AI浪潮下之半導體研發創新趨勢－以台積電為例

Abstract

AI的快速發展推動整個半導體產業的發展也帶來了變革， AI晶片的製造需要使用到異質整合、SoC、SiP封裝、Chiplet先進技術，台積電作為全球晶圓代工領導者勢必會跟上這波趨勢，憑藉自身在先進製程技術的優勢，透過SoIC與CoWoS技術提升AI效能。 本研究以台積電為個案，運用第二曲線理論、波特鑽石理論、商業模式九宮格與BCG矩陣，探討其技術創新、市場策略與全球競爭力。 AI不僅推動技術放的提升，也改變傳統半導體供應鏈，台積電應持續強化先進製程技術，並積極佈局先進封裝與異質整合領域，然而面臨三星（Samsung）與英特爾（Intel）的競爭壓力，以及隨時改變的地緣政治，例如：美國、日本與歐洲推動半導體供應鏈自主化的政策，帶來了新的產業挑戰與不同的產業競爭格局。尤其在美國總統川普2025第二任期上台後，美國主張美國優先，對台積電影響甚鉅。根據研究分析，建議應積極發展全球產能佈局，持續技術創新保持競爭優勢，並強化與AI晶片設計公司的合作，確保台積電在AI時代的技術領導地位，持續引領全球半導體產業的發展。

The rapid development of AI has driven the entire semiconductor industry forward while also bringing significant changes. The manufacturing of AI chips requires the use of advanced technologies such as heterogeneous integration, System on Chip （SoC）, System in Package （SiP） packaging, and Chiplet technology. As the global leader in wafer foundry, TSMC is expected to keep up with this trend, leveraging its strengths in advanced process technology and enhancing AI performance through SoIC and CoWoS technologies. This study examines TSMC as a case study, utilizing the Second Curve Theory, Porter’s Diamond Model, Business Model Canvas, and the BCG Matrix to analyze its technological innovation, market strategies, and global competitiveness. AI not only drives technological advancements but also reshapes the traditional semiconductor supply chain. TSMC must continue to strengthen its advanced process technology and actively invest in advanced packaging and heterogeneous integration. However, it faces competitive pressure from Samsung and Intel, as well as geopolitical shifts such as the U.S., Japan, and Europe promoting policies for semiconductor supply chain localization. These developments introduce new industrial challenges and reshape the competitive landscape. Based on research analysis, it is recommended that TSMC actively expand its global production capacity, continuously innovate technologically to maintain its competitive edge, and strengthen collaborations with AI chip design companies. By doing so, TSMC can secure its technological leadership in the AI era and continue to drive the global semiconductor industry forward.