以DLP發展光纖立體顯微量測系統之研究

Abstract

隨著電子產業的微小化，光學量測技術紛紛朝向微小尺寸表面量測發展。本研究之目的在開發研究高工件適應性的微機械元件三維輪廓尺寸量測系統－光纖立體顯微術（Image Fiber Stereo Microscopy），在現有基礎上提出了一種微三維逆向工程測試理論及系統設計方法。 本研究主要針對微三維工件做高效率的檢測而發展的一種全新開發檢測技術，此系統利用了結構光及相位移法原理，為一種新式數位結構光立體顯微術，利用了影像光纖傳像束所具有任意調整方向及長光路的優點，取代傳統大量的透鏡組成，直接將結構條紋光傳遞至量測物件上，因此整體模組化的量測頭也可以有效的縮小體積及移動方向，由實驗結果可知，此套系統可有效的對如微機電元件之類mm~μm等級的量測物件提供良好的量測方案。 經由選擇適合的條紋結構光週期，本系統可達到約5μm的量測準確度及2μm的量測標準差。

As the minimization of electric components spreads out, optical measurement techniques are developed toward micro-scale profile measurement. This research is proposed to construct a prototype of high flexibility precision 3D measurement system, Image Fiber Stereo Microscopy, for the purpose of profile and dimension of micro components. It provides the concept and system design of micro 3D reverse engineering. On the basis of the principle of structured light and phase shifting, a novel digital stereomicroscopes system for micro-3D inspection is presented in this research. Because the image fiber has many advantages like direction changing and long distance transmitting without extra optics, this system also adopts it to project the structured light instead of the pure optical systems. Thus, the measurement head is very small, the measurement distance and orientation could be changed expediently. Experiments showed this is a useful system to measure the 3D profile of meso- to micro-scaled parts, such as the MEMS product. Through choosing appropriate pitch of the structure light, the accuracy and standard deviation σ of the system can reach 5μm and 2μm.