應用多重尺度模型與多重物理耦合分析於電子連接器溫昇檢視

Abstract

電子連接器溫度過高可能影響其功能表現，然匹配金屬彈片接觸區域溫度不易量測。本研究執行金屬彈片表面輪廓量測，所得資訊經快速傅立葉轉換獲致接觸模型所需頻率與其相對應振幅。藉由有限元素分析商用軟體ABAQUS，搭配MATLAB計算程式，導入多重尺度正弦波粗糙表面接觸模型，探討匹配Micro USB連接器採用不同金屬彈片材料之接觸電阻。進行連接器溫昇實驗，檢視金屬彈片於特定負載電流之溫昇值。進一步利用ABAQUS/CFD進行熱-電-固-流多重物理耦合分析，獲致包含金屬彈片與塑膠基底之匹配連接器達到穩態後之溫度分布場。數值分析結果分別與熱耦及紅外線熱像儀量測所得相較，皆具備良好一致性。

Temperature rise could be a crucial issue for some electronic connectors subjected to the relative large electrical current. A non-statistical multi-scale sinusoidal rough surface model is adopted to estimate the contact area between matched metallic terminals as a function of contact load. A fast Fourier transform is conducted to characterize the measured surface topology of the terminals. Multi-physics three-dimensional finite element analysis is then carried out to evaluate the temperature rise of mated micro USB connectors. Temperature distributions of the terminal based on the numerical simulations are in good agreement with those based on the measurements using a thermal couple and an infrared thermal camera as well.