應用於3D-IC並使用垂直耦合電感之晶片間的無線連接

Abstract

本論文提出一個使用了耦合電感濾波器於三維積體電路的晶片間連接。跟電容耦合相比，電感耦合的連接有比較好的通訊距離且可達到30微米的距離，較長的通訊距離意味著有較能抵抗製程上對不準的現象。我們使用振幅偏移調變技術來達到信號完整的傳送。發射器包含鎖相迴路做為本地震盪器並使用電晶體開關做為被動混波器，接收器則包含了整流器來解調訊號並使用限制器放大訊號。本連接方法操作在3.5Gbps時能達到6.77pJ/bit能量效率。此無線連接使用台灣積體電路公司0.18微米製程來驗證此電路架構。

A wireless interconnect for 3D-IC applications is implemented by using coupled inductor filter design. Inductive coupling interconnect has longer communication distance to 30μm as compared with capacitive interconnect. The longer distance means that it can resist the alignment mismatches and increase the yields for packaging. We use ASK modulation technique to transmit the data. In transmitter, a PLL is used as the local oscillator, and switches are used as passive mixer. In receiver, rectifiers are used to demodulate received signal, and cascaded limiters amplify the signal. This method has energy efficiency to 6.77pJ/bit at 3.5Gbps. The proposed wireless interconnect is implemented in TSMC 0.18μm process for demonstration of this architecture.