Browsing by Author Ju-Hui Chuang
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Publication Year | Title | Author(s) | Department |
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2020 | 電子封裝高銀合金線材與帶材通電流及退火之晶粒結構研究 Study on the Grain Structure of Electronic Packaging of High Ag alloy Wire and Ribbon under Current Stressing and Annealing | Ju-Hui Chuang; 莊如慧 | 材料科學與工程學研究所 |