開發微波頻段電磁干擾量測系統暨檢測石墨烯複合材料電磁屏蔽效果

Abstract

科技的進步飛速，其中半導體產業的發展可以說是所有研究的基礎。半導體元件內部的電晶體密度提高，元件之間的距離也不斷縮小，追求效能提升的同時，電磁干擾的問題卻也日益嚴重，因此出現了各種解決電磁干擾的方法，包括改變電路佈局、元件的擺放位置或是使用電磁屏蔽材料。電磁屏蔽材料的研發需要不斷的透過實際量測數據進行反饋，並根據量測結果修正材料的製作參數，因此電磁干擾之量測系統的量測成本和速度是研究電磁屏蔽材料的關鍵，若每次量測都使用租借成本昂貴且排程時間冗長的電波暗室，將不利材料的研發進度。 本論文提出一套電磁干擾近場掃描量測系統，利用電壓隨耦器(Voltage Follwer)電路，創造出頻率可控的電磁輻射源，量測平台符合國際IC電磁干擾量測標準IEC 61967-1定義的10 cm × 10 cm四層板PCB，以及IEC 61967-3晶片表面掃描的量測規範，可快速且有效的量測各種電磁屏蔽材料於不同頻率下的屏蔽效率，頻率範圍含括IEC 61967-3所訂定之規範。此量測系統具有高度靈活性，既可量測薄膜型態的電磁屏蔽材料，也可將屏蔽材料封裝在IC上再進行量測，可在材料開發的早期階段就快速取得大量的電磁屏蔽效率量測數據，建立材料製作參數與屏蔽效能的對應關係，大幅提升屏蔽材料的研發速度。

The advancement of technology is growing rapidly, and one of the most important industries is semiconductor. As the density of transistors within semiconductor devices continues to increase and the spacing between chips decreases, the issue of electromagnetic interference (EMI) has become increasingly severe. Various methods to mitigate EMI have been proposed, including modifications to circuit layout, adjustments to chips placement on the circuit board, and the use of electromagnetic shielding materials. The development of EMI shielding materials requires continuous feedback through actual measurement data. Therefore, the cost and efficiency of EMI measurement systems are critical to the research and development of shielding materials. Anechoic chambers, which are expensive to build and takes long scheduling times to rent it, is not a good choice in early stage of material development. This work proposes a near-field EMI scanning measurement system that utilizes a voltage follower circuit to generate an electromagnetic radiation source with tunable frequency. The measurement platform complies with the international standard IEC 61967-1 for EMI testing of integrated circuits, specifically a 10 cm 10 cm four-layer PCB, as well as the IEC 61967-3 standard for IC surface scanning. The system enables effective evaluation of the shielding effectiveness of various materials across a wide frequency range, fully covering the specifications defined by IEC 61967-3. This measurement system offers high flexibility, allowing both the characterization of film-type shielding materials and the shielding materials directly packaged onto ICs. It help collecting shielding effectiveness data during the early stage of material development, enabling the establishment of correlations between fabrication parameters and shielding performance, significantly accelerating the R&D process of EMI shielding materials.