多孔性黏土及聚脲酯-醯亞胺複合材料之製備與性質探討

Abstract

本論文研究主要分成三大個部分: 第一個部分乃是利用不同重量比的四乙氧基矽烷( Tetraethyl Orthosilicate , TEOS )加入奈米黏土中，使其進入奈米黏土的層與層之間，再使用酸當觸媒，使四乙氧基矽烷與奈米黏土進行溶膠-凝膠( Sol-Gel )反應，在奈米黏土的表面及層與層之間產生多孔性的二氧化矽無機粒子，利用此方法，使奈米黏土具有多孔洞的特性，並利用動態光散射雷射粒徑儀測試儀( Dynamic Light Scattring , DLS )、比表面積與孔隙分佈分析儀 ( Specific Surface Area & Pore Size Distribution Analyzer by as Adsorption Method )，測定其分散性和孔洞體積等等。第二部分乃是合成聚脲酯-醯亞胺膜( Poly( urea-imide ) film )，固定二苯基甲烷-4,4'-二異氰酸酯( Methylene Diphenyl Diisocyanate , MDI )的含量，調整不同比例的均苯四甲酸二酐( Pyromellitic Dianhydride , PMDA ) 和 4,4'-二氨基二苯醚( 4,4'-Oxydianiline , ODA )，再以一階段方法共聚合反應形成聚脲酯-醯亞胺，並利用熱重分析儀( Thermal Gravimetric Analysis , TGA )、拉力試驗機( Tensile Strength Test )，測定其熱性質、機械性質等等。第三部分乃是結合第一、二部分所合成之多孔性奈米黏土及聚脲酯-醯亞胺，製備出多孔性黏土/聚脲酯-醯亞胺奈米複材( Poly( urea-imide )/Clay ) Nanocomposite )，並研究不同添加量的多孔性改質黏土對聚脲酯-醯亞胺的性質影響，由實驗結果可以得知，隨著改質奈米黏土含量的增加，多孔性黏土/聚脲酯-醯亞胺奈米複合材料的熱性質、機械性質皆有所提升，並由於加入了多孔性的奈米黏土，介電性質有所下降。

In my thesis, it is composed of three major parts : In first part, I introduce different weight ratios of TEOS into layer of nano porous clay, and use acid as a catalyst to go through a condensation procedure named Sol-Gel reaction between TEOS and hydroxyl groups on the clay and thus resulting mesoporous silica inorganic nanoparticles or inside between layer and layer. On the basis of Dynamic Light Scattring ( DLS ), Specific Surface Area & Pore Size Distribution Analyzer, the dispersion property and pore volume can be controlled by varying the mass ratio TEOS/Clay and adding trace amount of acid as catalyst. The follow by second part, by utilizing One-step Method and different mass ratio of PMDA, ODA, and MDI, different structures of Poly( urea-imide )( PUI ) can be synthesized. The thermal stability and mechanical property are measured by Thermal Gravimetric Analysis ( TGA ) and Tensile Strength Test. The final parts is the combination of section one and two, Nano porous clay are blended with Poly( urea-imide ) to produce Poly( urea-imide )/Clay Nanocomposite. It can be determined by Thermal Gravimetric Analysis ( TGA ) and Tensile Strength Test that the thermal stability and mechanical property are enhanced by increasing the mass ratio between Clay and PUI. In addition, the dielectric constant is decreased with the increasing mass ratio of Clay/PUI.