互補式金氧半導體晶片打線研究以及高畫質影像無線傳輸

Abstract

IEEE802.15.3是設定60GHz附近頻帶之無線個人網路的標準。 藉著在60GHz附近非常寬的頻寬，無線轉輸的資料量可以達到每秒十億位元(Gbps)的資料量。高畫質影像無線傳輸是該標準製定者群提出的其中一項應用。為了使多顆晶片可以封裝在一起，我們必須釐清晶片打線對電路效能的影響。實驗指明打線的電感值比預期小。 另外，我們也對高畫質影像無線傳輸作了測試。含有1.485Gbps資料量的1080i高畫質影像被載到40GHz的頻帶，然後傳輸了1.5公尺的距離。

IEEE802.15.3 is a WPAN standard for wireless transmisson at 60GHz band.With the wide bandwidth around 60GHz it is possible to implement high data-rate,transmitting up to Gbps speed. One of the proposed usage is the wireless transmission of high-definition multimedia content. In order that several chips could be packaged in a module, the effect of bondwire needs to be clarify. Experiment shows that wire-bonding for CMOS chip is much smaller than predicted. Wireless HD video transmission is also tested. The 1080i HD video, data-rate 1.485Gbps, is up-converted to 40GHz band, and transmitted over 1.5m distance.