壓合鑄造矽晶片之研究

Abstract

目前矽晶太陽能電池模組已接近$0.50/Wp的成本，但其主要成本仍在於矽晶片。而晶片製造在切片與切割矽損失仍佔相當高的成本，因此無切割損失的矽晶片鑄造技術日益重要。實驗室提出壓合鑄造矽晶片的新方法，首先建立了壓鑄設備及簡單測試，針對錫與矽的基本壓鑄行為有初步了解，了解了溫差、壓速、基板材質等因素，對晶片的外觀形狀、厚度、均勻性，與晶粒方向的影響。同時，在壓鑄有了一定成果後，也利用EBSD，對晶向及晶界加以分析，並與矽晶帶生長技術互相比較。

As the cost of silicon solar module is near $0.50/Wp, silicon wafers remain the major cost. However, to produce the wafers from ingot growth, the cost for slicing and kerf-loss silicon is still very high. Therefore, the kerf-free wafer casting technology has attracted much attention recently. Labrotary propose a novel single wafer press-casting technique to do experiment. First, a prototype system has been developed. The effects of major control parameters, such as the temperature difference, pressing speed, and the substrate materials, on the wafer shape, thickness, uniformity, and grain orientation were examined for tin and silicon. Some preliminary results were obtained and the feasibility of the technique was discussed. In addition, press-casting silicon wafers will analyse grain orientation and grain boundary by EBSD, then compare it to silicon ribbons of other grown methods.