應用於3D-IC並使用垂直耦合電感之晶片間的高速無線連接

Abstract

本篇論文提出一個使用了耦合電感於三維積體電路的晶片間連接。跟電容耦合相比，電感耦合的連接有比較遠的通訊距離，我設計的距離是15 微米。較長的通訊距離意味著有較能抵抗製程上對不準的現象，而且我們使用交錯式的電感可以更進一步的克服這個問題。我們使用振幅偏移調變技術來達到信號完整的傳送。發射器包含鎖相迴路作為本地震盪器並使用電晶體開關作為被動混波器，接收器則包含了整流器來解調訊號並使用限制器放大訊號。本連接方法操作在6Gbps 時能達到4.08pJ/bit 能量效率。此無線連接使用台灣積體電路公司0.18 微米製程來驗證此電路架構。

A wireless interconnect for 3D-IC applications is implemented by using coupled inductor design. Inductive coupling interconnect has longer communication distance as compared with capacitive interconnect. Our communication distance is 15µm. The longer distance means that it can resist the alignment mismatches and increase the yields for packaging. We also use a mis-alignment resistance coupled inductor to alleviate the alignment problem. We use ASK modulation technique to transmit the data. In transmitter,a PLL is used as the local oscillator, and switch is used as a passive mixer. In receiver,rectifiers are used to demodulate received signal, and cascaded limiters amplify the signal.This interconnect has energy efficiency of 4.08pJ/bit at 6Gbps. The proposed wireless interconnect is implemented in TSMC 0.18µm process for demonstration of this architecture.