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http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/84551
標題: | Ka-頻段天線系統封裝基板材料特性萃取及貼片天線設計 Antenna-in-Package substrate dk/df extraction and patch antenna design at Ka-band |
作者: | Ming-Yu Song 宋明諭 |
指導教授: | 盧信嘉(Hsin-Chia Lu) |
關鍵字: | 微帶線,接地共面波導,TRL,散射參數矩陣,正切損耗,介電常數,貼片天線, Microstrip,grounded coplanar waveguide,TRL,scattering parameters,loss tangent,dielectric constant,patch antenna, |
出版年 : | 2022 |
學位: | 碩士 |
摘要: | 本論文的研究內容分成二部分,第一部分為利用傳輸線來萃取板材介電常數及正切損耗,第二部分為貼片天線模擬及量測。 第一部分使用微帶線與GCPW兩種傳輸線,再利用廣義TRL的方式,計算矩陣特徵值,再運用長短傳輸線法計算衰減常數(α)與相位常數(β),由於這兩種傳輸線在高頻下並沒有相關的數學式可以由α及β推導至ε及tanδ,所以本文使用Ansys研發的高頻結構模擬器(high frequency structure simulator, HFSS)模擬,藉由調整HFSS中的ε及tanδ使得模擬中的α及β與量測相同,來萃取高頻板材參數。也討論影響介電常數及正切損耗的因素。PCB電路板時常為了保護電路會使用防焊油墨及表面處理(surface finished),本文也將會討論加入防焊油墨及表面處理後對傳輸線的電氣特性的影響,也將此兩種情況下的傳輸線進行防焊油墨的材料萃取及經過表面處理後的傳輸線板材萃取。量測部分利用欣興電子的載板製程,使用MGC的HL972LF(LD)作為基板材料及Taiyo AUS SR1作為防焊油墨材料進行萃取。不同種的傳輸線對於萃取板材的結果有些不同,微帶線所萃取出來的偏高,而GCPW所萃取出來的偏低,二種傳輸線萃取出來的ε差異約在2%左右,與板材廠商所提供的量測結果來看在頻率10GHz的板材參數,微帶線所萃取出的結果較GCPW較準。防焊油墨的ε萃取兩傳輸線的萃取結果都偏低,表面處理對於萃取影響不大。 第二部分將會介紹天線的相關理論及設計以及饋入端的設計,並且進行模擬與量測2×2貼片天線,並且討論量測及模擬上的誤差。 This thesis is divided into two parts. The first part is to extract the dielectric constant and loss tangent by using the transmission lines. The second part is the simulation and measurement, of patch antenna. The first part uses two transmission lines, microstrip line and GCPW, and then uses the generalized TRL method to calculate the matrix eigenvalues, and then uses the long and short transmission line method to calculate the attenuation constant(α) and phase constant(β). Since these two transmission lines don't have equations to relate α and β to ε and tanδ, so this thesis uses the high frequency structure simulator (HFSS) developed by Ansys to simulate, compare the simulation with the measurement, and then extract the ε and tanδ from S-parameters. This thesis also explains the factors affecting the dielectric constant and loss tangent extraction and analyzes different results from different transmission lines. The influence of solder mask and surface finished on the electrical characteristics of the transmission line are also disussed. The fabrication of carrier is provided by Unimicron. The material used is MGC's HL972LF (LD) as the substrate material and Taiyo AUS SR1 as the solder mask material of the carrier board. The difference on extracted ε from two transmission lines is about 2%. The second part will introduce the theory and design of the patch antenna, and simulation and measurement of the 2×2 patch antenna array. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/84551 |
DOI: | 10.6342/NTU202203278 |
全文授權: | 同意授權(限校園內公開) |
電子全文公開日期: | 2022-09-30 |
顯示於系所單位: | 電信工程學研究所 |
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U0001-1109202206213300.pdf 授權僅限NTU校內IP使用(校園外請利用VPN校外連線服務) | 15.98 MB | Adobe PDF | 檢視/開啟 |
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