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標題: | 移動式感應加熱於滾輪熱壓大面積微結構之應用 Replication of Large-area Microstructures with Moving Induction Heating and Roller Embossing |
作者: | Wei-Cheng Hung 洪瑋晟 |
指導教授: | 楊申語(Sen-Yeu Yang) |
關鍵字: | 熱壓印成型,感應加熱,滾對板,大面積,微結構, Hot embossing,Induction heating,Roll-to-plate(R2P),Large area,Microstructure, |
出版年 : | 2018 |
學位: | 碩士 |
摘要: | 微熱壓成型技術具有成本低廉、高轉寫率等優點,其中最主要的缺點是壓力不均勻、壓印面積受限制和升、降溫耗時,由於傳統熱壓機所使用的加壓機構為板對板加壓機構,此壓印方式易受到壓板表面粗糙度及壓板平行度等因素影響,造成壓力分佈不均勻且面積受限;壓板加熱與冷卻,需要整塊熱盤升、降溫,導致製程耗時且耗費能源。
本研究使用軟滾輪施壓,使壓力均勻且擴大壓印面積;並使用單面式感應加熱技術,使升溫快速,開發移動式感應加熱應用於滾輪熱壓印製程。本研究開發感應加熱於移動平台上,使加熱面積不受線圈長度限制,達到更大面積的快速加熱。 首先利用COMSOL分析軟體,模擬單面式線圈對鎳模具感應加熱的表面升溫,觀察在不同線圈幾何對於鎳模具的加熱趨勢。並以實驗驗證在相同的進給速率164 mm/min下,藉由調整功率大小和擺放磁場集中器,可提升整體溫度均勻性,移動式感應加熱可使面積100×100 mm2的鎳模具溫度控制小於20℃。為避免基材與模具在滾壓後變型,本實驗開發真空吸附平台,利用矽膠板將基材與模具吸附在平台之上,不易產生變型。也進一步以風冷強制對流散熱,解決降溫耗時的問題,開發出快速大面積升降溫且施壓均勻的熱滾輪壓印設備。 本研究設計移動式感應加熱應用於滾輪熱壓印V型溝槽微、微透鏡陣列結構於長寬厚100×100×0.1 mm3的PC基材上,轉寫率皆可達96%以上,生產週期時間約2 min。藉由光通量量測證實V型溝槽成品具良好光學應用,證實移動式感應加熱結合滾輪壓印複製微結構製程可應用於高分子光學元件之製備與可行性。 Recently, induction heating technology has been widely used to increase the heating efficiency in injection mold and hot embossing process. However, how to enlarge the heating area limited by the characteristic of induction coil and the power of induction heater is a great challenge. In this study, moving induction heating with roll-to-plate hot embossing is proposed and demonstrated. First, a commercial simulation software, COMSOL Multiphysics, was used to simulate the temperature of the nickel mold after heating. The heating trend of the nickel mold in different coil geometries was analyzed. The result shows that the single layer frame coil has the better heating effect. Adjusting power and placing ferrites at different zones on the coil to effectively improve temperature uniformity at the same feed rate 164 mm/min were confirmed. It will enable to control the temperature differential of 100×100 mm2 nickel molds less than 20°C. In order to avoid substrate and mold deformation after rolling. A vacuum absorbing was implemented on platform, on which the substrate and mold was placed. The cooling system employed to increase cooling efficiency. In this study, the moving induction heating system and the roll-to-plate of hot embossing facility were combined to realize a high heating rate, large area and uniform pressure in process. The periodic V-cut structures can be replicated on PC substrate by using this process. Replication results indicated that replication rates were higher than 96% at 190°C and 5 kgf/cm2, whereas the cycle time was about 2 min. The optical measurement showed that the illuminance was enhanced 39% by V-cut film. The study proves the potential of this moving induction heating and roller embossing for fast fabrication of microstructure onto polymeric substrate. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/21957 |
DOI: | 10.6342/NTU201803449 |
全文授權: | 未授權 |
顯示於系所單位: | 機械工程學系 |
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