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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15531完整後設資料紀錄
| DC 欄位 | 值 | 語言 |
|---|---|---|
| dc.contributor.advisor | 莊東漢 | |
| dc.contributor.author | Kuan-Ting Lee | en |
| dc.contributor.author | 李冠廷 | zh_TW |
| dc.date.accessioned | 2021-06-07T17:47:32Z | - |
| dc.date.copyright | 2013-07-26 | |
| dc.date.issued | 2013 | |
| dc.date.submitted | 2013-06-21 | |
| dc.identifier.citation | [1] http://web.nchu.edu.tw/~lschang/Thermoelectric.htm
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| dc.identifier.uri | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/15531 | - |
| dc.description.abstract | 隨著能源及環保兩大議題的重要性日漸提升，研究廢熱回收與再利用成為讓地球永續發展的一項重要環節；另外，當電子元件功能快速提升的同時尺寸卻大幅縮小，造成發熱密度增加，意味著熱管理技術備受重視。熱電材料利用其可將熱與電互相轉換的特性，應用在廢熱回收極具潛力及發展性；熱電致冷元件也具有多項優點可用來解決小尺寸電子元件的散熱問題。
熱電材料的轉換效率隨著熱電優值(ZT值)的增加而有所提升，依其工作溫度可分為低溫、中溫、以及高溫熱電材料三種。然而單一熱電材料之熱電轉換效率有限，因此工業上以P型和N型交互串聯做成的熱電模組應用最具優勢，本研究選用中溫P型的熱電材料Zn4Sb3為母材、Cu為電極，以Ni作為擴散阻隔層，Ag、Sn分別作為高熔點及低熔點金屬進行固液擴散接合，在不同時間及溫度的接合參數下，比較在熱電材料Zn4Sb3與Ni擴散阻隔層間有無預鍍錫所造成的接合強度差異，同時分析各不同金屬間之介面反應以及進行動力學分析。 實驗結果顯示，預鍍Sn系統經固液擴散接合後，在Zn4Sb3/Sn/Ni的界面會有裂縫的產生，此部位即為強度測試時發生斷裂的位置，其強度也較無預鍍錫系統的實驗結果低，約10MPa~15MPa左右；然而無預鍍Sn系統之接合結果顯示，Zn4Sb3會提供Zn直接與Ni形成一介金屬Ni5Zn21，此相與Zn4Sb3間的界面平整且連續，使得系統整體強度值較高，約達15~20MPa以上，甚至超過20MPa。雖然無預鍍錫的系統接合情形良好，但經時效測試後之成份元素分佈分析的結果顯示，於長時間的反應下，熱電材料Zn4Sb3可無限量的提供Zn使得Ni5Zn21不斷增厚直到Ni被完全消耗殆盡，隨後便沒有Ni作為擴散阻隔層來阻擋各層金屬原子間的互相擴散，最終導致整體元件的破裂與失效。 | zh_TW |
| dc.description.abstract | With the importance of energy and environmental issues increase, recycling and reuse of waste heat become an important part of sustainable development.Additionly, when the electronic component size quickly significantly reduced, resulting in heat density increases, which means thermal management technology has attracted more attention. Thermoelectric material has a feature that it can convert heat and electricity into each other, which means a great potential for applications in waste heat recovery and development; thermoelectric cooler also has a number of advantages that can be used to solve the heat dissipation problem of small size electronic components.
The conversion efficiency of thermoelectric materials increases with the thermoelectric figure of merit (ZT) increases, and they can be divided into three types according to their operating temperature. However, the conversion efficiency of one single thermoelectric material is limited, so the most conmmon application is connecting the P-type and N-type thermoelectric materials in series to become modules. In this study,we choose the P-type thermoelectric material Zn4Sb3 as a base material, Cu as an electrode , Ni as a diffusion barrier layer; elecroplate Ag and Sn layer on bonding interface respectively, as high and low melting point metal for solid-liquid interdiffusion bonding. Bonding the sample with different parameters,and analses the two systems:preheating & non-preheating. Experimental results show that the preheating system will generate cracks between the interface of Zn4Sb3/Sn/Ni, and cuase the sample fail at this position; their strength are lower than those without preheating, about 10MPa ~ 15MPa. However, the non-preheating system shows that Zn4Sb3 can provides Zn to react with Ni and form an intermetallic Ni5Zn21 directly.The interface between Ni5Zn21 and Zn4Sb3 is smooth and continuous, providing the system a higher strength value, about 15 ~ 20MPa, even more than 20MPa. Although the non-preheating system shows better bonding results, Ni still can’t be used as a barrier layer for SLID between Zn4Sb3 and Cu electrode. After aging, Ni will be completely exhausted since Zn4Sb3 can provide an unlimited amount of Zn to react with it to form Ni5Zn21. Once the Ni layer disappear, all metal atoms will interdiffuse to whole system and cause the sample fail eventually. | en |
| dc.description.provenance | Made available in DSpace on 2021-06-07T17:47:32Z (GMT). No. of bitstreams: 1 ntu-102-R00527063-1.pdf: 4853729 bytes, checksum: 3b1997c8dc3f3bd819f1c7d247d1286f (MD5) Previous issue date: 2013 | en |
| dc.description.tableofcontents | 摘要 I
Abstract II 目錄 IV 圖目錄 VI 表目錄 VIII 壹、前言 1 貳、理論及文獻回顧 3 2.1熱電材料之發展與應用 3 2.2常見之材料接合製程 11 2.2.1軟銲(Soldering)[27] 11 2.2.2硬銲(Brazing) 12 2.2.3固液擴散接合(Solid-Liquid Interdiffusion Bonding，SLID) 13 2.3擴散阻隔層 18 2.4界面反應動力學 19 2.4.1界面控制反應 21 2.4.2擴散控制反應 21 2.4.3 Sn-Zn-Ni系統 23 2.4.4 Ni-Zn系統 24 2.4.5 Ni-Sn系統 25 2.4.6 Ag-Sn系統 26 2.4.7 Cu-Sn系統 27 參、實驗方法 32 3.1 試片前處理 32 3.2固液擴散接合 33 3.3強度測試與介面分析 33 3.4時效測試 33 肆、實驗結果與討論 45 4.1 中溫熱電材料Zn4Sb3預鍍Sn後利用Sn系統與Cu電極接合 45 4.1.1 Zn4Sb3/Sn/Ni/Ag-Sn/Ag/Cu之界面反應 45 4.1.2 Zn4Sb3/Sn/Ni/Ag-Sn/Ag/Cu之介金屬長動力學 47 4.1.3 Zn4Sb3/Sn/Ni/Ag-Sn/Ag/Cu之接合強度測試 47 4.2 中溫熱電材料Zn4Sb3在無預鍍Sn情況利用Sn系統與Cu電極接合 48 4.2.1 Zn4Sb3/Ni/Ag-Sn/Ag/Cu之界面反應 48 4.2.2 Zn4Sb3/Ni/Ag-Sn/Ag/Cu之介金屬成長動力學 49 4.2.3 Zn4Sb3/Ni/Ag-Sn/Ag/Cu之接合強度測試 50 4.2.4 Zn4Sb3/Ni/Ag-Sn/Ag/Cu之時效測試 51 伍、結論 70 陸、參考文獻 71 | |
| dc.language.iso | zh-TW | |
| dc.title | Zn4Sb3中溫熱電材料與銅電極之薄膜固液擴散接合研究 | zh_TW |
| dc.title | Thin Film Solid-Liquid Interdiffusion Bonding of Zn4Sb3 Thermoelectric Material with Cu Electrode | en |
| dc.type | Thesis | |
| dc.date.schoolyear | 101-2 | |
| dc.description.degree | 碩士 | |
| dc.contributor.oralexamcommittee | 謝慧霖,王彰盟,鄭智元,黃振東 | |
| dc.subject.keyword | 熱電材料,固液擴散接合,強度測試,界面反應,擴散阻隔層, | zh_TW |
| dc.subject.keyword | thermoelectric material,SLID,strength test,interface reaction,barrier layer, | en |
| dc.relation.page | 78 | |
| dc.rights.note | 未授權 | |
| dc.date.accepted | 2013-06-21 | |
| dc.contributor.author-college | 工學院 | zh_TW |
| dc.contributor.author-dept | 材料科學與工程學研究所 | zh_TW |
| 顯示於系所單位： | 材料科學與工程學系 | |
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