中國IC設計產業競爭優勢及與台灣研發合作模式之探討

Abstract

近年來，中國IC設計產業快速發展，在政府政策和市場驅動兩個有利因素的結合下，成長非常快速，到2012年為止中國IC設計公司已有518家，並有二家進入全球無廠IC設計前二十大公司，分別是海思和展訊通信。至今中國已是全球第三大IC設計地區，僅次於美國和台灣，而中國半導體產業快速發展的模式，有不少是效法台灣半導體產業發展的成功經驗，本研究的主要目的是要了解中國IC設計產業快速崛起的背後因素，並歸納其與台灣研發合作之模式。 本論文首先介紹中國IC設計產業發展歷程和發展現況，然後探討中國IC設計產業的國家競爭優勢，藉以了解IC設計產業在中國的發展和未來趨勢。本論文藉由Michael Porter的Diamond Model作研究，以生產要素、需求條件、相關及支持產業和公司策略，結構和競爭對手、政府等五個構面來分析中國IC設計產業的國家競爭力。另外，本論文亦對其研發國際化，尤其是中國IC設計產業跟台灣研發合作模式，以實例的方式加以描述和解釋。

In recent years, the rapid development of China's IC design industry is due to two factors, the government policies and the growing market. In 2012, there are 518 IC design companies in China, and, among them, two are listed in the top twenty fabless IC suppliers, which are HiSilicon Technologies and Spreadtrum Communications. China is now the world’s third largest IC design country, after the United States and Taiwan. The rapid development of China's semiconductor industry follows much of the successful experience of Taiwan semiconductor industry. The main purpose of this study is to understand the factors behind the rapid rise of China's IC design industry, and find out its R&D cooperation mode with Taiwan. We first introduce the history and the current development of China's IC design industry, then we explore the national competitive advantage of China's IC design industry, so we can understand the development of IC design industry in China and its future trend. This study is based on Michael Porter’s Diamond Model to analyze the national competitiveness of China’s IC design industry from five aspects - factor conditions, demand conditions, related and supporting industries, firm strategies, structure and rivalry and government. In addition, this study uses real cases to describe and to explain the China's IC design R&D globalization, especially the cooperation mode with Taiwan's IC design industry.