積體電路與系統組於無線通訊晶片專利布局策略之研究

Abstract

本論文將專利工程研究方法應用於無線通訊晶片領域，分析台灣大學電子所積體電路與系統組專利與全球專利現況之關係，預測技術發展趨勢與提出專利布局策略。 此研究發展出以電路設計與市場應用觀點為基礎的專利分析研究方法，檢索技巧上，採用切割研究主題與精確定義關鍵字提升資料精確度，對篩選之專利資訊以專利計量學方式分析各技術領域，由此歸納無線通訊晶片核心技術之專利分類，並以技術功效分析，依專利密集度分布，提出未來專利申請之方向。專利布局策略研究則是對無線通訊晶片領導企業高通(Qualcomm)、博通(Broadcom)、德州儀器(Texas Instruments)之專利分布，研究其專利於技術與應用之相關性，依各企業與其布局模型優劣勢比較提出台灣大學電子所積體電路與系統組專利能量所適合之布局策略，最後與同為學術研究單位的加州柏克萊大學積體電路組以競爭者分析比較做為總結。

This study applied patent engineering methodology on wireless communication IC to analyze patents by ICS (Integrated Circuit and System) group of GIEE (Graduate Institute of Electronics Engineering) with recent patent status; furthermore, to predict the technology trend and to propose patent planning strategies. The study developed a new patent engineering method combining the essence of IC design knowledge and market intelligence. In terms of patent searching technique, the subject was divided into several individual topics to identify true keywords. After patent information was collected, two patent analyses were applied. Firstly, the IPC (International Patent Classification) was used to define the technology scope of wireless communication, and Technology vs. Function Patent Map Analysis was used to seek the new oppoutunities where ICS can apply patents. Secondly, dominant companies in the wireless industry such as Qualcomm, Broadcom, and Texas Instruments’ patent portfolio were studied. According to the result of patent analysis, this paper proposed an adequate patent planning strategy for ICS group. Lastly, a comparison of patent publications was done with INC (integrated circuit) group of UC-Berkeley.