以覆晶微型 LED 封裝製程研製透明微顯示器

Abstract

擴增實境（AR）是一種將數位元素即時疊加於現實環境中的技術，旨在強化物理世界並提供豐富的互動體驗。AR的核心價值在於透過提供額外的資訊和背景，顯著提升使用者在現實世界中的感知與效率。其應用範圍廣泛，從汽車導航指令的簡化提示，到複雜機械3D模型的現場可視化，跨足日常生活與專業領域。本質上，AR透過彌合數位與實體領域的鴻溝，正在徹底改變我們與世界互動的方式，成為在各行業創造更高效、更身臨其境體驗的關鍵工具。 我開發一款半透明顯示系統架構來解決傳統CMOS晶片背板多採用矽基板而導致不透光的問題，且為達到輕薄化與透明化。為了解決背板不透光的問題且兼具機械強度，我設計了兩種結構：第一是使用深反應離子蝕刻（Deep Reactive Ion Etching, DRIE）技術，並計算出背板元件穿透率70%；這樣能使中央區域保持光學通透，並降低人眼異物感。第二，先在矽基板上面做電路設計以及製程，再去切割成6*6mm和3*3mm的小尺寸矽片。這兩種prototype都會與自行設計並製作的Micro-LED做flip chip bonding，以提升整體光學穿透性。 在這裡，將使用半導體製程技術來完成Micro-LED顯示系統模組。分別設計並製作矽基板以及μ-LED，最後再將矽基板以及μ-LED做flip clip bonding，並證明此架構可以成功的完成 flip chip，並展示出以 μ-LED 在下的部分透明結構，並為此透明顯示器的雛形提供了有價值的參考，初步演示一種新穎的顯示系統模組。得到階段性成功，期待未來可以將此技術拓展至多種 AR/VR應用領域。

Augmented Reality (AR) is a technology that overlays digital elements onto the real-world environment in real-time, aiming to enhance the physical world and provide rich interactive experiences. AR's core value lies in significantly improving user perception and efficiency by providing supplementary information and context within the real world. Its applications are extensive, spanning from simplified cues for automotive navigation to the on-site visualization of complex mechanical 3D models, thus bridging everyday life and professional domains. Essentially, AR is revolutionizing how we interact with the world by bridging the gap between the digital and physical realms, making it a critical tool for creating more efficient and immersive experiences across various industries. In response to the opaqueness issue inherent in traditional CMOS chip backplanes, which primarily utilize silicon substrates, I developed a semi-transparent display system architecture aimed at achieving both thinness and transparency. To overcome the backplane's opacity while maintaining mechanical strength, I designed two distinct structures. The first approach employs Deep Reactive Ion Etching (DRIE) technology, calculating the backplane component's transparency to be 70%. This design ensures the central area remains optically transmissive and reduces the foreign body sensation perceived by the human eye. The second approach involves fabricating the circuit design onto a full silicon substrate first, which is then diced into small slices measuring 6*6mm and 3*3mm. Both prototypes will undergo flip-chip bonding with a self-designed and fabricated Micro-LED to enhance overall optical transparency. Herein, semiconductor fabrication technology is utilized to complete the Micro-LED display system module. This involves separately designing and fabricating the silicon substrate and the μ-LED, followed by their final flip-chip bonding. We successfully demonstrate the feasibility of this flip-chip architecture and present the semi-transparent structure with the μ-LED array positioned on the bottom. This achievement offers a valuable reference for the prototype of such a transparent display and preliminarily demonstrates a novel display system module. Having achieved this staged success, we anticipate expanding this technology into various AR/VR application fields in the future.