晶圓代工製造之廢氣處理設備廠商的創新管理

Abstract

本研究以半導體晶圓製造中的廢氣處理設備產業為對象，探討其在創新管理與技術合作上的策略選擇，並聚焦於「聯合創新 (Joint Innovation) 」模式的實務適用性與潛在優勢。隨著先進製程技術快速演進及ESG法規日益嚴格，IC製造業者對廢氣處理設備的效能、安全性及合規要求同步提升，設備供應商唯有透過創新管理與與客戶緊密協作，方能掌握競爭優勢。 本研究透過文獻探討、問卷調查與半結構式訪談，收集16位來自IC製造業內部不同部門 (設備使用單位、採購、EHS) 的專業人員意見，分析其對設備創新與聯合研發的看法。結果顯示，高達93.75%的受訪者表示願意參與與設備供應商的聯合創新，且多數期望以「需求回饋」、「現場測試」等方式提供支持。受訪者亦指出，聯合創新可促進技術契合度、提升研發效率，並分攤開發風險，是最適合應用於廢氣處理設備領域的創新模式。 研究亦指出，供應商在創新管理上具備如法規遵循經驗、技術客製彈性與積極溝通等優勢，但也面臨需求回饋機制不完善、創新提案不夠主動、以及變更應對不夠敏捷等挑戰。供應商若欲有效推動創新專案，需從組織內部強化以顧客需求為導向的研發架構、導入敏捷開發流程、培養吸收能力與跨部門協作能力；同時，在外部則應建立單一窗口機制、設置駐廠團隊、推進資訊透明與數位化合作，並積極參與開放式創新與跨界合作平台。 綜上所述，本研究認為，供應商唯有內外兼修：一方面整合內部資源與能力，打造靈活高效的創新體系；另一方面與客戶及外部夥伴建立穩固互信的聯合開發關係，才能在快速變動且高度競爭的半導體產業中脫穎而出。研究同時提出多項具體建議供業界參考，並對未來研究方向 (如不同規模設備商的策略比較、創新文化對研發績效的影響等) 進行初步探索，以期促進半導體產業在綠色永續與高效創新下的協同發展。

This study investigates the innovation management strategies of exhaust gas abatement equipment suppliers in the semiconductor wafer manufacturing industry, with a particular focus on the applicability and effectiveness of joint innovation. As advanced manufacturing processes evolve and ESG-related environmental regulations become increasingly stringent, IC foundries demand higher efficiency, safety, and regulatory compliance from their equipment suppliers. To remain competitive, abatement equipment providers must strengthen both internal capabilities and external collaboration through agile and customer-centered innovation strategies. Using a mixed-methods approach, this research combines literature analysis, structured questionnaires, and semi-structured interviews with 16 professionals from key departments—equipment engineering (user) , procurement, and environmental health and safety (EHS) —at major Taiwanese IC foundries. The results show that over 93% of respondents are willing to engage in joint innovation with suppliers, mainly through feedback and in-field testing rather than direct financial investment. Joint innovation is recognized as an effective strategy to align product development with customer expectations, reduce risks, and accelerate time-to-market.

The study further identifies that while local equipment providers possess strengths such as regulatory compliance, customization flexibility, and a willingness to communicate, they face challenges in customer feedback tracking, proactive innovation proposals, and change management. To address these gaps, the study proposes a two-pronged strategy: internally, suppliers should adopt value proposition tools, agile R&D processes, and knowledge absorption mechanisms; externally, they should build joint development platforms, streamline communication through single-point contact teams, and pursue open innovation with upstream and downstream partners. In conclusion, this study emphasizes that “joint innovation” is the most suitable innovation model for the semiconductor abatement equipment sector. It not only enhances suppliers’ responsiveness and technical alignment with foundry demands but also supports long-term ESG goals. Practical recommendations are provided to help equipment firms evolve into strategic partners in the semiconductor value chain, while directions for future research are proposed to further enrich academic and industrial understanding of collaborative innovation.