乘勢而上、佈局致勝 － IC 設計廠商的經營發展策略：以聯發科技為例

Abstract

在全球智慧應用迅速發展的浪潮下，IC 設計產業因應技術需求，面臨更高的運算效能、系統整合等挑戰。聯發科技作為臺灣最大的無晶圓廠 IC 設計公司，於 2020 年超越高通成為全球最大的智慧型手機晶片供應商，且在 Wi-Fi、車用電子與電源管理等多元產品領域亦有所耕耘。然而，隨著國際競爭加劇、AI 技術加速演進，以及地緣政治風險的不確定性，聯發科技也面臨多重挑戰與壓力。在這樣的環境下，聯發科技如何突破瓶頸並強化競爭力，成為本研究所關注的核心議題。 本研究採用質性個案研究法，聚焦於聯發科技四大主要業務領域（智慧型手機晶片、Wi-Fi 晶片、車用智慧座艙晶片與電源管理晶片）之發展情形。其中運用各項管理理論與分析工具，包括五力分析、資源基礎觀點與 VRIO 模型、策略活動系統圖、事業組合與 BCG 矩陣、競爭策略分析等，探討 IC 設計產業環境、聯發科技四大產品市場的關鍵成功因素及產業競爭態勢，並分析公司的核心資源能力、事業組合及成長策略，最終提供未來發展之策略建議。 根據研究結果，多元深度的策略聯盟資源及技術深厚的研發能力是聯發科技的兩大競爭優勢。事業組合方面，智慧型手機晶片為未來成長可期的明星事業，從過去以高性價比為主的成本領導策略逐步轉向強調 AI 與高效能的差異化策略；Wi-Fi 晶片屬於具穩定營收貢獻的金牛事業，同樣從價格導向的成本領導策略轉換為低功耗、展現節能優勢的差異化策略；而車用智慧座艙晶片為發展潛力高、採取差異化策略的問號事業；至於電源管理晶片則同樣採取差異化策略，屬於貢獻穩定營收來源並強力支援其他產品線的金牛事業。成長策略上，公司經歷有機成長、外部併購、重回有機成長三階段，並持續拓展海外據點。 本研究針對聯發科技提出各事業別與公司整體的策略建議。事業別方面，智慧型手機晶片應加強軟體適配，展現邊緣 AI 差異化優勢並提前佈局 6G 以和高通相抗衡；Wi-Fi 晶片可發揮低功耗優勢拓展歐洲市場，並搶佔新興市場三頻、Wi-Fi 8 先機；而車用智慧座艙晶片建議深化 NVIDIA 策略聯盟，發揮多媒體領域技術優勢；電源管理晶片則應持續開發多功能系統模組並穩固台積電製程合作。整體策略方面，聯發科技應深化 AI ASIC 與長距離高速傳輸技術，與臺灣 EDA 公司合作自研工具，同時拓展韓國與歐洲市場，並鞏固與龍頭企業的策略聯盟合作，把握當今趨「勢」與自身優「勢」，方能乘勢而上、佈局致勝。

With the accelerating global adoption of smart technologies, the IC design industry is increasingly challenged to meet the rising demands for computing performance, system integration, and so on. As Taiwan’s largest fabless IC design company, MediaTek surpassed Qualcomm in 2020 to become the world’s top smartphone chip supplier and has consistently invested in Wi-Fi, automotive electronics, and power management sectors. However, intensifying international competition, rapid AI advancements, and geopolitical uncertainties have brought about a range of strategic pressures. This study aims to explore the foundations of MediaTek’s past success and how it can respond to emerging challenges to sustain its global competitiveness. Adopting a qualitative case study approach, this research investigates the development of MediaTek’s four major business lines: smartphone chips, Wi-Fi chips, automotive smart cockpit chips, and power management chips. Utilizing a variety of management frameworks including Porter’s Five Forces, the Resource-Based View (RBV) and VRIO model, Strategy Activity System, BCG matrix, and competitive strategy analysis, the study examines the IC design industry landscape, critical success factors across MediaTek’s product markets, and the company’s core resources, business portfolio, and growth strategies to propose concrete strategic recommendations. The findings highlight MediaTek’s competitive advantages in forming deep, diversified strategic alliances and maintaining strong research and development capabilities. In terms of business portfolio, smartphone chipsets are identified as “star” products, shifting from a cost-leadership approach toward a more differentiated strategy focused on AI and performance. Wi-Fi chipsets serve as “cash cows,” having transitioned from price-focused competition to low-power, energy-efficient solutions. Automotive smart cockpit chipsets are positioned as “question marks” with high growth potential under a differentiation strategy. In contrast, power management chipsets are categorized as “cash cows,” representing a stable revenue contributor and playing a critical supporting role across other product lines. As for growth strategy, MediaTek has undergone three major stages—organic expansion, strategic acquisitions, and a return to organic growth—alongside ongoing global market development. In conclusion, the study offers strategic recommendations for MediaTek at both the business unit and corporate levels. For each business unit, smartphone chipsets should improve software compatibility, showcase edge AI differentiation, and advance 6G development to better compete with Qualcomm; Wi-Fi chipsets could capitalize on low power consumption to expand in Europe and seize early opportunities in tri-band and Wi-Fi 8 across emerging markets; for automotive smart cockpit chipsets, it is advised to deepen the strategic alliance with NVIDIA and leverage multimedia expertise; power management ICs should focus on developing multifunctional system modules and reinforcing process collaboration with TSMC. At the corporate level, MediaTek could strengthen its capabilities in AI ASIC and long-distance high-speed transmission, co-develop EDA tools with Taiwanese firms, expand more into the Korean and European markets, and deepen partnerships with industry leaders. By aligning with current trends and leveraging its core strengths, MediaTek can ride the momentum and win through strategic deployment.