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標題: | 脆性材料微孔噴蝕製程之研究 A study of micro-holing of brittle materials using micro-abrasive jet machining |
作者: | Li-Chun Chen 陳立春 |
指導教授: | 廖運炫教授 |
關鍵字: | 脆性材料,噴蝕,護膜樣孔尺寸,過切噴蝕, brittle materials,sand blasting,mask opening size,underetching, |
出版年 : | 2005 |
學位: | 博士 |
摘要: | 摘要
在磨料微噴蝕製程(micro-abrasive jet machining)中,護膜(mask) 用以保護母材不想被噴蝕之處。拜感光性樹脂之賜,護膜能在雙面對準曝光機、曝光、顯影下,於晶片待加工位置形成對位準確的護膜開口(mask opening),使有量產優勢的噴砂製程能接續感測計等微機電晶片製作之上游製程,在晶片正確位置大量噴蝕各种流道孔。本製程之精密度完全取決於護膜之「抗蝕性」及護膜上「樣孔尺寸之正確性」二要件,本論文將就此二要件分別提出新的構想與辦法,期能使本噴蝕製程更趨精密與可靠。 本研究嘗試以雙層式護膜取代傳統上單層式護膜:內層是一種能與工件密切結合且對磨料噴蝕抵抗力甚弱的水溶性樹脂,外層則是混有感光樹脂,對磨料抗蝕力極佳又能與內層緊密結合的膠脂混合體。如此之雙層式護膜具有原本兩相衝突的特性:噴蝕時對磨料强的抗蝕力及完工後自母材輕易剝離性。水溶性內層樹脂可以輕易被水溶解,雙層保護膜隨自母材剝離,避免過去易傷及工件母材上電子電路的缺點。 在微孔噴蝕的過程中,因回砂因素導致所創孔洞之實際尺寸大於設計尺寸,實務上,須憑經驗,靠微調,補償護膜樣孔尺寸,才能滿足噴蝕製程所要求。本研究探討護膜下侵蝕 (underetching),根據噴蝕理論,將補償,量化成方程式,以正確求出護膜樣孔應補償尺寸,一次滿足噴蝕製程之要求。經實驗證實,護膜之樣孔尺寸,經過本量化成方程式求出正確補償後,正反面噴蝕孔最大誤差分別為2.4%及3.0%,誤差值均很小,且在合理範圍內。因此本章所推導之護膜樣孔方程式,應能有效而可靠地被應用於護膜樣孔之計算,有助於提升噴蝕製程之尺寸精度。 本研究提出新的構想與辦法,預期微噴蝕製程之位置精度、尺寸精度均能獲致具體改善,進而對製程之改進作出貢獻。 Abstract In the process of powder blasting, mask was closely stuck on the substrate to protect the area of substrate not to be powder blasted. The quality characteristics of this process depend completely on the erosion resistance of mask to the powder blasting and the accuracy of mask opening size. this paper will provides a new idea and methods to improve the precision and achieve a good quality of this process. Instead of one protective layer for mask that is conventionally used, two layers are coated on the surface of the substrate material. The inner layer is water-soluble resin with excellent adhesion to the substrate but having weak resistance to powder erosion, and the second layer is a photosensitive oligomer that is adhered well to the first layer and has very high resistance to powder erosion. Once the openings of the second layer are formed at the desired positions via a photo-etching method, a printing method, or other methods, the holes or grooves can be obtained by etching through the openings of the second layer to the first layer and the substrate by a powder blasting process. Then the whole protective coating is easily and smoothly stripped off without any damage to the substrate by dissolving the first layer with water. Such a protective coating possesses two contrary characteristics: high resistance to powder blasting and easy removal from substrate after powder erosion. Due to two layers are coated on the surface of the substrate material, the material of each layer can thus separately be developed to its utmost properties by researcher, and therefore, more space is created for developing in the powder blasting process. In creating a hole on brittle materials by double-side sand blasting, the rebounding sand particle flux during the process may result in underetching at the edge of the mask opening, and leads to a larger sized fluid hole than desired one. In practice, determination of the correct mask opening size was made mainly by trial and error or with fine-tuning of the masking process and compensation for mask wear. In this paper, relationships between the mask opening size and desired size of a hole on both the front and the back sides of the substrate are derived. For the front side, by taking into account the underetching effect, an equation is derived based on kinetic energy theory. For the back side, there is negligible rebounding sand particles, and the mask opening size is set to be equal to the desired size of the hole. Experiments were conducted to verify the derived relationships. It is found that the measured sizes of the eroded holes on both the front and the back sides of the wafer substrate are distributed normally. The desired hole sizes deviate slightly from the median of a normal distribution curve, and the maximum predicted errors are 2.4% and 3.0% for front side and the back side sand blasting, respectively. The very satisfactory result of the predicted errors for various hole size shows that the derived relationships is applicable for determination of mask opening size in powder blasting process. With this improvement of hole accuracy in size, it is expected that the powder blasting process will provide another choice for the process of machining holes on brittle materials. |
URI: | http://tdr.lib.ntu.edu.tw/jspui/handle/123456789/24171 |
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顯示於系所單位: | 機械工程學系 |
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