符合 3Dblox 標準的基於有限元素法（FEM）的三維積體電路 (3D-IC) 熱模擬框架

Abstract

隨著三維積體電路（3D-ICs）的日益普及，精確的熱分析對於確保其性能與可靠性至關重要。本論文提出了一個跨平台的自動化熱模擬框架，專為TSMC 3Dblox 抽象描述的3D-ICs 設計而開發。該框架整合了開源工具——FreeCAD、Gmsh 和deal.II——從設計解析到有限元素法（FEM）熱模擬，提供完整的自動化流程。 本論文所提出的系統支援異質3D-ICs結構的穩態與暫態熱分與商業工具Ansys Icepak 的比較結果顯示，我們的框架在處理具有異質材料的晶粒時能提供更高的準確度。此外，其執行效能相對於自由度（DOF）數量展現出近乎線性的可擴展性，確保在網格解析度提升時仍能保持穩定效能。 此開源解決方案可作為基於3Dblox的熱模擬流程的實用且可擴展替代方案，為早期3D-ICs熱設計提供高度可自訂的基礎。本論文詳細探討了系統架構、建模策略與關鍵實作細節。

As 3D integrated circuits (3D-ICs) become more prevalent, accurate thermal analysis is critical to ensure their performance and reliability. This thesis presents a cross-platform, automated thermal simulation framework tailored for 3D-ICs using the TSMC 3Dblox abstraction. Leveraging open-source tools—FreeCAD, Gmsh, and deal.II—the framework supports a fully automated pipeline from layout parsing to finite element thermal simulation. The proposed system supports both steady-state and transient thermal analysis for heterogeneous 3D-ICs structures. When benchmarked against the commercial tool Ansys Icepak, our framework demonstrates higher accuracy in cases involving chiplets with heterogeneous materials. Moreover, it exhibits near-linear scalability with respect to the number of degrees of freedom(DOF), ensuring consistent performance as mesh resolution increases. This open-source solution serves as a practical and extensible alternative for 3Dblox based thermal simulation workflows, providing a customizable foundation for early-stage 3D-ICs thermal design. The thesis discusses the system architecture, modeling strategies, and key implementation decisions.