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  1. NTU Theses and Dissertations Repository
  2. 電機資訊學院
  3. 電子工程學研究所
請用此 Handle URI 來引用此文件: http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/99777
完整後設資料紀錄
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dc.contributor.advisor李建模zh_TW
dc.contributor.advisorChien-Mo Lien
dc.contributor.author劉旻鑫zh_TW
dc.contributor.authorMin-Hsin Liuen
dc.date.accessioned2025-09-17T16:39:11Z-
dc.date.available2025-09-18-
dc.date.copyright2025-09-17-
dc.date.issued2025-
dc.date.submitted2025-07-28-
dc.identifier.citationP. Pant and J. Zelman, “Understanding Power Supply Droop during At-Speed Scan Testing,” in 2009 27th IEEE VLSI Test Symposium (VTS), pp. 227–232, 2009.
A. Srivastava and J. Abraham, “Low Capture Power At-Speed Test with Local Hot Spot Analysis to Reduce Over-Test,” in 2022 IEEE International Test Conference (ITC), pp. 446–455, 2022.
J. Saxena, K. Butler, V. Jayaram, S. Kundu, N. Arvind, P. Sreeprakash, and M. Hachinger, “A Case Study of IR-drop in Structured At-speed Testing,” in 2003 IEEE International Test Conference (ITC), vol. 1, pp. 1098–1104, 2003.
X. Lin, R. Press, J. Rajski, P. Reuter, T. Rinderknecht, B. Swanson, and N. Tamarapalli, “High-frequency, At-speed Scan Testing,” IEEE Design & Test of Computers, vol. 20, no. 5, pp. 17–25, 2003.
J. Savir, “Skewed-Load Transition Test: Part I, Calculus,” in 1992 IEEE International Test Conference (ITC), pp. 705–, 1992.
S. Patil and J. Savir, “Skewed-Load Transition Test: Part II, Coverage,” in 1992 IEEE International Test Conference (ITC), pp. 714–, 1992.
J. Savir and S. Patil, “On Broad-side Delay Test,” in 1994 IEEE VLSI Test Symposium(VTS), pp. 284–290, 1994.
W.-C. Lin, C. Chen, C.-H. Hsieh, J. C.-M. Li, E. J.-W. Fang, and S. S.-Y. Hsueh,“ML-Assisted VminBinning with Multiple Guard Bands for Low Power Consumption,” in 2022 IEEE International Test Conference (ITC), pp. 213–218, 2022.
S. Borkar, “Designing Reliable Systems from Unreliable Components: the Challenges of Transistor Variability and Degradation,” IEEE Micro, vol. 25, no. 6, pp. 10–16, 2005.
H. H. Chen, “Analysis of Vmin Variability in Complex Digital Logic via Post-Silicon Profiling,” in 2023 International VLSI Symposium on Technology, Systems and Applications (VLSI-TSA/VLSI-DAT), pp. 1–4, 2023.
V. Sontakke and J. Dickhoff, “A Survey of Scan-capture Power Reduction Techniques,” International Journal of Electrical and Computer Engineering (IJECE),vol. 13, no. 6, pp. 6118–6130, 2023.
R. Jajodia, J. Kurien, K. Zhou, T. Raja, P. Manikandan, K. Joshi, P. Singh, V. Srinath, J. Colburn, and S. Sharma, “Applications of Test Techniques for Improving Silicon to Pre-Silicon Timing Correlation,” in 2019 IEEE International Test Conference India(ITC India), pp. 1–8, 2019.
J.-X. Chen, S.-T. Liu, Y.-T. Wu, M.-T. Wu, J. C.-M. Li, N. Chang, Y.-S. Li, and W.-T. Chuang, “Vector-based Dynamic IR-drop Prediction Using Machine Learning,”in 2022 27th Asia and South Pacific Design Automation Conference (ASP-DAC), pp. 202–207, 2022.
Z.-J. Liang, Y.-T. Wu, Y.-F. Yang, J. C.-M. Li, N. Chang, A. Kumar, and Y.-S. Li,“High-Speed, Low-Storage Power and Thermal Predictions for ATPG Test Patterns,”in 2023 IEEE International Test Conference (ITC), pp. 206–215, 2023.
A. D. Singh, “Understanding Vmin Failures for Improved Testing of Timing Marginalities,” in 2022 IEEE International Test Conference (ITC), pp. 372–381, 2022.
S.-C. Hung, Y.-C. Lu, S. K. Lim, and K. Chakrabarty, “Power Supply Noise-Aware Scan Test Pattern Reshaping for At-Speed Delay Fault Testing of Monolithic 3D ICs,” in 2020 IEEE 29th Asian Test Symposium (ATS), pp. 1–6, 2020.
P. Girard, “Survey of Low-power Testing of VLSI Circuits,” IEEE Design & Test of Computers, vol. 19, no. 3, pp. 82–92, 2002.
J. Li, C.-W. Tseng, and E. McCluskey, “Testing for Resistive Opens and Stuck Opens,” in 2001 IEEE International Test Conference (ITC), pp. 1049–1058, 2001.
K. S. Kim, S. Mitra, and P. Ryan, “Delay Defect Characteristics and Testing Strategies,” IEEE Design & Test of Computers, vol. 20, no. 5, pp. 8–16, 2003.
D. Goswami, K.-h. Tsai, M. Kassab, T. Kobayashi, J. Rajski, B. Swanson, D. Walters, Y. Sato, T. Asaka, and T. Aikyo, “At-Speed Testing with Timing Exceptions and Constraints-Case Studies,” in 2006 15th Asian Test Symposium (ATS), pp. 153–162, 2006.
D. Goswami, K.-H. Tsai, M. Kassab, and J. Rajski, “Test Generation in the Presence of Timing Exceptions and Constraints,” in 2007 44th ACM/IEEE Design Automation Conference (DAC), pp. 688–693, 2007.
J. Rajski, J. Tyszer, M. Kassab, N. Mukherjee, R. Thompson, Kun-Han Tsai, A. Hertwig, N. Tamarapalli, G. Mrugalski, G. Eide, and Jun Qian, “Embedded Deterministic Test for Low Cost Manufacturing Test,” in 2002 IEEE International Test Conference (ITC), pp. 301–310, 2002.
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dc.identifier.urihttp://tdr.lib.ntu.edu.tw/jspui/handle/123456789/99777-
dc.description.abstract在行動晶片的品質驗證中,at-speed 邏輯掃描測試是一項重要工具。在初期測試樣本導入階段,若測試展現出異常偏高的 Vmin,可能導致過度測試,進而影響量產良率,這種情況尤其在測試的 Vmin 顯著高於實際系統工作負載的 Vmin 時更為嚴重,在這類情況下,工程師會對 at-speed 邏輯掃描測試進行除錯,以找出並解決造成高 Vmin 的根本原因。本論文介紹一個 Vmin 除錯的案例研究,透過一系列實驗,找出問題根源為某些測試樣本擷取了未受約束路徑的響應。我們提出了晶片前期(pre-silicon)與後期(post-silicon)的方法,藉由預防問題樣本並減少測試導入期間的除錯負擔,以改善 Vmin,這些方法已在 ATE(自動測試設備)上驗證,能有效改善 Vmin,提升幅度為 28.83mV 至 39.33mV,且測試向量僅增加0% 至 0.5%。zh_TW
dc.description.abstractAt-speed logic scan tests are an important tool to ensure desired quality in mobile chips. During initial test pattern bring-up, tests that exhibit an unexpectedly high Vmin pose a risk of over-testing and production yield loss. This is particularly problematic if the Vmin of the test is significantly higher than that of the functional system workloads. In such situations, the at-speed logic scan test is debugged to find and resolve the source of the high Vmin. This thesis describes an example case study of Vmin debug, in which a series of experiments are performed to identify the root cause as individual test patterns that capture the responses of unconstrained paths. We propose pre-silicon and post-silicon methods to improve Vmin by preventing problematic patterns and reducing the debug effort during test bring-up. Our methods have been verified on ATE to effectively improve Vmin by 28.83mV to 39.33mV with 0% to 0.5% pattern count inflation.en
dc.description.provenanceSubmitted by admin ntu (admin@lib.ntu.edu.tw) on 2025-09-17T16:39:11Z
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dc.description.provenanceMade available in DSpace on 2025-09-17T16:39:11Z (GMT). No. of bitstreams: 0en
dc.description.tableofcontentsAcknowledgments i
摘要 iii
Abstract iv
Contents v
List of Figures vii
List of Tables viii
Denotation ix
Chapter1 Introduction 1
1.1 Motivation 1
1.2 Debug Attempts and Proposed Methods 4
1.3 Contributions 8
1.4 Organization 8
Chapter2 Background and Preliminaries 10
2.1 At-speed Testing 10
2.2 Test Bring-up 12
2.3 Vmin Test 13
2.4 Suspected Root Causes for High Vmin 15
Chapter3 Per-pattern Vmin Debug 19
3.1 Per-pattern Vmin and Outlier Patterns 19
3.2 Debugging Attempt No.1: Power-aware ATPG 23
3.3 Debugging Attempt No.2: Global Dynamic Power 25
3.4 Debugging Attempt No.3: Local Dynamic Power 27
3.5 Debugging Attempt No.4: Dynamic Power around the Long Path 30
3.6 Debugging Attempt No.5: Unconstrained Paths 31
3.7 Runtime of Debugging Attempts 35
Chapter4 Proposed Prevention Methods 37
4.1 Pre-silicon Method 38
4.2 Post-silicon Method 40
Chapter5 Prevention Experimental Results 44
5.1 Pre-silicon Method 45
5.2 Post-silicon Method 46
5.3 Methods Comparison 47
5.4 Runtime of Proposed Prevention Methods 49
Chapter6 Discussion 51
6.1 Power-aware ATPG and Prevention Methods 51
6.2 Capturing Responses of Unconstrained Paths 52
Chapter7 Conclusion 54
References 55
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dc.language.isoen-
dc.subject測試診斷zh_TW
dc.subject延遲測試zh_TW
dc.subject最低操作電壓zh_TW
dc.subject未受約束路徑zh_TW
dc.subjectDelay Testen
dc.subjectVminen
dc.subjectDiagnosisen
dc.subjectUnconstrained Pathen
dc.title於邏輯掃描測試培養中除錯及預防異常高的最小工作電壓zh_TW
dc.titleDebugging and Preventing Abnormally High Vmin during Logic Scan Test Bring-upen
dc.typeThesis-
dc.date.schoolyear113-2-
dc.description.degree碩士-
dc.contributor.oralexamcommittee黃俊郎;呂學坤zh_TW
dc.contributor.oralexamcommitteeJiun-Lang Huang;Shyue-Kung Luen
dc.subject.keyword測試診斷,延遲測試,最低操作電壓,未受約束路徑,zh_TW
dc.subject.keywordDiagnosis,Delay Test,Vmin,Unconstrained Path,en
dc.relation.page58-
dc.identifier.doi10.6342/NTU202502538-
dc.rights.note同意授權(全球公開)-
dc.date.accepted2025-07-30-
dc.contributor.author-college電機資訊學院-
dc.contributor.author-dept電子工程學研究所-
dc.date.embargo-lift2025-09-18-
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