背面照射雷射驗證平台實驗建立與晶片測試量化分析

Abstract

本研究完成了短脈衝背面照射雷射驗證平台及其光路系統的設計和架設，此光學實驗系統使用於各式不同電路設計之印製電路板的雷射背面照射測試，並進行電路受到雷射產生單事件效應之錯誤率分析。本研究的雷射測試系統選擇使用波長1060 nm的飛秒短脈衝雷射進行晶片測試，此雷射波段具有較佳的穿透率，因此是比較適合做為晶片背面照射的雷射源，而在光路設計中本研究使用類似於顯微鏡系統之成像模組，用於在實驗中觀察和監測待測物(Device Under Test, DUT)，還結合了可以進行XYZ三軸控制的移動平台，以此支援在測試中DUT的高精度移動和掃描功能，將這些不同模組整合之後，本研究完成了一個相比其他輻射測試驗證系統更高效，並且具有可靠性的雷射輻射驗證系統。 本篇論文討論的實驗成果，以及雷射驗證平台之測試對象，是取用台大電機系陳信樹老師團隊研發之抗輻射晶片作為DUT進行雷射測試， DUT的種類包含了傳統類比數位轉換器（Analog-to-digital converter, ADC）、有抗輻射設計之ADC、傳統數位類比轉換器（Digital to analog converter, DAC）以及有抗輻射設計之DAC，本研究透過多次的雷射實驗，探討雷射照射、掃描造成DUT訊號錯誤的關聯，通過本研究之雷射驗證平台快速、高效的測試，便有能力產生更多佐證具抗輻射設計之晶片的測試數據，可與其他如重離子或質子束之實驗成果作比對和驗證，因此本研究成果有望為抗輻射電子元件的設計與優化提供重要的依據或參考，可為相關測試技術發展奠定不少的基礎。

This study completed the design and setup of a short-pulse backside laser irradiation verification platform and its optical system. This optical experimental system is used for laser backside irradiation testing of printed circuit boards with various circuit designs and for analyzing the error rate of Single Event Effects induced by the laser on the circuits. The laser testing system in this study uses a femtosecond short-pulse laser with a wavelength of 1060 nm for chip testing. This laser wavelength has better penetration, making it more suitable as a laser source for backside chip irradiation. In the optical path design, this study uses an imaging module similar to a microscope system to observe and monitor the Device Under Test (DUT) during experiments. It also incorporates a movable platform with XYZ three-axis control to support high-precision movement and scanning of the DUT during testing. By integrating these different modules, this study has completed a laser radiation verification system that is more efficient and reliable compared to other radiation testing verification systems.

The experimental results discussed in this paper and the test subjects of the laser verification platform involve radiation-resistant chips developed by Professor Hsin-Shu Chens team from the Department of Electrical Engineering at National Taiwan University, used as the DUT for laser testing. The types of DUT include traditional analog-to-digital converters (ADCs), radiation-resistant ADCs, traditional digital-to-analog converters (DACs), and radiation-resistant DACs. Through multiple laser experiments, this study explores the correlation between laser irradiation, scanning, and signal errors in the DUT. The rapid and efficient testing provided by the laser verification platform in this study has the capability to generate more supporting test data for radiation-resistant chip designs, which can be compared and verified with other experimental results such as heavy ion or proton beam tests. Therefore, the results of this study are expected to provide important references or foundations for the design and optimization of radiation-resistant electronic components, laying a significant foundation for the development of related testing technologies.