精微線材彎壓成形產品之性能預測及模擬分析

Abstract

半導體檢測為製程中的重要流程，可篩選晶片不良品以避免生產成本的浪費，而精微線材彎壓成形產品做為晶片與測試機台間傳遞訊號的橋樑，為檢測過程中的關鍵零件。為符合檢測需求，製造商須不斷優化產品設計以提升各項性能，如接觸力、耐電流(Current Carrying Capability, CCC)與使用壽命等。本論文為延續性計畫，前人已進行產品尺寸對各項性能之分析並建立初步預測公式。本論文將延伸至產品與導板交互影響分析並完善接觸力及CCC預測公式。建立快速預測產品接觸力及CCC的方法，藉以協助合作廠商加速設計流程為本論文研究之目的。 本論文將以前人建立之有限元素法分析模型為基礎，包含產品作動模型及電熱模型，對模型進行優化使其更接近真實樣態及條件，並透過接觸力測試及CCC測試之實驗結果比對確認模型準確性。接續以優化後作動模型對產品於導板中作動過程進行變形機制與受力分析，參考廠商之產品及導板尺寸設計範圍進行模擬以了解各項尺寸因子對接觸力之影響，並延伸至側向力之分析。最後以模擬結果建立接觸力及側向力預測公式，透過模擬與實驗驗證接觸力公式預測誤差5%。 在產品CCC研究方面，同樣參考廠商之產品尺寸設計範圍，以優化後電熱模型進行分析。再由前人建立之預測公式架構為基礎，增加其未考量之參數因子並以模擬結果建立預測公式，透過模擬與實驗驗證此CCC預測公式誤差小於1%，較原預測公式下降約7%。同時也將以此模型進行不同使用條件下的CCC分析以及接觸風險分析，幫助了解產品於實際可能發生的各種變數下的CCC表現以及是否有互相接觸的風險，提供優化產品設計之參考。 本論文完成精微線材彎壓成形產品性能的接觸力相關預測公式及CCC預測公式，未來可幫助產品設計流程進行快速且大量的性能預測，找出最佳設計。

關鍵字：精微線材、彎壓成形、有限元素分析、接觸力、耐電流、性能預測公式

Semiconductor wafer testing is a critical process in manufacturing, as it filters out chips’ defects and avoid unnecessary production costs. The Fine-Wire product made by Bending-Compression forming process plays an important role transmitting signal between the chip and the testing equipment. To meet testing requirements, manufacturers must continuously optimize product design to improve various specifications and performance, such as contact force, Current Carrying Capability (CCC), and product lifespan. This thesis is part of a continuing research project. Previous work has analyzed the influence of product dimensions on performances and established preliminary prediction formulas. Building on that foundation, this study further analyzes the interaction between the product and probe hole, and refines the prediction formulas for contact force and CCC. The aim of this thesis is to establish methods that can predict contact force and CCC of product rapidly to accelerate design process for collaborating manufacturers. This thesis utilizes some previous researches based on finite element method, including an actuation model and a CCC testing model. The models are optimized to better reflect real-world behavior and validated through comparisons with experimental results from contact force and CCC tests to ensure accuracy. The optimized actuation model is then used to analyze the deformation mechanisms and forces during the product's operation within a probe hole. Simulations are conducted based on the dimensional design range of both the product and probe hole, to evaluate the influence of each dimensional factors on contact force, extending further to the analysis of lateral force. Finally, predictive formulas for contact force and lateral force are developed based on simulation results, with validation showing the contact force prediction error is less than 5%. In the study of CCC, analysis is based on the dimensional design range with the optimized CCC test model. Building on the predictive formula in previous research, this study introduces additional parameters and develops a new predictive formula based on simulation results. Validation through simulation and experimentation confirms that the error of this new formula is under 1%, approximately 7% lower than the original prediction model. The model also performs analyses of CCC and contact risk under various conditions to predict product's performance under different potential real-world scenarios and assess any risk of contact, thus offering a reference for design optimization. This thesis successfully establishes predictive formulas for the contact force and CCC of the Fine-Wire product made by Bending-Compression forming process, enabling large-scale performance prediction rapidly during the product design process and facilitating the identification of optimal designs.

Keywords：Fine Wire Rods、Bending-Compression Forming、Finite Element Method Analysis、Contact Force、Current Carrying Capability、Performance Prediction Formula