Browsing by Author Cheng-En Hsu
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| Publication Year | Title | Author(s) | Department |
|---|---|---|---|
| 2020 | 應用於互補式金屬氧化物半導體微機電製程平台之無接合封裝技術 Zero-Bonding Packaging Technology for CMOS-MEMS Process Platform | Cheng-En Hsu; 許誠恩 | 應用力學研究所 |