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標題: | 電子封裝高銀合金線材與帶材通電流及退火之晶粒結構研究 Study on the Grain Structure of Electronic Packaging of High Ag alloy Wire and Ribbon under Current Stressing and Annealing |
作者: | Ju-Hui Chuang 莊如慧 |
指導教授: | 莊東漢(Tung-Han Chuang) |
關鍵字: | 銀合金線,電遷移,輥壓,退火,織構,電子背向散射繞射分析, silver alloy wire,electromigration,rolling,annealing,texture,EBSD, |
出版年 : | 2020 |
學位: | 碩士 |
摘要: | 本研究分析電子封裝使用之純銀及高銀合金銲線,可分為於電遷移效應中及變形、熱處理製程中兩面向的微結構變化分析。 第一部分使用17.5um線徑之純銀及高銀合金線材,於室溫下通以1.23*105A/cm2之電流,已知電遷移效應下的質量傳輸主要由電子風力及靜電場力所致,焦耳熱效應亦伴隨其中,又銀合金線以表面擴散為其主要擴散途徑,本研究即以電子背向散射繞射分析技術(EBSD)分析線材在不同通電時間參數下之微結構、織構(texture)變化,亦比較前人以銀鈀(Ag-Pd)及銀金鈀(Ag-Au-Pd)合金線材之電遷移研究,並試從電子風力與差排之間的交互影響,探討不同成分之線材其微結構變化差異的原因。 第二部分輥壓退火帶材之實驗,以0.623mm之純銀線輥壓變形至0.1mm之帶材,並以不同溫度及時間參數進行退火熱處理,已知線材經變形後,以退火製程釋放出材料內部儲存的應變能,退火過程又可分為的兩個部分:再結晶及晶粒成長,前者以降低差排密度為驅動力,而後者則透過減少晶界面積,進一步降低晶界能,從晶粒取向變化的角度討論,材料內部晶粒在變形時,傾向以達到所需應變,能儲存最大應變能之滑移系統組合進行,而退火過程的晶體排列,則以能快速降低差排密度亦或釋放出最大應變能為原則,上述原因使得材料內部晶粒經過變形、退火等一連串製程,在晶體排列上具異向性,此部份研究亦以EBSD技術,結合SEM背向電子散射圖(BSE)資訊,從輥壓後帶材晶粒形貌觀察、應變能釋放分析、ODF(orientation distribution function)分析織構,及晶界種類、佔比變化,試探討銀線經輥壓退火後織構的發展及微結構變化。 The research analyze pure silver and high-silver alloy wire for the use of package of electronic. It contains two part: microstructure evolution of electromigration and annealing process following deformation. First part,the 17.5 micron diameter pure silver and high-silver alloy wire are used for current test of 1.23*105A/cm2 .The current-induced mass transport is mainly the result of electron wind and electrostatic field with Joule heat included. Furthermore,surface diffusion is main diffusion of atom diffusion path for Ag-alloy wire. Based on above knowledge,the research analyze microstructure and texture evolution of several parameters of current testing time by applying Electron Backscatter Diffraction technique(EBSD).Besides,compare electromigration effect of Ag-Pd and Ag-Au-Pd alloy wire studied by previous reserchers .In the end, attempt to understand the difference of microstructure evolution of different composition from the point of interaction between the electron wind and dislocation. In the second part:annealing experiment following rolling process,diameter of 0.623mm pure silver wire is used to rollig to ribbon of 0.1mm thickness. After deformation,the wire release strain energy during annealing which can be divided into two part,recrystallization and grain growth.Reducing dislocation density is the main driving force of the former.On the other hand, the later reduce grain boundary area in order to further lower the grain boundary energy. Discuss about change of grain orientation,the grain tend to deform with combined slip systems which can maximise the work done on the material for the required strain amount.Besides,annealing process progress based on releasing maximum strain energy in principle.Due to the reasons mentioned above,the material have an anisotropic structure after a series of deformation and annealing process.This part of the research,as the former,studied by applying EBSD technique combined with SEM microscopic information. Furthermore, from the point of grain appearance, strain energy release analysis ,orientation distribution function,and fraction of different grain boundary type,the research attempt to analyze microstructure evolution and texture development during the process of deformation and annealing. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/17921 |
DOI: | 10.6342/NTU202003338 |
全文授權: | 未授權 |
顯示於系所單位: | 材料科學與工程學系 |
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