分析-以創新散熱奈米材料為例 | zh_TW |
dc.title | Business Model Design for New Venture - Case Analysis of Innovative Thermal Cooling Nano Material | en |
dc.type | Thesis | |
dc.date.schoolyear | 100-2 | |
dc.description.degree | 碩士 | |
dc.contributor.oralexamcommittee | 謝明慧,郭佳瑋 | |
dc.subject.keyword | 新創企業,經營模式,創新,散熱,奈米材料, | zh_TW |
dc.subject.keyword | Business Model,venture,Innovative,Thermal Cooling Nano Material, | en |
dc.relation.page | 66 | |
dc.rights.note | 有償授權 | |
dc.date.accepted | 2012-08-16 | |
dc.contributor.author-college | 管理學院 | zh_TW |
dc.contributor.author-dept | 企業管理碩士專班 | zh_TW |
顯示於系所單位: | 管理學院企業管理專班(Global MBA) |
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