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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/54513完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 廖國基 | |
| dc.contributor.author | Hsiao-Lin Lu | en |
| dc.contributor.author | 呂效霖 | zh_TW |
| dc.date.accessioned | 2021-06-16T03:01:23Z | - |
| dc.date.available | 2020-08-28 | |
| dc.date.copyright | 2015-08-28 | |
| dc.date.issued | 2015 | |
| dc.date.submitted | 2015-07-02 | |
| dc.identifier.citation | 1. Hibbit, H. D., B. I. Karlsson, and E. P. Sorensen. 2012. ABAQUS User Manual. Version 6.12. USA. 2. MATLAB (R2010a). 2010. MATLAB User Manual, Release 7.10.0. USA. 3. Hertz, H. 1882. On the Contact of Elastic Solids. J. Reine Angew. Math. 92: 156-171. 4. Greenwood, J. A. and J. B. P. Williamson. 1966. Contact of Nominally Flat Surfaces. Proceeding of the Royal Society of London. 295: 300-319. 5. Kogut, L. and I. Etsion. 2000. Electrical Conductivity and Friction Force Estimation in Compliant Electrical Connectors. Tribology Transactions 43(4): 816-822. 6. Zhao, Y. and L. Chang. 2001. A Model of Asperity Interactions in Elastic-Plastic Contact of Rough Surfaces. Journal of Tribology 123(4): 857-864. 7. Jackson, R. L. and I. Green. 2005. A Finite Element Study of Elasto-Plastic Hemispherical Contact Against a Rigid Flat. Journal of Tribology 127(2): 343-354. 8. Archard, J. F. 1957. Elastic Deformation and the Laws of Friction. Proceeding of the Royal Society of London. 243: 190-205. 9. Jackson, R. L. and J. L. Streator. 2006. A Multi-Scale Model for Contact between Rough Surfaces. Wear 261(11-12): 1337-1347. 10. Jackson, R. L., W. R. Ashurst, G. T. Flowers, S. Angadi, S. Choe, and M. J. Bozack. 2007. The Effect of Initial Connector Insertions on Electrical Contact Resistance. Proceeding of the 53th IEEE Holm Conference on Electrical Contacts: 17-24. 11. Angadi, S. V., W. E. Wilson, R. L. Jackson, G. T. Flowers, and B. I. Rickett. 2008. A Multi-Physics Finite Element Model of an Eletrical Connector Considering Rough Surface Contact. Proceedings of the 54th IEEE Holm Conference on Electrical Contacts, Orlando, FL: 168-177. 12. Angadi, S. V., R. L. Jackson, S. Choe, G. T. Flowers, B. Lee, and L. Zhong. 2012. A Multi-Physics Finite Element Model of a 35A Automotive Connecter Including Multi-Scale Rough Surface Contact. Journal of Electronic Packaging 134: 1-12. 13. Jackson, R. L., H. Liu, and D. Leray. 2013. A Comparison of the Predictions of a Finite Element Model and Multi-Scale Model for a Rough MEMS Electrical Contact. Proceeding of the 59th IEEE Holm Conference on Electrical Contacts: 1-9. 14. Liu, H., D. Leray, P. Pons, and S. Colin. 2014. Finite Element Multi-Physics Modeling for Ohmic Contact of Microswitches. 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2014: 1-8. 15. Breitmeier Messtechnik GmbH. 2002. WLI Lab Manual. Version 09. 02. Ettlingen. 16. Johnson, K. L., J. A. Greenwood, and J. G. Higginson. 1985. The Contact of Elastic Regular Wavy Surfaces. International Journal of Mechanical Sciences 27(6): 383-396. 17. Krithivasan, V. and R. L. Jackson. 2007. An Analysis of Three-Dimensional Elasto-Plastic Sinusoidal Contact. Tribology Letters 27(1): 31-43. 18. Jackson, R. L., V. Krithivasan, and W. E. Wilson. 2008. The Pressure to Cause Complete Contact Between Elastic-Plastic Sinusoidal Surfaces. Journal of Engineering Tribology 222(J): 857-863. 19. Holm, R. 1967. Electric Contacts-Theory and Applications. 4th ed., 60-64. Berlin: Springer. | |
| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/54513 | - |
| dc.description.abstract | 電子連接器溫度過高可能影響其功能表現，然匹配金屬彈片接觸區域溫度不易量測。本研究執行金屬彈片表面輪廓量測，所得資訊經快速傅立葉轉換獲致接觸模型所需頻率與其相對應振幅。藉由有限元素分析商用軟體ABAQUS，搭配MATLAB計算程式，導入多重尺度正弦波粗糙表面接觸模型，探討匹配Micro USB連接器採用不同金屬彈片材料之接觸電阻。進行連接器溫昇實驗，檢視金屬彈片於特定負載電流之溫昇值。進一步利用ABAQUS/CFD進行熱-電-固-流多重物理耦合分析，獲致包含金屬彈片與塑膠基底之匹配連接器達到穩態後之溫度分布場。數值分析結果分別與熱耦及紅外線熱像儀量測所得相較，皆具備良好一致性。 | zh_TW |
| dc.description.abstract | Temperature rise could be a crucial issue for some electronic connectors subjected to the relative large electrical current. A non-statistical multi-scale sinusoidal rough surface model is adopted to estimate the contact area between matched metallic terminals as a function of contact load. A fast Fourier transform is conducted to characterize the measured surface topology of the terminals. Multi-physics three-dimensional finite element analysis is then carried out to evaluate the temperature rise of mated micro USB connectors. Temperature distributions of the terminal based on the numerical simulations are in good agreement with those based on the measurements using a thermal couple and an infrared thermal camera as well. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-16T03:01:23Z (GMT). No. of bitstreams: 1 ntu-104-R02631031-1.pdf: 3682730 bytes, checksum: 5b2d8627a89fbbd92945158636839f12 (MD5) Previous issue date: 2015 | en |
| dc.description.tableofcontents | 誌謝………………………………………………………………………………. i 中文摘要…………………………………………………………………………. ii Abstract…………………………………...……………………………………….iii 目錄………………………………………………………………………………. iv 表目錄……………………………………………………………………………. vi 圖目錄……………………………………………………………………………. vii 第一章 緒論……………………………………………………………………. 1 1-1 前言……………………………………………………………………… 1 1-2 研究動機與目的……...……………………………………….2 1-3 論文架構……...………………………………………….....3 第二章 文獻回顧………………………………………………………………. 4 第三章 實驗量測………...………………...……………………………7 3-1 金屬彈片表面輪廓量測……….………………………………7 3-2 連接器接觸電阻量測與溫昇實驗………………………8 第四章 研究方法……………………………………….……………………… 27 4-1 多重尺度粗糙表面接觸模型………………….…………27 4-2 彈性與彈塑性接觸模型與接觸電阻之計算…29 4-3 數值分析….…………………………………………………………….33 第五章 結果與討論…………..………………………………………………36 5-1 連接器接觸電阻分析與實驗結果比較……………36 5-2 連接器溫昇分析………………………………………………………37 5-2-1 應用多重尺度模型於溫昇分析與實驗結果比較……………37 5-2-2 應用多重尺度模型與傳統手法於溫昇分析之比較…………39 第六章 結論………………………………………………………….…………47 參考文獻………………………………………………………………………….49 | |
| dc.language.iso | zh-TW | |
| dc.subject | 有限元素分析 | zh_TW |
| dc.subject | 電子連接器 | zh_TW |
| dc.subject | 溫昇 | zh_TW |
| dc.subject | 多重物理耦合分析 | zh_TW |
| dc.subject | 多重尺度模型 | zh_TW |
| dc.subject | 有限元素分析 | zh_TW |
| dc.subject | 電子連接器 | zh_TW |
| dc.subject | 溫昇 | zh_TW |
| dc.subject | 多重尺度模型 | zh_TW |
| dc.subject | 多重物理耦合分析 | zh_TW |
| dc.subject | multi-scale model | en |
| dc.subject | multi-physics analysis | en |
| dc.subject | temperature rise | en |
| dc.subject | electronic connector | en |
| dc.subject | finite element analysis | en |
| dc.subject | multi-scale model | en |
| dc.subject | multi-physics analysis | en |
| dc.subject | temperature rise | en |
| dc.subject | electronic connector | en |
| dc.subject | finite element analysis | en |
| dc.title | 應用多重尺度模型與多重物理耦合分析於電子連接器溫昇檢視 | zh_TW |
| dc.title | Applications of Multi-Scale Model and Multi-Physics Coupling Analysis to Temperature Rise of Electronic Connectors | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 103-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 李國清,李維楨,呂學育 | |
| dc.subject.keyword | 多重尺度模型,多重物理耦合分析,溫昇,電子連接器,有限元素分析, | zh_TW |
| dc.subject.keyword | multi-scale model,multi-physics analysis,temperature rise,electronic connector,finite element analysis, | en |
| dc.relation.page | 51 | |
| dc.rights.note | 有償授權 | |
| dc.date.accepted | 2015-07-03 | |
| dc.contributor.author-college | 生物資源暨農學院 | zh_TW |
| dc.contributor.author-dept | 生物產業機電工程學研究所 | zh_TW |
| 顯示於系所單位： | 生物機電工程學系 | |
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|---|---|---|---|
| ntu-104-1.pdf 未授權公開取用 | 3.6 MB | Adobe PDF |
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